公开(公告)号：US6142726A

公开(公告)日：2000-11-07

申请号：US250464

申请日：1999-02-16

申请人： Robert Peter Westerfield, Jr. ,  Thomas Gerard Jantz ,  Robert Paul Kuder, II ,  David Clyde Linnell ,  Robert Albert Meyen

发明人： Robert Peter Westerfield, Jr. ,  Thomas Gerard Jantz ,  Robert Paul Kuder, II ,  David Clyde Linnell ,  Robert Albert Meyen

IPC分类号： B23C3/12 ,  H01L21/00 ,  H01L21/68 ,  H05K3/00 ,  B65G65/00

CPC分类号： H01L21/67092 ,  B23C3/12 ,  H01L21/68 ,  H05K3/0052 ,  H05K2201/09154 ,  H05K2203/0228

摘要： An apparatus for loading, chamfering and unloading a ceramic or ceramic/polymer substrate for electronic components. An automatic part loader moves substrates in a row as a unit, using a frangible pin to push the parts. The part loader separates the first of the substrates from the rest, and a load pedestal pushes the first substrate up into a loading/unloading nest. The load pedestal is mounted on rods so that the substrate may move laterally to center itself in the nest. The nest then rotates to load the substrate onto a movable process pedestal. The chamfering apparatus includes a pair of spaced, rotatable cutting spindles for chamfering edges and corners on the substrate. The cutting spindles include: i) separate top and bottom edge cutters for simultaneously chamfering top and bottom of edges of a substrate secured on the carrier as the substrate passes between the spindles and ii) corner cutters for simultaneously chamfering corners of a substrate secured on the carrier as the substrate contacts the spindles. The pedestal rotates the substrate about an axis normal to the plane of the substrate and moves the substrate in a direction normal to the plane of the substrate to present unchamfered edges and corners to the cutting spindles. A disc brake on the process pedestal may be actuated to prevent rotation of the substrate during chamfering. An enclosure surrounds the substrate, chamfering cutters and process pedestal during chamfering and utilizes the air flow supplied by the rotating cutters to propel chips into a particle collector.

摘要翻译： 用于加载，倒角和卸载用于电子部件的陶瓷或陶瓷/聚合物基板的装置。 自动装载装载机将基板作为一个单元移动，使用易碎的销来推动零件。 部件装载机将第一基板与其余部分分开，并且负载基座将第一基板向上推入装载/卸载嵌套。 负载基座安装在杆上，使得基板可以横向移动以使其自身居中。 然后，巢旋转以将基底装载到可移动的过程基座上。 倒角装置包括一对间隔开的可旋转切割主轴，用于在基板上倒角边缘和拐角。 切割锭子包括：i）分离的顶部和底部边缘切割器，用于同时倒角固定在载体上的基底的边缘的顶部和底部，当基底通过心轴之间时，以及ii）角部切割器，用于同时倒角固定在基底上的基底的角部 载体作为基板接触心轴。 基座使基板围绕垂直于基板平面的轴线旋转，并使基板沿垂直于基板平面的方向移动，以将切割主轴的未被引导的边缘和拐角呈现。 可以启动过程基座上的盘式制动器，以防止倒角期间基底的旋转。 外壳围绕基板，在倒角期间倒角切割器和工艺基座，并且利用由旋转切割器提供的空气流将芯片推进到颗粒收集器中。

公开(公告)号：US5752797A

公开(公告)日：1998-05-19

申请号：US629300

申请日：1996-04-08

申请人： Robert Peter Westerfield, Jr. ,  Thomas Gerard Jantz ,  Robert Paul Kuder, II ,  David Clyde Linnell ,  Robert Albert Meyen

发明人： Robert Peter Westerfield, Jr. ,  Thomas Gerard Jantz ,  Robert Paul Kuder, II ,  David Clyde Linnell ,  Robert Albert Meyen

IPC分类号： B23C3/12 ,  H01L21/00 ,  H01L21/68 ,  H05K3/00

CPC分类号： H01L21/67092 ,  B23C3/12 ,  H01L21/68 ,  H05K3/0052 ,  H05K2201/09154 ,  H05K2203/0228

摘要： An apparatus for loading, chamfering and unloading a ceramic or ceramic/polymer substrate for electronic components. An automatic part loader moves substrates in a row as a unit, using a frangible pin to push the parts. The part loader separates the first of the substrates from the rest, and a load pedestal pushes the first substrate up into a loading/unloading nest. The load pedestal is mounted on rods so that the substrate may move laterally to center itself in the nest. The nest then rotates to load the substrate onto a movable process pedestal. The chamfering apparatus includes a pair of spaced, rotatable cutting spindles for chamfering edges and corners on the substrate. The cutting spindles include: i) separate top and bottom edge cutters for simultaneously chamfering top and bottom of edges of a substrate secured on the carrier as the substrate passes between the spindles and ii) corner cutters for simultaneously chamfering corners of a substrate secured on the carrier as the substrate contacts the spindles. The pedestal rotates the substrate about an axis normal to the plane of the substrate and moves the substrate in a direction normal to the plane of the substrate to present unchamfered edges and corners to the cutting spindles. A disc brake on the process pedestal may be actuated to prevent rotation of the substrate during chamfering. An enclosure surrounds the substrate, chamfering cutters and process pedestal during chamfering and utilizes the air flow supplied by the rotating cutters to propel chips into a particle collector.

公开(公告)号：US5984608A

公开(公告)日：1999-11-16

申请号：US966622

申请日：1997-11-10

申请人： Robert Peter Westerfield, Jr. ,  Thomas Gerard Jantz ,  Robert Paul Kuder, II ,  David Clyde Linnell ,  Robert Albert Meyen

发明人： Robert Peter Westerfield, Jr. ,  Thomas Gerard Jantz ,  Robert Paul Kuder, II ,  David Clyde Linnell ,  Robert Albert Meyen

IPC分类号： B23C3/12 ,  H01L21/00 ,  H01L21/68 ,  H05K3/00

CPC分类号： H01L21/67092 ,  B23C3/12 ,  H01L21/68 ,  H05K3/0052 ,  H05K2201/09154 ,  H05K2203/0228

摘要： An apparatus for loading, chamfering and unloading a ceramic or ceramic/polymer substrate for electronic components. An automatic part loader moves substrates in a row as a unit, using a frangible pin to push the parts. The part loader separates the first of the substrates from the rest, and a load pedestal pushes the first substrate up into a loading/unloading nest. The load pedestal is mounted on rods so that the substrate may move laterally to center itself in the nest. The nest then rotates to load the substrate onto a movable process pedestal. The chamfering apparatus includes a pair of spaced, rotatable cutting spindles for chamfering edges and corners on the substrate. The cutting spindles include: i) separate top and bottom edge cutters for simultaneously chamfering top and bottom of edges of a substrate secured on the carrier as the substrate passes between the spindles and ii) corner cutters for simultaneously chamfering corners of a substrate secured on the carrier as the substrate contacts the spindles. The pedestal rotates the substrate about an axis normal to the plane of the substrate and moves the substrate in a direction normal to the plane of the substrate to present unchamfered edges and corners to the cutting spindles. A disc brake on the process pedestal may be actuated to prevent rotation of the substrate during chamfering. An enclosure surrounds the substrate, chamfering cutters and process pedestal during chamfering and utilizes the air flow supplied by the rotating cutters to propel chips into a particle collector.

摘要翻译： 用于加载，倒角和卸载用于电子部件的陶瓷或陶瓷/聚合物基板的装置。 自动装载装载机将基板作为一个单元移动，使用易碎的销来推动零件。 部件装载机将第一基板与其余部分分开，并且负载基座将第一基板向上推入装载/卸载嵌套。 负载基座安装在杆上，使得基板可以横向移动以使其自身居中。 然后，巢旋转以将基底装载到可移动的过程基座上。 倒角装置包括一对间隔开的可旋转切割主轴，用于在基板上倒角边缘和拐角。 切割锭子包括：i）分离的顶部和底部边缘切割器，用于同时倒角固定在载体上的基底的边缘的顶部和底部，当基底通过心轴之间时，以及ii）角部切割器，用于同时倒角固定在基底上的基底的角部 载体作为基板接触心轴。 基座使基板围绕垂直于基板平面的轴线旋转，并使基板沿垂直于基板平面的方向移动，以将切割主轴的未被引导的边缘和拐角呈现。 可以启动过程基座上的盘式制动器，以防止倒角期间基底的旋转。 外壳围绕基板，在倒角期间倒角切割器和工艺基座，并且利用由旋转切割器提供的空气流将芯片推进到颗粒收集器中。