公开(公告)号：US20180317321A1

公开(公告)日：2018-11-01

申请号：US15904577

申请日：2018-02-26

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Kenichi MORI ,  Kazuyuki KUBOTA ,  Yoshihiro IHARA

IPC分类号： H05K1/14 ,  H05K1/18 ,  H05K1/11 ,  H01R12/72

CPC分类号： H05K1/144 ,  H01R12/721 ,  H01R12/725 ,  H01R12/728 ,  H05K1/111 ,  H05K1/181 ,  H05K1/183 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/09409 ,  H05K2201/10522

摘要： A circuit board module is electrically connectable to a socket by inserting one end part thereof into the socket, and includes a circuit board and a terminal board having a first surface provided with a column of socket-connection pads and mounted on the surface of the circuit board at the one end part. The terminal board includes first, second, and third pad columns provided on a second surface of the terminal board opposite to the first surface. The circuit board includes fourth, fifth, and sixth pad columns respectively provided on the surface of the circuit board opposing the second surface of the terminal board, at positions opposing the first, second, and third pad columns of the terminal board, respectively.

公开(公告)号：US09986635B2

公开(公告)日：2018-05-29

申请号：US15379778

申请日：2016-12-15

申请人： Fujitsu Technology Solutions Intellectual Property GmbH

发明人： Wilhelm Neukam

IPC分类号： H05K1/02 ,  H05K5/02 ,  H05K1/03 ,  H05K7/14 ,  H05K3/20

CPC分类号： H05K1/0275 ,  H05K1/0284 ,  H05K1/03 ,  H05K3/20 ,  H05K5/0208 ,  H05K7/1427 ,  H05K2201/0388 ,  H05K2201/07 ,  H05K2201/09154 ,  H05K2201/09681

摘要： An assembly includes a carrier and an electrically conductive mesh, wherein the carrier includes a side surface with an edge, the electrically conductive mesh is attached to the side surface and extends over the edge of the side surface, and the edge has a radius at least as big as a minimal bending radius of electric lines of the electrically conductive mesh.

公开(公告)号：US20180075871A1

公开(公告)日：2018-03-15

申请号：US15689695

申请日：2017-08-29

申请人： NITTO DENKO CORPORATION

发明人： Yuu SUGIMOTO ,  Hiroyuki TANABE

IPC分类号： G11B5/48 ,  H05K1/05 ,  H05K1/11 ,  H05K3/40 ,  H05K3/06 ,  H05K3/00

CPC分类号： G11B5/4853 ,  G11B5/3163 ,  G11B2005/0021 ,  H05K1/056 ,  H05K1/119 ,  H05K1/184 ,  H05K3/0023 ,  H05K3/0041 ,  H05K3/06 ,  H05K3/3405 ,  H05K3/4015 ,  H05K2201/09063 ,  H05K2201/09154 ,  H05K2201/09827 ,  H05K2201/10106

摘要： A suspension board with circuit having an opening with an electronic element inserted therein includes an insulating layer disposed at the edge of the opening, a first terminal disposed at one surface of the insulating layer and connected to a magnetic head, and a second terminal disposed at the other surface thereof and connected to the electronic element. The insulating layer includes a first portion in which the first terminal is disposed and a second portion that extends from the first portion toward the opening and is overlapped with a slider. The second portion is thinner than the first portion and is overlapped with the second terminal. The slider has a first surface facing the second portion. The first surface is disposed between the first terminal and the second terminal.

公开(公告)号：US20180024676A1

公开(公告)日：2018-01-25

申请号：US15547796

申请日：2015-03-31

申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

发明人： Cameron Hutchings ,  Stewart R. Wyatt ,  Scott David Hahn

IPC分类号： G06F3/041 ,  H05K1/02 ,  G06F3/042

CPC分类号： G06F3/0412 ,  G06F3/041 ,  G06F3/0421 ,  G06F2203/04103 ,  H05K1/0274 ,  H05K2201/09036 ,  H05K2201/09154 ,  H05K2201/10106 ,  H05K2201/10121

摘要： According to an example, a device may comprise a touchscreen light guide assembly, a lens disposed on the touchscreen light guide assembly, and a printed circuit board including a relief cut on an edge of the printed circuit board. The relief cut may be to receive the touchscreen light guide assembly and to allow the lens to extend into the printed circuit board relief cut.

公开(公告)号：US20170343204A1

公开(公告)日：2017-11-30

申请号：US15681989

申请日：2017-08-21

申请人： Molex, LLC

发明人： Yi-Tse HO

IPC分类号： F21V29/83 ,  F21K9/232 ,  H05K3/18 ,  F21V29/77 ,  H05K1/02 ,  F21V19/00 ,  F21Y2107/40 ,  H05K3/38 ,  H05K3/10 ,  H05K3/00 ,  F21V3/00 ,  F21Y2115/10

CPC分类号： F21V29/83 ,  F21K9/232 ,  F21V3/00 ,  F21V19/0055 ,  F21V29/77 ,  F21Y2107/40 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/0284 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/182 ,  H05K3/381 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/09154 ,  H05K2201/09645 ,  H05K2201/09781 ,  H05K2201/09854 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2201/10287 ,  H05K2201/10409 ,  H05K2203/107

摘要： An illumination device comprises a holder, a plurality of light emitting elements, a translucent cover and a lamp cap structure. The holder comprises a heat dissipating base body and a carrying unit. The carrying unit is connected to a top portion of the heat dissipating base body and comprises a carrying base body, a circuit pattern and a heat dissipating pattern, the circuit pattern and the heat dissipating pattern are directly formed to a surface of the carrying base body, the circuit pattern has a plurality of mounting positions, the heat dissipating pattern at least extends from a region close to the mounting position to a region where the heat dissipating pattern can contact the heat dissipating base body. The plurality of light emitting elements are respectively provided at the plurality of the mounting positions and establish an electrical connection with the circuit pattern.

公开(公告)号：US09821787B2

公开(公告)日：2017-11-21

申请号：US14632574

申请日：2015-02-26

申请人： NISSIN KOGYO CO., LTD.

发明人： Sakae Miyasaka

IPC分类号： H05K7/10 ,  B60T15/02 ,  H05K3/40 ,  H05K3/32

CPC分类号： B60T15/028 ,  H05K3/325 ,  H05K3/4015 ,  H05K2201/09154 ,  H05K2201/09381 ,  H05K2201/10151 ,  H05K2203/048

摘要： One embodiment provides a circuit board having a substrate and an electrode portion which is provided on the substrate. The electrode portion includes: a quadrangular land which is provided on a front surface of the substrate; a solder layer which is laminated on the whole of a front surface of the land; and a pad which is joined to a front surface of the solder layer. When the electrode portion is seen from thereabove, an outer circumferential line of the pad touches each of four sides of the land. Exposed portions where the solder layer is exposed are formed individually at four corners of a front surface of the electrode portion. And, the exposed portions are formed to have the same shape.

公开(公告)号：US09627739B2

公开(公告)日：2017-04-18

申请号：US13526817

申请日：2012-06-19

申请人： Theodore Timaru

发明人： Theodore Timaru

IPC分类号： H05K5/00 ,  H01P5/02 ,  H05K1/14 ,  H05K1/02

CPC分类号： H01P5/028 ,  H05K1/0239 ,  H05K1/142 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/09845

摘要： The system includes a first printed circuit board including a first transmission line, the first circuit board may be attached to a chassis and a second printed circuit board including a second transmission line, the second circuit board may be attached to the chassis and/or the first printed circuit board and the second transmission line configured to electrically couple power from the first transmission line.

公开(公告)号：US20170019996A1

公开(公告)日：2017-01-19

申请号：US15124499

申请日：2015-02-27

申请人： SONY CORPORATION

发明人： Toshihiko WATANABE

IPC分类号： H05K1/11 ,  H05K3/34 ,  H05K3/40 ,  H05K3/00 ,  H05K3/42

CPC分类号： H05K1/116 ,  H01L21/486 ,  H01L23/49827 ,  H01L33/48 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2924/1531 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/112 ,  H05K1/115 ,  H05K3/0094 ,  H05K3/3436 ,  H05K3/3447 ,  H05K3/3489 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/09154 ,  H05K2201/0959 ,  H05K2201/09863 ,  H05K2201/10106 ,  H05K2201/10484 ,  H05K2203/1383 ,  H05K2203/1394 ,  Y02P70/613

摘要： A mounting substrate includes a through-hole 13 formed in a substrate 10, a first land part 21, a second land part 31, a first component attaching part 22, a second component attaching part 32, a conductive layer 14, and a filling member 15 filled into a part of the through-hole 13. A shortest distance allowable value L0 from the center of the first land part 21 to a component 51 is determined on the basis of the volume Vh of a part of the through-hole 15 positioned above a top surface of the filling member 15 on the side of the first land part 21, the length L1 of the component 51 to be mounted to the first component attaching part 22, and the maximum allowable value of the inclination of the component 51 to be mounted to the first component attaching part 22 relative to the first surface 11 of the substrate 10.

摘要翻译： 安装基板包括形成在基板10中的通孔13，第一接地部21，第二接地部31，第一部件安装部22，第二部件安装部32，导电层14和填充部件 15被填充到通孔13的一部分中。从第一陆部21的中心到部件51的最短距离允许值L0基于定位的通孔15的一部分的体积Vh来确定 在第一接地部21侧的填充部件15的上表面上，要安装到第一部件安装部22的部件51的长度L1和部件51的倾斜度的最大允许值为 相对于基板10的第一表面11安装到第一部件安装部22。

公开(公告)号：US09456503B2

公开(公告)日：2016-09-27

申请号：US14209106

申请日：2014-03-13

申请人： Murata Manufacturing Co., Ltd.

发明人： Tadashi Nomura ,  Akihiko Kamada

IPC分类号： H05K1/18 ,  H05K3/28 ,  H05K1/03 ,  H05K1/14

CPC分类号： H05K3/284 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/144 ,  H05K2201/09063 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/10378 ,  H05K2201/2018 ,  H05K2201/2072 ,  H05K2203/063 ,  H05K2203/1327 ,  Y10T29/49146 ,  H01L2924/00014

摘要： An engagement structure for preventing the separation of a resin layer is formed in a contact surface of an insulating substrate in a connecting component, the contact surface being in contact with the resin layer. The resin layer engages with the engagement structure in the contact surface in the insulating substrate in contact with the resin layer, the contact surface forming the side surface of the connecting component.

摘要翻译： 在连接部件中的绝缘基板的接触面上形成防止树脂层分离的接合结构，该接触面与树脂层接触。 树脂层与绝缘基板的与树脂层接触的接触表面中的接合结构接合，接触表面形成连接部件的侧表面。

公开(公告)号：US09433087B2

公开(公告)日：2016-08-30

申请号：US14482177

申请日：2014-09-10

申请人： MITSUBISHI ELECTRIC CORPORATION

发明人： Tomohiro Tashiro

IPC分类号： H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K5/00 ,  G02F1/1345 ,  H05K3/32 ,  G02F1/1333 ,  H05K3/36

CPC分类号： H05K1/0281 ,  G02F1/13452 ,  G02F2001/133302 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/323 ,  H05K3/361 ,  H05K5/0017 ,  H05K2201/068 ,  H05K2201/09154

摘要： A display device includes: a glass substrate including a driver circuit and a plurality of connection terminals that is connected to the driver circuit and is arranged in an array, and an elongated FPC, which has a plurality of panel connection terminals that correspond to the connection terminals and which is mounted on the glass substrate, wherein the FPC has a coverlay. The FPC has a chamfered-area end gap between an end portion of the coverlay facing an end face of the glass substrate and a chamfered-area end portion of the glass substrate in a mounted state, wherein the chamfered-area end gap is covered with an insulating resin, and wherein the chamfered-area end gap at a center portion of the FPC is narrower than the chamfered-area end gap at both end portions of the FPC.

摘要翻译： 显示装置包括：玻璃基板，包括驱动电路和连接到驱动电路并且布置成阵列的多个连接端子，以及细长FPC，其具有与连接对应的多个面板连接端子 端子，并且其安装在玻璃基板上，其中FPC具有覆盖层。 FPC在安装状态下在覆盖物的面向玻璃基板的端面的端部与玻璃基板的倒角区域端部之间具有倒角区域端部间隙，其中，倒角区域端部间隙被覆盖 绝缘树脂，并且其中FPC的中心部分处的倒角区域端部间隙比FPC的两个端部处的倒角区域端部间隙窄。