公开(公告)号：US20180159011A1

公开(公告)日：2018-06-07

申请号：US15711087

申请日：2017-09-21

申请人： Roccor, LLLC

发明人： William Francis ,  Michael Hulse

IPC分类号： H01L33/64 ,  H05K3/00 ,  H01L33/62 ,  F21V29/00

CPC分类号： H01L33/648 ,  F21V29/00 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0066 ,  H01L2933/0075 ,  H05K3/0058 ,  H05K3/0061 ,  H05K2201/10106 ,  H01L2924/00014

摘要： Methods and systems for thermal management of one or more LEDs are disclosed. One or more LEDs may be coupled with an external layer of a thermal ground plane according to some embodiments described herein. For example, the one or more LEDs may be electrically coupled with a circuit carrier with one or more electrically conductive traces etched therein prior to coupling with the thermal ground plane. The thermal ground plane may be charged with a working fluid and/or hermetically sealed after being coupled with the LED.