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公开(公告)号:US20060014084A1
公开(公告)日:2006-01-19
申请号:US11209418
申请日:2005-08-23
申请人: Roger French , Timothy Gierke , Mark Harmer , Paula Hietpas , Anand Jagota , Steven Lustig , Rakesh Mehta , Bibiana Onoa
发明人: Roger French , Timothy Gierke , Mark Harmer , Paula Hietpas , Anand Jagota , Steven Lustig , Rakesh Mehta , Bibiana Onoa
CPC分类号: B82Y40/00 , B82Y30/00 , C01B32/174 , C01B32/176 , C01B2202/34 , Y10S977/84 , Y10S977/856 , Y10S977/889
摘要: This invention relates to the field of nanotechnology. Specifically the invention describes a method for cutting a multiplicity of nano-structures to uniform dimensions of length, length and width, or area, or to a specific distribution of lengths or area using various cutting techniques.
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公开(公告)号:US20050079666A1
公开(公告)日:2005-04-14
申请号:US10968569
申请日:2004-10-19
申请人: Roger French , Timothy Gierke , Mark Harmer , Anand Jagota , Steven Lustig , Rakesh Mehta , Paula Hietpas , Bibiana Onoa
发明人: Roger French , Timothy Gierke , Mark Harmer , Anand Jagota , Steven Lustig , Rakesh Mehta , Paula Hietpas , Bibiana Onoa
CPC分类号: B82Y40/00 , B82Y30/00 , C01B32/174 , C01B32/176 , C01B2202/34 , Y10S977/84 , Y10S977/856 , Y10S977/889
摘要: This invention relates to the field of nanotechnology. Specifically the invention describes a method for cutting a multiplicity of nano-structures to uniform dimensions of length, length and width, or area, or to a specific distribution of lengths or area using various cutting techniques.
摘要翻译: 本发明涉及纳米技术领域。 具体地,本发明描述了使用各种切割技术将多个纳米结构切割成长度,长度和宽度或面积的均匀尺寸或长度或面积的特定分布的方法。
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