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公开(公告)号：US20130215200A1
公开(公告)日：2013-08-22
申请号：US13747703
申请日：2013-01-23
申请人： ROHM CO., LTD.
CPC分类号： B41J2/3352 , B41J2/04541 , B41J2/3351 , B41J2/33515 , B41J2/3353 , B41J2/3354 , B41J2/33545 , B41J2/3355 , B41J2/3357 , B41J2/3359 , H05K1/0306 , H05K1/09 , H05K1/092 , H05K3/06 , H05K3/12 , H05K3/40 , H05K2201/017 , H05K2201/0338 , H05K2201/035
摘要： According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.
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2.发明申请公开(公告)号：US20150138298A1
公开(公告)日：2015-05-21
申请号：US14610330
申请日：2015-01-30
申请人： ROHM CO., LTD.
CPC分类号： B41J2/3352 , B41J2/04541 , B41J2/3351 , B41J2/33515 , B41J2/3353 , B41J2/3354 , B41J2/33545 , B41J2/3355 , B41J2/3357 , B41J2/3359 , H05K1/0306 , H05K1/09 , H05K1/092 , H05K3/06 , H05K3/12 , H05K3/40 , H05K2201/017 , H05K2201/0338 , H05K2201/035
摘要： According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.
摘要翻译： 根据本公开，公开了精细布线图案的制造方法。 该制造方法包括制备支撑构件，通过厚膜印刷在支撑构件上形成第一层，并通过厚膜印刷在第一层上形成包括Ag的第二层。 该方法还包括通过对第一层和第二层执行蚀刻处理来形成预定的精细布线图案。
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3.发明授权公开(公告)号：US09358804B2
公开(公告)日：2016-06-07
申请号：US14610330
申请日：2015-01-30
申请人： ROHM CO., LTD.
CPC分类号： B41J2/3352 , B41J2/04541 , B41J2/3351 , B41J2/33515 , B41J2/3353 , B41J2/3354 , B41J2/33545 , B41J2/3355 , B41J2/3357 , B41J2/3359 , H05K1/0306 , H05K1/09 , H05K1/092 , H05K3/06 , H05K3/12 , H05K3/40 , H05K2201/017 , H05K2201/0338 , H05K2201/035
摘要： According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.
摘要翻译： 根据本公开，公开了精细布线图案的制造方法。 该制造方法包括制备支撑构件，通过厚膜印刷在支撑构件上形成第一层，并通过厚膜印刷在第一层上形成包括Ag的第二层。 该方法还包括通过对第一层和第二层执行蚀刻处理来形成预定的精细布线图案。
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4.发明授权Fine wiring pattern and composition, manufacturing method thereof, and thermal print head including fine wiring pattern 有权精细的布线图案及其组成，制造方法和包括精细布线图案的热打印头公开(公告)号：US08982169B2
公开(公告)日：2015-03-17
申请号：US13747703
申请日：2013-01-23
申请人： Rohm Co., Ltd.
CPC分类号： B41J2/3352 , B41J2/04541 , B41J2/3351 , B41J2/33515 , B41J2/3353 , B41J2/3354 , B41J2/33545 , B41J2/3355 , B41J2/3357 , B41J2/3359 , H05K1/0306 , H05K1/09 , H05K1/092 , H05K3/06 , H05K3/12 , H05K3/40 , H05K2201/017 , H05K2201/0338 , H05K2201/035
摘要： According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.
摘要翻译： 根据本公开，公开了精细布线图案的制造方法。 该制造方法包括制备支撑构件，通过厚膜印刷在支撑构件上形成第一层，并通过厚膜印刷在第一层上形成包括Ag的第二层。 该方法还包括通过对第一层和第二层执行蚀刻处理来形成预定的精细布线图案。
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