-
公开(公告)号：US20200066429A1
公开(公告)日：2020-02-27
申请号：US16466256
申请日：2017-11-30
申请人： Rohm Co., Ltd.
发明人： Wataru IMAHASHI , Takanori SHINOURA
摘要： One aspect of the present disclosure provides a chip resistor. In the chip resistor, a top electrode is disposed on a front surface of a substrate. A resistor is disposed on the front surface and electrically connected to the top electrode. A protective layer covers the resistor. A protective electrode is electrically connected to the top electrode. A side electrode is electrically connected to the top electrode. The side electrode has a side portion disposed on the side surface, and a top portion and a bottom portion respectively overlapping the front surface and the back surface in plan view. An intermediate electrode covers the protective electrode and the side electrode. An outer electrode covers the intermediate electrode. The protective electrode is in contact with both the top electrode and the protective layer and covers a portion of the top electrode and a portion of the protective layer.
-
公开(公告)号：US20210012932A1
公开(公告)日：2021-01-14
申请号：US17039041
申请日：2020-09-30
申请人： ROHM CO., LTD.
发明人： Takanori SHINOURA , Wataru IMAHASHI
IPC分类号： H01C1/142 , H01C17/00 , H01C17/02 , H01C17/242
摘要： A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.
-
公开(公告)号：US20220375657A1
公开(公告)日：2022-11-24
申请号：US17773720
申请日：2020-10-29
申请人： ROHM CO., LTD.
摘要： A chip resistor includes a substrate, an upper electrode and a resistor body, a back electrode, a side electrode, and a metal plating layer. The substrate includes an upper surface, a back surface that intersect a thickness-wise direction and a side surface that joins the upper surface and the back surface. The upper electrode and the resistor body are formed on the upper surface. The back electrode is formed on the back surface. The side electrode is formed on the side surface. The metal plating layer includes a back plating layer and a side plating layer. The back plating layer covers at least a portion of the back electrode. The side plating layer covers at least a portion of the side electrode. The metal plating layer has a thickness that is greater than or equal to 10 μm and less than or equal to 60 μm.
-
公开(公告)号：US20220165459A1
公开(公告)日：2022-05-26
申请号：US17430204
申请日：2020-02-27
申请人： ROHM CO., LTD.
发明人： Takanori SHINOURA
摘要： A chip resistor includes a substrate, two top electrodes, a resistor element, two back electrodes, and two side electrodes. The substrate has a top surface, a back surface and two side surface. The top and back surfaces face away in the thickness direction of the substrate. The side surfaces, spaced apart in a predetermined direction orthogonal to the thickness direction, are connected to the top and back surfaces. The top electrodes, spaced apart in the predetermined direction, are in contact with the top surface. The resistor element, disposed on the top surface, is connected to the top electrodes. The back electrodes, spaced apart in the predetermined direction, are in contact with the back surface. The side electrodes, held in contact with the side surfaces, are connected to the top and back electrodes. Each back electrode has a first and a second layer. The first layer is in contact with the back surface. The second layer, covering a part of the first layer, is made of a material containing metal particles and synthetic resin.
-
公开(公告)号：US20210151225A1
公开(公告)日：2021-05-20
申请号：US17159444
申请日：2021-01-27
申请人： ROHM CO., LTD.
发明人： Takanori SHINOURA
摘要： A chip resistor includes a substrate, a resistor layer, a first conductive layer, an insulating layer, a second conductive layer, a third conductive layer, and a fourth conductive layer. The first conductive layer is electrically connected to the resistor layer. The insulating layer covers the resistor layer and the first conductive layer. The second conductive layer covers the first conductive layer and the insulating layer. The third conductive layer covers the second conductive layer and the insulating layer. The fourth conductive layer covers the second conductive layer and the third conductive layer. Bonding strength between the third and fourth conductive layer is stronger than that between the second and fourth conductive layer.
-
公开(公告)号：US20200328014A1
公开(公告)日：2020-10-15
申请号：US16756413
申请日：2018-10-11
申请人： ROHM CO., LTD.
发明人： Takanori SHINOURA
摘要： An aspect of the present disclosure provides a chip resistor, which includes a substrate, a resistor layer, a first conductive layer, an insulating layer, a second conductive layer, a third conductive layer, and a fourth conductive layer. The substrate has an obverse surface and a reverse surface facing opposite in a thickness direction, with a side surface located between the obverse and reverse surface. The resistor layer is on the obverse surface. The first conductive layer is on the obverse surface, electrically connected to the resistor layer. The insulating layer covers the resistor layer and the first conductive layer, with a first edge located on the first conductive layer. The second conductive layer covers the first conductive layer and the insulating layer while straddling over the first edge, and has a second edge located on the insulating layer. The third conductive layer covers the second conductive layer and the insulating layer while straddling over the second edge, and has a third edge located on the second conductive layer. The fourth conductive layer covers the second conductive layer and the third conductive layer while straddling over the third edge. Bonding strength between the third and fourth conductive layer is stronger than that between the second and fourth conductive layer.
-
公开(公告)号：US20200005972A1
公开(公告)日：2020-01-02
申请号：US16570447
申请日：2019-09-13
申请人： ROHM CO., LTD.
发明人： Takanori SHINOURA , Wataru IMAHASHI
IPC分类号： H01C1/142 , H01C17/00 , H01C17/02 , H01C17/242
摘要： A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.
-
公开(公告)号：US20180261361A1
公开(公告)日：2018-09-13
申请号：US15977143
申请日：2018-05-11
申请人： ROHM CO., LTD.
发明人： Takanori SHINOURA , Wataru IMAHASHI
IPC分类号： H01C1/142 , H01C17/242 , H01C17/00 , H01C17/02
CPC分类号： H01C1/142 , H01C17/006 , H01C17/02 , H01C17/242
摘要： A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.
-
公开(公告)号：US20160247610A1
公开(公告)日：2016-08-25
申请号：US15044671
申请日：2016-02-16
申请人： ROHM CO., LTD.
发明人： Takanori SHINOURA , Wataru IMAHASHI
CPC分类号： H01C1/142 , H01C17/006 , H01C17/02 , H01C17/242
摘要： A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.
摘要翻译： 芯片电阻器包括设置在基板上的上电极，连接到上电极的电阻元件和连接到上电极的侧电极。 配置在基板的侧面的侧面电极分别具有与基板的正面和背面重叠的两部分。 中间电极覆盖侧电极，外电极覆盖中间电极。 第一保护层设置在上电极和中间电极之间，并与上电极和侧电极保持接触。 第一保护层比上电极更耐硫化。 第二保护层设置在第一保护层和中间电极之间，并与第一保护层，侧电极和中间电极保持接触。
-
-
-
-
-
-
-
-
搜索结果
9 条记录 (耗时 0.02 秒)