公开(公告)号：US20220307149A1

公开(公告)日：2022-09-29

申请号：US17592056

申请日：2022-02-03

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Youngmin Yoon ,  Miguel A. Rodriguez ,  Michael Lipschutz ,  Jamie Y. C. Chen ,  Kristen Griffin

IPC: C25D3/46

Abstract: Silver electroplating compositions deposit silver with low coefficients of friction on substrates, such as nickel, copper and copper alloys. The silver deposits have coefficients of friction of less than or equal to 1 in contrast to many conventional silver deposits which typically have coefficients of friction greater than 1, such as 1.5. The silver deposits also have improved wear resistance in contrast to silver deposited from many conventional silver electroplating baths. The low coefficients of friction and improved wear resistance of silver deposited from the silver electroplating compositions is especially suitable for connectors and electronics finishes. Preferably, the silver electroplating compositions are cyanide-free silver electroplating compositions.

公开(公告)号：US20230160085A1

公开(公告)日：2023-05-25

申请号：US18153099

申请日：2023-01-11

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Youngmin Yoon ,  Miguel A. Rodriguez ,  Michael Lipschutz ,  Jamie Y. C. Chen ,  Kristen Griffin

IPC: C25D3/46

CPC classification number: C25D3/46

Abstract: Silver electroplating compositions deposit silver with low coefficients of friction on substrates, such as nickel, copper and copper alloys. The silver deposits have coefficients of friction of less than or equal to 1 in contrast to many conventional silver deposits which typically have coefficients of friction greater than 1, such as 1.5. The silver deposits also have improved wear resistance in contrast to silver deposited from many conventional silver electroplating baths. The low coefficients of friction and improved wear resistance of silver deposited from the silver electroplating compositions is especially suitable for connectors and electronics finishes. Preferably, the silver electroplating compositions are cyanide-free silver electroplating compositions.

公开(公告)号：US11578418B2

公开(公告)日：2023-02-14

申请号：US17592056

申请日：2022-02-03

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Youngmin Yoon ,  Miguel A. Rodriguez ,  Michael Lipschutz ,  Jamie Y. C. Chen ,  Kristen Griffin

IPC: C25D3/46

Abstract: Silver electroplating compositions deposit silver with low coefficients of friction on substrates, such as nickel, copper and copper alloys. The silver deposits have coefficients of friction of less than or equal to 1 in contrast to many conventional silver deposits which typically have coefficients of friction greater than 1, such as 1.5. The silver deposits also have improved wear resistance in contrast to silver deposited from many conventional silver electroplating baths. The low coefficients of friction and improved wear resistance of silver deposited from the silver electroplating compositions is especially suitable for connectors and electronics finishes. Preferably, the silver electroplating compositions are cyanide-free silver electroplating compositions.