FLUID SENSOR PACKAGE
    7.
    发明公开

    公开(公告)号:US20230183880A1

    公开(公告)日:2023-06-15

    申请号:US18081637

    申请日:2022-12-14

    摘要: In examples, an apparatus comprises a substrate having opposite first and second surfaces. The substrate includes a first opening through the substrate. The substrate includes a first sealing layer covering an inner surface of the first opening, with the inner surface extending between the first and second surfaces. The substrate includes contact pads on the second surface. The apparatus also comprises a fluid sensor having a sensor surface facing the second surface and the first opening. The apparatus further includes metal interconnects coupled between the sensor surface and the contact pads. The apparatus also includes a second sealing layer between the second surface and the sensor surface, in which the second sealing layer surrounds the metal interconnects and includes a second opening below the first opening, and at least part of the sensor surface is exposed through the first and second openings.