专利检索 ap:("Rohm AND Haas Electronic Materials LLC") AND inv:"Meng Qi" 第 1 页

1.

发明授权
Electroless copper plating compositions 有权

公开(公告)号：US10060034B2

公开(公告)日：2018-08-28

申请号：US15412464

申请日：2017-01-23

申请人： Rohm and Haas Electronic Materials LLC

发明人： Meng Qi , Sze Wei Chum , Ping Ling Li

IPC分类号： C23C18/38 , C23C18/40 , C09D1/00 , C09D7/12 , C09D7/48

CPC分类号： C23C18/38 , C09D1/00 , C09D7/48 , C23C18/40 , C23C18/405

摘要： Electroless copper plating compositions including (a) copper ions, (b) a complexing agent for copper ions, (c) a reducing agent, (d) a pH adjustor and (e) a stabilizer is disclosed. The stabilizer has a specific chemical structure, and contributes to stable an electroless copper plating composition from decomposition.

2.

发明申请
ELECTROLESS COPPER PLATING COMPOSITIONS 审中-公开

公开(公告)号：US20180209048A1

公开(公告)日：2018-07-26

申请号：US15412464

申请日：2017-01-23

申请人： Rohm and Haas Electronic Materials LLC

发明人： Meng Qi , Sze Wei Chum , Ping Ling Li

IPC分类号： C23C18/38 , C09D1/00 , C09D7/12

CPC分类号： C23C18/38 , C09D1/00 , C09D7/48 , C23C18/40 , C23C18/405

摘要： Electroless copper plating compositions including (a) copper ions, (b) a complexing agent for copper ions, (c) a reducing agent, (d) a pH adjustor and (e) a stabilizer is disclosed. The stabilizer has a specific chemical structure, and contributes to stable an electroless copper plating composition from decomposition.