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公开(公告)号:US20080283943A1
公开(公告)日:2008-11-20
申请号:US12093996
申请日:2006-11-07
申请人: Ronald Dekker , Hauke Polhmann , Martin Duemling
发明人: Ronald Dekker , Hauke Polhmann , Martin Duemling
CPC分类号: B81C1/00293 , B81C2203/0145 , H01L2224/13
摘要: The device (100) comprises a MEMS element (60) in a cavity (30) that is closed by a packaging portion (17) on a second side (2) of the substrate (10). Contact pads (25) are defined on a flexible resin layer (13) on an opposite first side (1) of the substrate. Electrical connections (32) extend through the resin layer (13) to at least one element of the device (100). The device (100) is suitably made with the use of a temporary carrier (42), and opening of etching holes (18) from the second side (2) of the substrate (10).
摘要翻译: 装置(100)包括在由基板(10)的第二侧(2)上的封装部分(17)封闭的空腔(30)中的MEMS元件(60)。 接触垫(25)限定在基板的相对的第一侧(1)上的柔性树脂层(13)上。 电连接(32)延伸穿过树脂层(13)到装置(100)的至少一个元件。 所述装置(100)适合于使用临时载体(42),并从所述基板(10)的第二侧(2)打开蚀刻孔(18)。