-
公开(公告)号：US20240208804A1
公开(公告)日：2024-06-27
申请号：US18538105
申请日：2023-12-13
Applicant: ROHM CO., LTD.
Inventor： Martin Wilfried HELLER , Toma FUJITA
CPC classification number: B81B7/0041 , B81C1/00293 , B81B2201/0235 , B81B2201/0242 , B81C2203/0118
Abstract: A MEMS sensor includes: a first substrate; and a second substrate bonded to the first substrate, wherein at least one space, in which at least one sensor element is arranged, is formed inside at least one bonding portion where the first substrate and the second substrate are bonded, wherein at least one communication path communicating the space with outside of the bonding portion is formed in the first substrate, wherein the communication path includes an inner opening opened toward inside of the bonding portion, an outer opening opened toward outside of the bonding portion, and a tubular portion connecting the inner opening and the outer opening, and wherein the outer opening is closed by a sealing layer sealing the outer opening.
-
公开(公告)号：US20240174514A1
公开(公告)日：2024-05-30
申请号：US18435500
申请日：2024-02-07
Applicant: Infineon Technologies AG
Inventor： Marc Fueldner , Andreas Wiesbauer , Athanasios Kollias
CPC classification number: B81C1/0023 , B81B7/02 , B81C1/00158 , B81C1/00182 , B81C1/00293 , B81B2201/0257 , B81B2203/0127 , B81B2207/012 , B81B2207/03 , B81C2201/0174 , B81C2203/0792
Abstract: A triple-membrane MEMS device includes a first membrane, a second membrane and a third membrane spaced apart from one another, wherein the second membrane is between the first membrane and the third membrane, a sealed low pressure chamber between the first membrane and the third membrane, a first stator and a second stator in the sealed low pressure chamber, and a signal processing circuit configured to read-out output signals of the triple-membrane MEMS device.
-
公开(公告)号：US20230365399A1
公开(公告)日：2023-11-16
申请号：US18316410
申请日：2023-05-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Petteri KILPINEN
CPC classification number: B81B7/0041 , B81C1/00293 , B81B2201/0235 , B81B2201/0242 , B81C2203/0145
Abstract: A microelectromechanical is provided that includes a support layer, a device layer and a cap layer, a first cavity and a second cavity. The first cavity and the second cavity are delimited by the support layer, the device layer and the cap layer. Moreover, the cap layer includes a through-hole that extends from the top surface of the cap layer to the first cavity. The microelectromechanical component includes a plug inside the through-hole and that seals the first cavity.
-
公开(公告)号：US20190047851A1
公开(公告)日：2019-02-14
申请号：US16160683
申请日：2018-10-15
Inventor： Kai-Chih Liang , Chia-Hua Chu , Te-Hao Lee , Jiou-Kang Lee , Chung-Hsien Lin
CPC classification number: B81C1/00515 , B81B7/0006 , B81B7/0077 , B81B2201/0235 , B81B2203/0315 , B81B2207/07 , B81B2207/095 , B81B2207/096 , B81C1/00293 , B81C1/00301 , B81C2201/0132 , B81C2201/014 , B81C2203/0109 , B81C2203/0118 , B81C2203/0145 , B81C2203/035 , H01L2224/11
Abstract: A microelectromechanical system (MEMS) device may include a MEMS structure over a first substrate. The MEMS structure comprises a movable element. Depositing a first conductive material over the first substrate and etching trenches in a second substrate. Filling the trenches with a second conductive material and depositing a third conductive material over the second conductive material and the second substrate. Bonding the first substrate and the second substrate and thinning a backside of the second substrate which exposes the second conductive material in the trenches.
-
公开(公告)号：US20190010047A1
公开(公告)日：2019-01-10
申请号：US16114521
申请日：2018-08-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Shyh-Wei Cheng , Chih-Yu Wang , Hsi-Cheng Hsu , Hsin-Yu Chen , Ji-Hong Chiang , Jui-Chun Weng , Wei-Ding Wu
CPC classification number: B81B7/0041 , B81B3/0081 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/07 , B81B2207/09 , B81C1/00293 , B81C2201/013 , B81C2203/0109 , B81C2203/0118 , B81C2203/037 , B81C2203/038 , B81C2203/0735 , H01L28/20
Abstract: The present disclosure relates to a micro-electromechanical system (MEMs) package. In some embodiments, the MEMs package has a plurality of conductive interconnect layers disposed within a dielectric structure over an upper surface of a first substrate. A heating element is electrically coupled to a semiconductor device within the first substrate by one or more of the plurality of conductive interconnect layers. The heating element is vertically separated from the first substrate by the dielectric structure. A MEMs substrate is coupled to the first substrate and has a MEMs device. A hermetically sealed chamber surrounding the MEMs device is disposed between the first substrate and the MEMs substrate. An out-gassing material is disposed laterally between the hermetically sealed chamber and the heating element.
-
Patent Agency Ranking
公开(公告)号：US10017382B2
公开(公告)日：2018-07-10
申请号：US15043850
申请日：2016-02-15
Inventor： Chia-Hua Chu , Chun-Wen Cheng
IPC: H01L21/00 , B81C1/00 , B81B3/00 , G01C19/56 , G01P15/00 , G01L19/00 , G01L9/00 , G01P15/08 , G01P15/125 , B81B7/04 , G01C19/5769 , B81B7/02 , B81B7/00
CPC classification number: B81C1/00293 , B81B3/0021 , B81B7/0041 , B81B7/007 , B81B7/02 , B81B7/04 , B81B2201/0235 , B81B2201/0242 , B81B2201/025 , B81B2201/0264 , B81C1/00134 , B81C1/00309 , B81C2201/013 , B81C2203/0118 , G01C19/56 , G01C19/5769 , G01L9/0044 , G01L19/0076 , G01L19/0092 , G01P15/00 , G01P15/0802 , G01P15/125
Abstract: A method embodiment includes providing a micro-electromechanical (MEMS) wafer including a polysilicon layer having a first and a second portion. A carrier wafer is bonded to a first surface of the MEMS wafer. Bonding the carrier wafer creates a first cavity. A first surface of the first portion of the polysilicon layer is exposed to a pressure level of the first cavity. A cap wafer is bonded to a second surface of the MEMS wafer opposite the first surface of the MEMS wafer. The bonding the cap wafer creates a second cavity comprising the second portion of the polysilicon layer and a third cavity. A second surface of the first portion of the polysilicon layer is exposed to a pressure level of the third cavity. The first cavity or the third cavity is exposed to an ambient environment.
-
公开(公告)号：US09997370B2
公开(公告)日：2018-06-12
申请号：US15206926
申请日：2016-07-11
Applicant: SEIKO EPSON CORPORATION
Inventor： Takahiko Yoshizawa
IPC: H01L21/3105 , B81C1/00 , H01L23/532
CPC classification number: H01L21/31053 , B81B2201/0271 , B81C1/00293 , B81C2203/0136 , B81C2203/0145 , H01L23/53214
Abstract: An electronic apparatus according to the invention includes a substrate, a side wall that is disposed directly on the substrate or via an insulation film and forms a hollow, a functional element that is disposed within the hollow, a first layer that is disposed on the side wall so as to cover the hollow and has a first through hole that communicates with the hollow, a second layer that is disposed on the first layer so as to cover the hollow and has a second through hole that has a diameter smaller than a diameter of the first through hole and at least partially overlaps the first through hole as viewed in plan view, and a third layer that is disposed on the second layer so as to seal at least the second through hole.
-
公开(公告)号：US20180148320A1
公开(公告)日：2018-05-31
申请号：US15694176
申请日：2017-09-01
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chih-Chien Yang , Ming-Lun Shih , Ren-Dou Lee , Jen-Hao Liu
CPC classification number: B81B7/0041 , B81B2201/0264 , B81B2207/097 , B81C1/00293 , B81C2203/0145 , B81C2203/036 , G01L9/0048 , G01L9/0072 , G01L9/008
Abstract: A multi-layer sealing film for high seal yield is provided. In some embodiments, a substrate comprises a vent opening extending through the substrate, from an upper side of the substrate to a lower side of the substrate. The upper side of the substrate has a first pressure, and the lower side of the substrate has a second pressure different than the first pressure. The multi-layer sealing film covers and seals the vent opening to prevent the first pressure from equalizing with the second pressure through the vent opening. Further, the multi-layer sealing film comprises a pair of metal layers and a barrier layer sandwiched between metal layers. Also provided is a microelectromechanical systems (MEMS) package comprising the multilayer sealing film, and a method for manufacturing the multi-layer sealing film.
-
公开(公告)号：US20180141806A1
公开(公告)日：2018-05-24
申请号：US15874664
申请日：2018-01-18
Applicant: SNAPTRACK, INC.
Inventor： Gudrun HENN
IPC: B81C1/00
CPC classification number: B81C1/00293 , B81B2201/0257 , B81B2201/0264 , B81B2201/0271 , B81B2207/096 , B81C2203/0136 , H01L2224/73204 , H01L2924/1461 , H01L2924/00
Abstract: An arrangement and a production method for the arrangement with at least one MEMS device, which comprises a package that closely encloses the MEMS device and seals it from ambient influences. The package comprises as sealing a PFPE layer of a perfluoropolyether polymerized with the aid of functional groups.
-
10.发明授权公开(公告)号：US09862596B2
公开(公告)日：2018-01-09
申请号：US14355464
申请日：2012-11-02
Applicant: Continental Teves AG & Co. OHG
Inventor： Stefan Günthner , Bernhard Schmid
CPC classification number: B81C1/00293 , B81B2201/0235 , B81B2201/0264 , B81C1/00357 , G01P15/0802
Abstract: A micromechanical component formed from, a substrate (100) having a first cavity (112) and a second cavity (113), a first micromechanical structure (117) arranged in the first cavity (112), and a second micromechanical structure (118) arranged in the second cavity (113). The first cavity (112) and the second cavities having respective first and second gas pressures having different values. The first gas pressure is provided by a closed configuration of the first cavity (112) and a first channel (115) opens into the second cavity (113), and the second gas pressure is adjustable via the first channel (115).
-
-
-
-
-
-
-
-
-
Search Results
424
records
(took 0.02 seconds)
