-
公开(公告)号：US07747173B1
公开(公告)日：2010-06-29
申请号：US11728841
申请日：2007-03-26
IPC分类号： H04B10/00
CPC分类号： H04B10/801
摘要： Embodiments of an integrated circuit are described. This integrated circuit includes a clock-generator circuit configured to provide a clock signal and an optical clock path coupled to the clock-generator circuit. Note that the optical clock path is configured to distribute optical signals corresponding to the clock signal. Furthermore, note that a given optical signal has a phase which is different than phases of the other optical signals.
摘要翻译： 描述集成电路的实施例。 该集成电路包括时钟发生器电路，其被配置为提供时钟信号和耦合到时钟发生器电路的光时钟通路。 注意，光时钟路径被配置为分配对应于时钟信号的光信号。 此外，注意，给定的光信号具有与其它光信号的相位不同的相位。
-
公开(公告)号：US07646984B1
公开(公告)日：2010-01-12
申请号：US11728915
申请日：2007-03-26
IPC分类号： H04B10/12
CPC分类号： G06F1/105
摘要： Embodiments of an integrated circuit are described. This integrated circuit includes: a clock-generator circuit configured to provide a clock signal; an optical clock path coupled to the clock-generator circuit; and a latch coupled to the optical clock path. This optical clock path is configured to distribute an optical signal corresponding to the clock signal. Furthermore, the optical clock path is configured to optically set a skew value for the optical signal, and is configured to selectively gate distribution of the optical signal to the latch based on activity of the latch. Note that the selective gating is performed optically.
摘要翻译： 描述集成电路的实施例。 该集成电路包括：时钟发生器电路，被配置为提供时钟信号; 耦合到时钟发生器电路的光时钟通路; 以及耦合到光时钟路径的锁存器。 该光时钟路径被配置为分配对应于时钟信号的光信号。 此外，光时钟路径被配置为光学地设置光信号的偏斜值，并且被配置为基于锁存器的活动来选择性地将光信号分配到锁存器。 注意，选择性门控是光学执行的。
-
公开(公告)号：US07356213B1
公开(公告)日：2008-04-08
申请号：US11728843
申请日：2007-03-26
IPC分类号： G02B6/12
CPC分类号： H01L23/48 , H01L25/0652 , H01L25/0657 , H01L2225/06513 , H01L2225/06527 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of a switch are described. This switch includes input ports configured to receive signals (which include data) and output ports configured to output the signals. In addition, the switch includes switching elements and a flow-control mechanism, which is configured to provide flow-control information associated with the data to the switching elements via an optical control path. These switching elements are configured to selectively couple the input ports to the output ports based on the flow-control information. Furthermore, a given switching element in the switching elements is coupled to a given input port and a given output port via electrical signal paths that are configured to use proximity communication to communicate the data.
摘要翻译： 描述开关的实施例。 该开关包括被配置为接收被配置为输出信号的信号（其包括数据）和输出端口的输入端口。 此外，开关包括开关元件和流量控制机构，其被配置为经由光学控制路径向开关元件提供与数据相关联的流量控制信息。 这些开关元件被配置为基于流量控制信息选择性地将输入端口耦合到输出端口。 此外，开关元件中的给定开关元件通过经配置以使用接近通信来传送数据的电信号路径耦合到给定输入端口和给定输出端口。
-
公开(公告)号：US08195990B2
公开(公告)日：2012-06-05
申请号：US13212900
申请日：2011-08-18
IPC分类号： G11B5/00
CPC分类号： H04B5/0075 , H01L25/065 , H01L2924/0002 , H04B17/318 , H04L1/0009 , Y10T29/49133 , H01L2924/00
摘要： In a proximity communication system, transmit elements on one chip are aligned with receive elements on a second chip juxtaposed with the first chip. However, if the elements are misaligned, either statically or dynamically, the coupling between chips is degraded. The misalignment may be compensated by controllably degrading performance of the system. For example, the transmit signal strength may be increased. The bit period or the time period for biasing each bit may be increased, thereby decreasing the bandwidth. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels. The granularity of symbols, such as images, may be increased by decreasing the number of bits per symbol. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels.
摘要翻译： 在接近通信系统中，一个芯片上的发射元件与与第一芯片并置的第二芯片上的接收元件对齐。 然而，如果元件是静态的或动态的，则芯片之间的耦合会降低。 可以通过可控地降低系统的性能来补偿未对准。 例如，可以增加发射信号强度。 可以增加用于偏置每个位的位周期或时间段，从而降低带宽。 诸如电容器的多个耦合元件可以组合在一起，从而减少通道数量。 可以通过减少每个符号的比特数来增加诸如图像的符号的粒度。 诸如电容器的多个耦合元件可以组合在一起，从而减少通道数量。
-
公开(公告)号：US20100115349A1
公开(公告)日：2010-05-06
申请号：US12263713
申请日：2008-11-03
CPC分类号： H04B5/0075 , H01L25/065 , H01L2924/0002 , H04B17/318 , H04L1/0009 , Y10T29/49133 , H01L2924/00
摘要： In a proximity communication system, transmit elements on one chip are aligned with receive elements on a second chip juxtaposed with the first chip. However, if the elements are misaligned, either statically or dynamically, the coupling between chips is degraded. The misalignment may be compensated by controllably degrading performance of the system. For example, the transmit signal strength may be increased. The bit period or the time period for biasing each bit may be increased, thereby decreasing the bandwidth. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels. The granularity of symbols, such as images, may be increased by decreasing the number of bits per symbol. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels.
摘要翻译： 在接近通信系统中，一个芯片上的发射元件与与第一芯片并置的第二芯片上的接收元件对齐。 然而，如果元件是静态的或动态的，则芯片之间的耦合会降低。 可以通过可控地降低系统的性能来补偿未对准。 例如，可以增加发射信号强度。 可以增加用于偏置每个位的位周期或时间段，从而降低带宽。 诸如电容器的多个耦合元件可以组合在一起，从而减少通道数量。 可以通过减少每个符号的比特数来增加诸如图像的符号的粒度。 诸如电容器的多个耦合元件可以组合在一起，从而减少通道数量。
-
公开(公告)号：US08024623B2
公开(公告)日：2011-09-20
申请号：US12263713
申请日：2008-11-03
IPC分类号： G11B5/00
CPC分类号： H04B5/0075 , H01L25/065 , H01L2924/0002 , H04B17/318 , H04L1/0009 , Y10T29/49133 , H01L2924/00
摘要： In a proximity communication system, transmit elements on one chip are aligned with receive elements on a second chip juxtaposed with the first chip. However, if the elements are misaligned, either statically or dynamically, the coupling between chips is degraded. The misalignment may be compensated by controllably degrading performance of the system. For example, the transmit signal strength may be increased. The bit period or the time period for biasing each bit may be increased, thereby decreasing the bandwidth. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels. The granularity of symbols, such as images, may be increased by decreasing the number of bits per symbol.
摘要翻译： 在接近通信系统中，一个芯片上的发射元件与与第一芯片并置的第二芯片上的接收元件对齐。 然而，如果元件是静态的或动态的，则芯片之间的耦合会降低。 可以通过可控地降低系统的性能来补偿未对准。 例如，可以增加发射信号强度。 可以增加用于偏置每个位的位周期或时间段，从而降低带宽。 诸如电容器的多个耦合元件可以组合在一起，从而减少通道数量。 可以通过减少每个符号的比特数来增加诸如图像的符号的粒度。
-
公开(公告)号：US07840136B1
公开(公告)日：2010-11-23
申请号：US11728844
申请日：2007-03-26
CPC分类号： H04Q11/0005 , H04Q3/66 , H04Q2011/0039 , H04Q2011/005 , H04Q2011/0052
摘要： Embodiments of a switch are described. This switch includes input ports configured to receive signals (which include data) and output ports configured to output the signals. In addition, the switch includes switching elements and a flow-control mechanism, which is configured to provide flow-control information associated with the data to the switching elements via an electrical control path. Note that the electrical control path is configured to use proximity communication to communicate the flow-control information. Furthermore, the switching elements are configured to selectively couple the input ports to the output ports via optical signal paths based on the flow-control information.
摘要翻译： 描述开关的实施例。 该开关包括被配置为接收被配置为输出信号的信号（其包括数据）和输出端口的输入端口。 此外，开关包括开关元件和流量控制机构，其被配置为经由电控制路径向开关元件提供与数据相关联的流量控制信息。 注意，电气控制路径被配置为使用邻近通信来传达流量控制信息。 此外，开关元件被配置为基于流量控制信息经由光信号路径选择性地将输入端口耦合到输出端口。
-
公开(公告)号：US07817880B1
公开(公告)日：2010-10-19
申请号：US11728845
申请日：2007-03-26
CPC分类号： G02B6/43 , G02B6/35 , H04B10/803
摘要： Embodiments of a system are described. This system includes an array of single-chip modules (CMs), which includes a first CM and a second CM which are coupled to each other. A given CM, which can be either the first CM or the second CM, includes a semiconductor die that is configured to communicate data signals with other CMs by capacitively coupled proximity communication and optical proximity communication using proximity connectors. These proximity connectors are proximate to a surface of the semiconductor die, and the semiconductor die includes an optical signal path configured to communicate on-chip optical signals.
摘要翻译： 描述系统的实施例。 该系统包括单芯片模块（CM）的阵列，其包括彼此耦合的第一CM和第二CM。 可以是第一CM或第二CM的给定CM包括被配置为通过电容耦合的邻近通信和使用接近连接器的光学邻近通信与其他CM通信数据信号的半导体管芯。 这些接近连接器靠近半导体管芯的表面，并且半导体管芯包括被配置为传送片上光信号的光信号通路。
-
公开(公告)号：US20110302465A1
公开(公告)日：2011-12-08
申请号：US13212900
申请日：2011-08-18
IPC分类号： G06F11/07
CPC分类号： H04B5/0075 , H01L25/065 , H01L2924/0002 , H04B17/318 , H04L1/0009 , Y10T29/49133 , H01L2924/00
摘要： In a proximity communication system, transmit elements on one chip are aligned with receive elements on a second chip juxtaposed with the first chip. However, if the elements are misaligned, either statically or dynamically, the coupling between chips is degraded. The misalignment may be compensated by controllably degrading performance of the system. For example, the transmit signal strength may be increased. The bit period or the time period for biasing each bit may be increased, thereby decreasing the bandwidth. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels. The granularity of symbols, such as images, may be increased by decreasing the number of bits per symbol. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels.
摘要翻译： 在接近通信系统中，一个芯片上的发射元件与与第一芯片并置的第二芯片上的接收元件对齐。 然而，如果元件是静态的或动态的，则芯片之间的耦合会降低。 可以通过可控地降低系统的性能来补偿未对准。 例如，可以增加发射信号强度。 可以增加用于偏置每个位的位周期或时间段，从而降低带宽。 诸如电容器的多个耦合元件可以组合在一起，从而减少通道数量。 可以通过减少每个符号的比特数来增加诸如图像的符号的粒度。 诸如电容器的多个耦合元件可以组合在一起，从而减少通道数量。
-
公开(公告)号：US08207752B2
公开(公告)日：2012-06-26
申请号：US12685159
申请日：2010-01-11
申请人： Kannan Raj , Xuezhe Zheng , Ashok V. Krishnamoorthy , Ronald Ho , Michael O. McCracken , David K. McElfresh , John E. Cunningham
发明人： Kannan Raj , Xuezhe Zheng , Ashok V. Krishnamoorthy , Ronald Ho , Michael O. McCracken , David K. McElfresh , John E. Cunningham
IPC分类号： H03K19/003
CPC分类号： H03K19/177
摘要： A multi-chip module (MCM) is described. This MCM includes multiple sites, where a given site in the multiple sites includes multiple chips with proximity connectors that communicate information through proximity communication within the MCM via multiple components associated with the given site. Note that the MCM includes global redundancy and local redundancy at the given site. In particular, the global redundancy involves providing one or more redundant sites in the multiple sites. Furthermore, the local redundancy involves providing one or more redundant chips in the multiple chips and one or more redundant components in the multiple components.
摘要翻译： 描述了多芯片模块（MCM）。 该MCM包括多个站点，其中多个站点中的给定站点包括具有邻近连接器的多个芯片，其通过与给定站点相关联的多个组件在MCM内通过邻近通信传递信息。 请注意，MCM包括给定站点的全局冗余和本地冗余。 特别地，全局冗余涉及在多个站点中提供一个或多个冗余站点。 此外，本地冗余包括在多个芯片中提供一个或多个冗余芯片以及在多个组件中提供一个或多个冗余组件。
-
-
-
-
-
-
-
-
-
搜索结果
118 条记录 (耗时 0.028 秒)
