公开(公告)号：US20150185085A1

公开(公告)日：2015-07-02

申请号：US14140784

申请日：2013-12-26

Applicant: Rosemount Inc.

Inventor： Pat Dodson Converse

IPC: G01K1/14 ,  G01K3/14 ,  G01K13/00

CPC classification number: G01K1/143 ,  G01K3/14 ,  G01K7/427 ,  G01K13/00 ,  G01K13/02

Abstract: A temperature sensor assembly for use with a process vessel wall includes a base structure, a first temperature sensor, a second temperature sensor, and a processor. The base structure forms a contact area with an external surface of the process vessel wall. The first temperature sensor extends through the base structure to measure a temperature of the external surface of the process vessel wall. The second temperature sensor is at a second surface spaced from the first surface to measure a temperature of the second surface of the base structure. The processor is connected to the first and second temperature sensors, and adapted to determine an internal process vessel wall temperature value as a function of the measured temperature of the external surface of the process vessel wall, the measured temperature of the second surface of the base structure, base structure parameters, and process vessel wall parameters.

Abstract translation: 与过程容器壁一起使用的温度传感器组件包括基座结构，第一温度传感器，第二温度传感器和处理器。 基底结构与处理容器壁的外表面形成接触区域。 第一温度传感器延伸穿过基部结构以测量处理容器壁的外表面的温度。 第二温度传感器处于与第一表面间隔开的第二表面，以测量基部结构的第二表面的温度。 处理器连接到第一温度传感器和第二温度传感器，并且适于确定作为处理容器壁的外表面的测量温度的函数的内部处理容器壁温度值，基底的第二表面的测量温度 结构，基础结构参数和过程容器壁参数。

公开(公告)号：US09360377B2

公开(公告)日：2016-06-07

申请号：US14140784

申请日：2013-12-26

Applicant: Rosemount Inc.

Inventor： Pat Dodson Converse

IPC: G01K1/14 ,  G01K3/14 ,  G01K13/00 ,  G01K7/42

CPC classification number: G01K1/143 ,  G01K3/14 ,  G01K7/427 ,  G01K13/00 ,  G01K13/02

Abstract: A temperature sensor assembly for use with a process vessel wall includes a base structure, a first temperature sensor, a second temperature sensor, and a processor. The base structure forms a contact area with an external surface of the process vessel wall. The first temperature sensor extends through the base structure to measure a temperature of the external surface of the process vessel wall. The second temperature sensor is at a second surface spaced from the first surface to measure a temperature of the second surface of the base structure. The processor is connected to the first and second temperature sensors, and adapted to determine an internal process vessel wall temperature value as a function of the measured temperature of the external surface of the process vessel wall, the measured temperature of the second surface of the base structure, base structure parameters, and process vessel wall parameters.

Abstract translation: 与过程容器壁一起使用的温度传感器组件包括基座结构，第一温度传感器，第二温度传感器和处理器。 基底结构与处理容器壁的外表面形成接触区域。 第一温度传感器延伸穿过基部结构以测量处理容器壁的外表面的温度。 第二温度传感器处于与第一表面间隔开的第二表面，以测量基部结构的第二表面的温度。 处理器连接到第一温度传感器和第二温度传感器，并且适于确定作为处理容器壁的外表面的测量温度的函数的内部处理容器壁温度值，基底的第二表面的测量温度 结构，基础结构参数和过程容器壁参数。