Packaging Structure of AC light-emitting diodes
    2.
    发明申请
    Packaging Structure of AC light-emitting diodes 审中-公开
    交流发光二极管的封装结构

    公开(公告)号:US20110089443A1

    公开(公告)日:2011-04-21

    申请号:US12801704

    申请日:2010-06-22

    申请人: Hui-Wen Hsu

    发明人: Hui-Wen Hsu

    IPC分类号: H01L33/62 H01L33/48

    摘要: A packaging structure of AC LEDs is provided, which comprises: a carrier containing a positive electrode connecting end, and a negative electrode connecting end; an AC LED module disposed on the carrier, wherein the AC LED module electrically connects to the positive electrode connecting end and the negative electrode connecting end of the carrier; and a die-bonding insulating layer disposed between the AC LED module and the carrier.

    摘要翻译: 提供了一种AC LED的封装结构,其包括:包含正极连接端和负极连接端的载体; 设置在所述载体上的AC LED模块,其中所述AC LED模块电连接到所述载体的正极连接端和所述负极连接端; 以及设置在AC LED模块和载体之间的芯片接合绝缘层。