公开(公告)号：US08633088B2

公开(公告)日：2014-01-21

申请号：US13460020

申请日：2012-04-30

Applicant: Ruben B Montez ,  Robert F Steimle

Inventor： Ruben B Montez ,  Robert F Steimle

IPC: H01L21/30 ,  H01L21/00 ,  H01L21/46 ,  H01L23/06

CPC classification number: H01L23/10 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/019 ,  H01L21/743 ,  H01L23/04 ,  H01L23/053 ,  H01L24/05 ,  H01L24/06 ,  H01L24/94 ,  H01L2224/04042 ,  H01L2224/06155 ,  H01L2224/83 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/16152 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/16788 ,  H01L2924/00

Abstract: A bonded semiconductor device comprising a support substrate, a semiconductor device located with respect to one side of the support substrate, a cap substrate overlying the support substrate and the device, a glass frit bond ring between the support substrate and the cap substrate, an electrically conductive ring between the support substrate and the cap substrate. The electrically conductive ring forms an inner ring around the semiconductor device and the glass frit bond ring forms an outer bond ring around the semiconductor device.

Abstract translation: 一种键合半导体器件，包括支撑衬底，相对于所述支撑衬底的一侧定位的半导体器件，覆盖所述支撑衬底和所述器件的帽衬底，所述支撑衬底和所述帽衬底之间的玻璃料接合环，电 支撑基板和盖基板之间的导电环。 导电环在半导体器件周围形成内环，并且玻璃料接合环在半导体器件周围形成外部结合环。