公开(公告)号：US5396185A

公开(公告)日：1995-03-07

申请号：US100252

申请日：1993-08-02

申请人： Ryoji Honma ,  Soichi Kawasaki ,  Hidetaka Tone ,  Hiroyuki Ohira ,  Kouichi Watanabe

发明人： Ryoji Honma ,  Soichi Kawasaki ,  Hidetaka Tone ,  Hiroyuki Ohira ,  Kouichi Watanabe

IPC分类号： H01L21/66 ,  G01R1/04 ,  H01L21/48 ,  G01R31/28

CPC分类号： G01R1/04

摘要： A plurality of semiconductor integrated circuit devices are mounted on a film carrier. First electrical connecting sections and first electrical wiring sections for electrically connecting the first electrical connecting sections to the semiconductor integrated circuit devices are provided on the film carrier. Second and third electrical connecting sections and second electrical wiring sections are provided on a film-like probe for electrical characteristic test. The second electrical connecting sections are provided in position corresponding to the first electrical connecting sections of the film carrier. The third electrical connecting sections are used to supply electrical signals to the exterior or derive an electrical signal to the exterior and check the electrical signal. The second electrical wiring sections electrically connects the second and third electrical connecting sections to each other. When the test is effected, the film-like probe and the film carrier are superposed on each other so as to set the second electrical connecting sections of the film-like probe into contact with the first electrical connecting sections of the film carrier. The electrical characteristic test of the semiconductor integrated circuit devices are effected by supplying electrical signals necessary for the electrical characteristic test of the semiconductor integrated circuit devices from the exterior via the third electrical connecting sections or deriving the electrical signals to the exterior and checking the electrical signals.

摘要翻译： 多个半导体集成电路器件安装在薄膜载体上。 第一电连接部分和用于将第一电连接部分电连接到半导体集成电路器件的第一电连接部分设置在胶片载体上。 第二和第三电连接部分和第二电连接部分设置在用于电特性测试的膜状探针上。 第二电连接部设置在与胶片承载体的第一电连接部对应的位置。 第三电连接部分用于向外部提供电信号，或者将电信号导出到外部并检查电信号。 第二电气配线部将第二和第三电连接部彼此电连接。 当进行测试时，将膜状探针和薄膜载体彼此叠置，以将薄膜状探针的第二电连接部分与薄膜载体的第一电连接部分接触。 半导体集成电路器件的电特性测试通过经由第三电连接部分从外部提供半导体集成电路器件的电特性测试所需的电信号或者将电信号导出到外部并检查电信号来实现 。

公开(公告)号：US5237268A

公开(公告)日：1993-08-17

申请号：US742426

申请日：1991-08-07

申请人： Ryoji Honma ,  Soichi Kawasaki ,  Hidetaka Tone ,  Hiroyuki Ohira ,  Kouichi Watanabe

发明人： Ryoji Honma ,  Soichi Kawasaki ,  Hidetaka Tone ,  Hiroyuki Ohira ,  Kouichi Watanabe

IPC分类号： H01L21/66 ,  G01R1/04 ,  H01L21/48

CPC分类号： G01R1/04

摘要： A plurality of semiconductor integrated circuit devices are mounted on a film carrier. First electrical connecting sections and first electrical wiring sections for electrically connecting the first electrical connecting sections to the semiconductor integrated circuit devices are provided on the film carrier. Second and third electrical connecting sections and second electrical wiring sections are provided on a film-like probe for electrical characteristic test. The second electrical connecting sections are provided in position corresponding to the first electrical connecting sections of the film carrier. The third electrical connecting sections are used to supply electrical signals to the exterior or derive an electrical signal to the exterior and check the electrical signal. The second electrical wiring sections connects the second and third electrical connecting sections to each other. The film-like probe and the film carrier are superposed on each other so as to set the second electrical connecting sections of the filmlike probe into contact with the first electrical connecting sections of the film carrier.

摘要翻译： 多个半导体集成电路器件安装在薄膜载体上。 第一电连接部分和用于将第一电连接部分电连接到半导体集成电路器件的第一电连接部分设置在胶片载体上。 第二和第三电连接部分和第二电连接部分设置在用于电特性测试的膜状探针上。 第二电连接部设置在与胶片承载体的第一电连接部对应的位置。 第三电连接部分用于向外部提供电信号，或者将电信号导出到外部并检查电信号。 第二电连接部将第二和第三电连接部彼此连接。 膜状探针和薄膜载体彼此重合，以使膜状探针的第二电连接部分与薄膜载体的第一电连接部分接触。