公开(公告)号：US20090283574A1

公开(公告)日：2009-11-19

申请号：US12437998

申请日：2009-05-08

申请人： Ryuichi OKAZAKI ,  Ryosuke Kumagai ,  Takuya Hando ,  Hajime Okamoto ,  Motonobu Kurahashi

发明人： Ryuichi OKAZAKI ,  Ryosuke Kumagai ,  Takuya Hando ,  Hajime Okamoto ,  Motonobu Kurahashi

IPC分类号： B23K1/20 ,  B23K3/06

CPC分类号： H05K3/3478 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11005 ,  H01L2224/742 ,  H01L2924/00014 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0485 ,  H05K2203/0557 ,  H01L2224/05599

摘要： A wiring board includes an insulating layer having a plurality of through holes formed therein, a base substrate layer positioned below the insulating layer, and a plurality of electrodes disposed on the base substrate layer, each electrode having an exposed surface exposed from a respective through hole, each exposed surfaces being coated with a flux. A plurality of solder balls are disposed on the fluxes in the through holes, respectively. An apparatus for mounting the solder balls on the plurality of electrodes includes: a solder ball removing unit configured to remove a first plurality of solder balls located other than in the through holes; and a solder ball pressing unit configured to press a second plurality of solder balls individually disposed in the through holes towards respective electrodes and into respective flux.

摘要翻译： 布线基板包括绝缘层，其中形成有多个通孔，位于绝缘层下方的基底层，以及设置在基底层上的多个电极，每个电极具有从相应通孔露出的暴露表面 每个暴露的表面都涂有助焊剂。 多个焊球分别设置在通孔中的焊剂上。 用于将焊球安装在多个电极上的装置包括：焊球去除单元，被配置为去除除通孔之外的第一多个焊球; 以及焊球压制单元，其被配置为将分别设置在所述通孔中的第二多个焊球朝向相应的电极按压，并且分别成为各自的焊剂。