公开(公告)号：US20180331058A1

公开(公告)日：2018-11-15

申请号：US15813222

申请日：2017-11-15

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： David W. Abraham ,  John M. Cotte

IPC: H01L23/00 ,  H01L23/522

CPC classification number: H01L24/11 ,  H01L21/76898 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/14 ,  H01L24/24 ,  H01L24/25 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L27/18 ,  H01L39/00 ,  H01L2224/0345 ,  H01L2224/0347 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05558 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/11005 ,  H01L2224/1131 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13009 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24105 ,  H01L2224/24146 ,  H01L2224/25175 ,  H01L2224/275 ,  H01L2224/29023 ,  H01L2224/29124 ,  H01L2224/32145 ,  H01L2224/32221 ,  H01L2224/73209 ,  H01L2224/73217 ,  H01L2224/73253 ,  H01L2224/82031 ,  H01L2224/82101 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/8382 ,  H01L2224/9202 ,  H01L2224/92144 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/11

Abstract: A semiconductor structure and methods of forming the semiconductor structure include a solder bump self-aligned to a through-substrate-via, wherein the solder bump and the through-substrate-via are formed of a conductive metal material, and wherein the through-substrate-via is coupled to a buried metallization layer, which is formed of a different conductive metal material.

公开(公告)号：US09972556B2

公开(公告)日：2018-05-15

申请号：US14797815

申请日：2015-07-13

Applicant: International Business Machines Corporation

Inventor： Peter A. Gruber ,  Jae-Woong Nah

IPC: H01L21/44 ,  H01L23/48 ,  H01L23/00 ,  B23K3/06 ,  B23K1/00 ,  B23K26/384 ,  B23K26/40 ,  B23K26/382 ,  H01L23/498 ,  H01L21/48 ,  B23K101/42 ,  H01L23/14 ,  B23K103/16

CPC classification number: H01L23/48 ,  B23K1/0016 ,  B23K3/0607 ,  B23K3/0623 ,  B23K26/384 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/42 ,  B23K2103/16 ,  H01L21/4853 ,  H01L23/14 ,  H01L23/147 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/0345 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/056 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/111 ,  H01L2224/1112 ,  H01L2224/11436 ,  H01L2224/11472 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13551 ,  H01L2224/13561 ,  H01L2224/136 ,  H01L2224/81101 ,  H01L2224/81191 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: A system of producing metal cored solder structures on a substrate includes: a decal having a plurality of apertures, the apertures being tapered from a top surface to a bottom surface of the decal; a carrier configured for positioning beneath the bottom of the decal, the carrier having cavities in a top surface and the cavities located in alignment with the apertures of the decal; the decal being configured for positioning on the carrier having the decal bottom surface in contact with the carrier top surface to form feature cavities defined by the decal apertures and the carrier cavities, the feature cavities being shaped to receive a plurality of metal elements therein, the feature cavities configured for receiving molten solder being cooled in the cavities, the decal being separable from the carrier to partially expose metal core solder contacts; and receiving elements of a substrate being configured to receive the metal core solder contacts thereon, and the metal core solder contacts being exposed and positioned on the substrate.

公开(公告)号：US09935072B2

公开(公告)日：2018-04-03

申请号：US15291063

申请日：2016-10-11

Applicant: SFA SEMICON CO., LTD.

Inventor： Byeong Ho Jeong ,  Eun Dong Kim ,  Jong Won Lee ,  Hyun Hak Jung ,  Jai Kyoung Choi

IPC: H01L23/52 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L24/16 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0231 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02331 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/03612 ,  H01L2224/03614 ,  H01L2224/03616 ,  H01L2224/03912 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/05611 ,  H01L2224/10145 ,  H01L2224/10175 ,  H01L2224/11005 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1601 ,  H01L2224/16014 ,  H01L2224/16111 ,  H01L2224/16112 ,  H01L2224/16147 ,  H01L2224/16237 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/3201 ,  H01L2224/32058 ,  H01L2224/32145 ,  H01L2224/73103 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/9211 ,  H01L2224/9212 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06558 ,  H01L2924/3512 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/014 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2924/01074 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01044 ,  H01L2924/01051 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/095 ,  H01L2924/07025 ,  H01L2924/0715 ,  H01L2924/0685 ,  H01L2924/0695 ,  H01L2224/119 ,  H01L2224/03444 ,  H01L2224/0346 ,  H01L2224/1146 ,  H01L2224/0361 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/06 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/07802

Abstract: The present disclosure provides a semiconductor package that prevents a bump bridge from being formed between adjacent conductive bumps to realize a fine bump pitch when each unit circuit part is directly stacked without using a printed circuit board and a method for manufacturing the same. The semiconductor package includes a first semiconductor chip structure including a first unit circuit part, a first passivation layer disposed on the first unit circuit part, and a conductive bump electrically connected to the first unit circuit part, and a second semiconductor chip structure including a second unit circuit part, a second passivation layer having a stepped portion that is recessed inward and disposed on the second unit circuit part, and a bump pad provided in the stepped portion. The first semiconductor chip structure and the second semiconductor chip structure are stacked to allow the conductive bump to be bonded to the bump pad within the stepped portion.

公开(公告)号：US09935044B2

公开(公告)日：2018-04-03

申请号：US15092256

申请日：2016-04-06

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Hsiu-Jen Lin ,  Wen-Hsiung Lu ,  Cheng-Ting Chen ,  Hsuan-Ting Kuo ,  Wei-Yu Chen ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L23/48 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H05K3/34 ,  H05K1/11 ,  H01L21/56

CPC classification number: H01L23/49816 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/49838 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L2224/02377 ,  H01L2224/02379 ,  H01L2224/0239 ,  H01L2224/0382 ,  H01L2224/03829 ,  H01L2224/03849 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05024 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05184 ,  H01L2224/05568 ,  H01L2224/05794 ,  H01L2224/05811 ,  H01L2224/10125 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/119 ,  H01L2224/1191 ,  H01L2224/13006 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13117 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/14131 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32058 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/812 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/81815 ,  H01L2224/9212 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/351 ,  H05K1/111 ,  H05K3/34 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2924/01032 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/01084 ,  H01L2924/01031 ,  H01L2924/01049 ,  H01L2924/01081 ,  H01L2924/00012 ,  H01L2924/01082 ,  H01L2924/01013 ,  H01L2924/01079 ,  H01L2924/01028 ,  H01L2924/01074

Abstract: The present disclosure provides a semiconductor package includes a contact pad, a device external to the contact pad and a solder bump on the contact pad. The device has a conductive contact pad corresponding to the contact pad. The solder bump connects the contact pad with the conductive contact pad. The solder bump comprises a height from a top of the solder bump to the contact pad; and a width which is a widest dimension of the solder bump in a direction perpendicular to the height. A junction portion of the solder bump in proximity to the contact pad comprises an hourglass shape.

公开(公告)号：US09922934B2

公开(公告)日：2018-03-20

申请号：US15141836

申请日：2016-04-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Hui Wang ,  Chih-Hung Cheng ,  Yung-Chi Lin ,  Wen-Chih Chiou

IPC: H01L23/544 ,  G03F9/00 ,  H01L21/683 ,  H01L21/3105 ,  H01L23/00

CPC classification number: H01L21/3105 ,  H01L21/6835 ,  H01L24/11 ,  H01L2221/6835 ,  H01L2221/68359 ,  H01L2224/11002 ,  H01L2224/11005

Abstract: A package carrier includes a carrier and a light absorption layer. The light absorption layer is disposed on the carrier. The light absorption layer includes a notch at the periphery of the carrier, and the notch is light transmissive so as to expose the carrier to light in a normal direction of the carrier. A semiconductor manufacturing process is also provided.

公开(公告)号：US20170352641A1

公开(公告)日：2017-12-07

申请号：US15173816

申请日：2016-06-06

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chien-Ling HWANG ,  Hsin-Hung LIAO ,  Yu-Ting CHIU ,  Ching-Hua HSIEH

IPC: H01L23/00

CPC classification number: H01L24/81 ,  H01L24/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/742 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/13017 ,  H01L2224/751 ,  H01L2224/75753 ,  H01L2224/80127 ,  H01L2224/80136 ,  H01L2224/81024 ,  H01L2224/81201 ,  H01L2224/81345 ,  H01L2924/00012

Abstract: A method for mounting components on a substrate is provided. The method includes providing a positioning plate which has a plurality of through holes. The method further includes supplying components each having a longitudinal portion on the positioning plate. The method also includes performing a component alignment process to put the longitudinal portions of the components in the through holes. In addition, the method includes connecting a substrate to the components which have their longitudinal portions in the through holes and removing the positioning plate.

公开(公告)号：US09793198B2

公开(公告)日：2017-10-17

申请号：US14275519

申请日：2014-05-12

Applicant: Invensas Corporation

Inventor： Cyprian Emeka Uzoh ,  Rajesh Katkar

IPC: H01L23/498 ,  B23K35/22 ,  B23K35/02 ,  B32B15/01 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00 ,  B23K1/00 ,  B23K101/40

CPC classification number: H01L23/49811 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/0266 ,  B23K35/22 ,  B23K2101/40 ,  B32B15/01 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3135 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/73 ,  H01L24/742 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/98 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/03 ,  H01L2224/03001 ,  H01L2224/03009 ,  H01L2224/03318 ,  H01L2224/0332 ,  H01L2224/0333 ,  H01L2224/03334 ,  H01L2224/0348 ,  H01L2224/03848 ,  H01L2224/03849 ,  H01L2224/039 ,  H01L2224/03901 ,  H01L2224/0391 ,  H01L2224/04105 ,  H01L2224/05022 ,  H01L2224/051 ,  H01L2224/05294 ,  H01L2224/05547 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05582 ,  H01L2224/056 ,  H01L2224/05794 ,  H01L2224/05839 ,  H01L2224/05844 ,  H01L2224/05847 ,  H01L2224/05855 ,  H01L2224/0603 ,  H01L2224/06102 ,  H01L2224/10145 ,  H01L2224/11001 ,  H01L2224/11005 ,  H01L2224/11009 ,  H01L2224/111 ,  H01L2224/11318 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/11901 ,  H01L2224/1191 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/1319 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13561 ,  H01L2224/13562 ,  H01L2224/13565 ,  H01L2224/136 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/1403 ,  H01L2224/16058 ,  H01L2224/16059 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/1701 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/17505 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/2401 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/75253 ,  H01L2224/81 ,  H01L2224/81138 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/8122 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/82005 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/82105 ,  H01L2224/83 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/07025 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/3512 ,  H01L2924/381 ,  H01L2924/3841

Abstract: A solder connection may be surrounded by a solder locking layer (1210, 2210) and may be recessed in a hole (1230) in that layer. The recess may be obtained by evaporating a vaporizable portion (1250) of the solder connection. Other features are also provided.

公开(公告)号：US09656353B2

公开(公告)日：2017-05-23

申请号：US14353495

申请日：2012-10-26

Applicant: Hitachi Chemical Company, Ltd.

Inventor： Kazuhiro Miyauchi ,  Naoya Suzuki ,  Nozomu Takano ,  Yukihiko Yamashita

IPC: H01L23/00 ,  H01L23/498 ,  B23K35/362 ,  B23K35/26 ,  C22C12/00 ,  C22C13/00 ,  C22C28/00 ,  B23K35/02 ,  H01L21/48 ,  H01L23/488 ,  H01L21/56 ,  H05K3/34 ,  B23K1/00 ,  B23K1/06 ,  B23K35/30 ,  B23K35/36 ,  B23K1/012 ,  B23K1/20 ,  B23K101/40 ,  B23K101/42

CPC classification number: B23K35/362 ,  B23K1/0016 ,  B23K1/012 ,  B23K1/06 ,  B23K1/203 ,  B23K35/0244 ,  B23K35/26 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3613 ,  B23K2101/40 ,  B23K2101/42 ,  C22C12/00 ,  C22C13/00 ,  C22C28/00 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/488 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/11005 ,  H01L2224/11436 ,  H01L2224/11522 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16238 ,  H01L2224/81075 ,  H01L2224/81101 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81815 ,  H01L2224/83815 ,  H01L2224/83886 ,  H01L2224/8391 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12042 ,  H05K3/3436 ,  H05K3/3478 ,  H05K2201/10977 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: The present invention relates to a reflow film containing a thermoplastic resin which is dissolvable in a solvent, and solder particles, wherein the solder particles are dispersed in the film, and also relates to a solder bump formation method which comprises: (A) a step of mounting the reflow film on the electrode surface side of a substrate, (B) a step of mounting and fixing a flat plate, (C) a step of heating, and (D) a step of dissolving and removing the reflow film, and herewith, a reflow film is provided which, by causing localization of the solder component on the electrodes of the substrate by self-assembly, exhibits excellent storage properties, transportability and handling properties during use, and can form solder bumps or solder joints selectively on only the electrodes.

公开(公告)号：US20170125369A1

公开(公告)日：2017-05-04

申请号：US15291063

申请日：2016-10-11

Applicant: SFA SEMICON CO., LTD.

Inventor： Byeong Ho JEONG ,  Eun Dong KIM ,  Jong Won LEE ,  Hyun Hak JUNG ,  Jai Kyoung CHOI

IPC: H01L23/00 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L24/16 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0231 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02331 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/03612 ,  H01L2224/03614 ,  H01L2224/03616 ,  H01L2224/03912 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/05611 ,  H01L2224/10145 ,  H01L2224/10175 ,  H01L2224/11005 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1601 ,  H01L2224/16014 ,  H01L2224/16111 ,  H01L2224/16112 ,  H01L2224/16147 ,  H01L2224/16237 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/3201 ,  H01L2224/32058 ,  H01L2224/32145 ,  H01L2224/73103 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/9211 ,  H01L2224/9212 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06558 ,  H01L2924/3512 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/014 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2924/01074 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01044 ,  H01L2924/01051 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/095 ,  H01L2924/07025 ,  H01L2924/0715 ,  H01L2924/0685 ,  H01L2924/0695 ,  H01L2224/119 ,  H01L2224/03444 ,  H01L2224/0346 ,  H01L2224/1146 ,  H01L2224/0361 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/06 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/07802

Abstract: The present disclosure provides a semiconductor package that prevents a bump bridge from being formed between adjacent conductive bumps to realize a fine bump pitch when each unit circuit part is directly stacked without using a printed circuit board and a method for manufacturing the same. The semiconductor package includes a first semiconductor chip structure including a first unit circuit part, a first passivation layer disposed on the first unit circuit part, and a conductive bump electrically connected to the first unit circuit part, and a second semiconductor chip structure including a second unit circuit part, a second passivation layer having a stepped portion that is recessed inward and disposed on the second unit circuit part, and a bump pad provided in the stepped portion. The first semiconductor chip structure and the second semiconductor chip structure are stacked to allow the conductive bump to be bonded to the bump pad within the stepped portion.

公开(公告)号：US09615464B2

公开(公告)日：2017-04-04

申请号：US14073998

申请日：2013-11-07

Applicant: FUJITSU LIMITED

Inventor： Takashi Kubota ,  Masayuki Kitajima ,  Takatoyo Yamakami ,  Hidehiko Kira

IPC: H05K3/34 ,  B23K35/02 ,  B23K3/08 ,  H01L23/00 ,  H01L31/167 ,  H01S5/022

CPC classification number: H05K3/3484 ,  B23K3/08 ,  B23K35/02 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L31/167 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/11005 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1184 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/13018 ,  H01L2224/13076 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27001 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/9212 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/3841 ,  H01S5/02272 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3494 ,  H05K2203/041 ,  H05K2203/1476 ,  Y10T29/4913 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of mounting a semiconductor element, the method includes: attaching a first solder joint material onto a first pad formed on a substrate supplying a second solder joint material onto the first solder joint material, a second melting point of the second solder joint material being lower than a first melting point of the first solder joint material; arranging the semiconductor element so that a second pad formed on the semiconductor element faces the first pad and a joint gap is provided between the semiconductor element and the substrate; and performing reflow at a reflow temperature lower than the first melting point and higher than the second melting point to join the first solder joint material and the second solder joint material.