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    SOLDER BALL MOUNTING APPARATUS AND WIRING BOARD MANUFACTURING METHOD
    1.
    发明申请
    SOLDER BALL MOUNTING APPARATUS AND WIRING BOARD MANUFACTURING METHOD 审中-公开
    焊球安装设备和接线板制造方法

    公开(公告)号：US20090283574A1

    公开(公告)日：2009-11-19

    申请号：US12437998

    申请日：2009-05-08

    申请人： Ryuichi OKAZAKI ,  Ryosuke Kumagai ,  Takuya Hando ,  Hajime Okamoto ,  Motonobu Kurahashi

    发明人： Ryuichi OKAZAKI ,  Ryosuke Kumagai ,  Takuya Hando ,  Hajime Okamoto ,  Motonobu Kurahashi

    IPC分类号： B23K1/20 ,  B23K3/06

    CPC分类号： H05K3/3478 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11005 ,  H01L2224/742 ,  H01L2924/00014 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0485 ,  H05K2203/0557 ,  H01L2224/05599

    摘要： A wiring board includes an insulating layer having a plurality of through holes formed therein, a base substrate layer positioned below the insulating layer, and a plurality of electrodes disposed on the base substrate layer, each electrode having an exposed surface exposed from a respective through hole, each exposed surfaces being coated with a flux. A plurality of solder balls are disposed on the fluxes in the through holes, respectively. An apparatus for mounting the solder balls on the plurality of electrodes includes: a solder ball removing unit configured to remove a first plurality of solder balls located other than in the through holes; and a solder ball pressing unit configured to press a second plurality of solder balls individually disposed in the through holes towards respective electrodes and into respective flux.

    摘要翻译： 布线基板包括绝缘层，其中形成有多个通孔，位于绝缘层下方的基底层，以及设置在基底层上的多个电极，每个电极具有从相应通孔露出的暴露表面 每个暴露的表面都涂有助焊剂。 多个焊球分别设置在通孔中的焊剂上。 用于将焊球安装在多个电极上的装置包括：焊球去除单元，被配置为去除除通孔之外的第一多个焊球; 以及焊球压制单元，其被配置为将分别设置在所述通孔中的第二多个焊球朝向相应的电极按压，并且分别成为各自的焊剂。

    Wiring substrate and stiffener therefor
    4.
    发明授权
    Wiring substrate and stiffener therefor 失效
    接线基板和加强件

    公开(公告)号：US06391422B1

    公开(公告)日：2002-05-21

    申请号：US09579140

    申请日：2000-05-30

    申请人： Seiji Mori ,  Takuya Hando

    发明人： Seiji Mori ,  Takuya Hando

    IPC分类号： B32B302

    CPC分类号： H01L23/16 ,  H01L23/142 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49894 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  Y10S428/901 ,  Y10T428/24273 ,  Y10T428/31678 ,  Y10T428/31681

    摘要： A wiring substrate includes a wiring substrate body and a stiffener. The latter is formed from a rolled metallic sheet and is bonded to a first main surface of the wiring substrate body. The stiffener has a boundary profile, in a plan view, which is substantially identical to that of the wiring substrate body, and a first direction of the boundary profile of the stiffener or the wiring substrate body intersects the rolling direction of the stiffener at an angle. This construction reduces the amount of deformation of the wiring substrate produced by bonding of the stiffener to the wiring substrate body and/or caused by temperature variations experienced by the construction. Because of this reduction in deformation, the wiring substrate provides improved reliability with respect to connections made to an electronic component mounted thereon as well as improved reliability with respect to connections made to another printed wiring board.

    摘要翻译： 布线基板包括布线基板主体和加强件。 后者由轧制的金属板形成并且接合到布线基板主体的第一主表面。 加强件在平面图中具有与布线基板主体相同的边界轮廓，并且加强件或布线基板主体的边界轮廓的第一方向以一定角度与加强件的滚动方向相交 。 这种结构减小了通过将加强件接合到布线基板主体而产生的布线基板的变形量和/或由该结构所经历的温度变化引起的变形量。 由于这种变形的减小，布线基板相对于安装在其上的电子部件的连接提供了改进的可靠性以及相对于与另一印刷电路板的连接相比提高的可靠性。

    Multilayered wiring substrate
    6.
    发明授权
    Multilayered wiring substrate 失效
    多层布线基板

    公开(公告)号：US08581388B2

    公开(公告)日：2013-11-12

    申请号：US12976427

    申请日：2010-12-22

    申请人： Shinnosuke Maeda ,  Tetsuo Suzuki ,  Atsuhiko Sugimoto ,  Tatsuya Ito ,  Takuya Hando ,  Satoshi Hirano

    发明人： Shinnosuke Maeda ,  Tetsuo Suzuki ,  Atsuhiko Sugimoto ,  Tatsuya Ito ,  Takuya Hando ,  Satoshi Hirano

    IPC分类号： H01L23/053 ,  H01L21/4763

    CPC分类号： H05K3/3452 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/113 ,  H05K3/205 ,  H05K3/383 ,  H05K3/4682 ,  H05K2201/068 ,  H05K2201/094 ,  H05K2201/09527 ,  H05K2201/099 ,  H05K2203/0346 ,  H05K2203/0369 ,  H01L2924/00

    摘要： A multilayered wiring substrate, comprising: a plurality of first main surface side connecting terminals arranged in a first main surface of a stack structure; and a plurality of second main surface side connecting terminals being arranged in a second main surface of the stack structure; wherein a plurality of conductor layers are alternately formed in a plurality of stacked resin insulation layers and are operably connected to each other through via conductors tapered such that diameters thereof are widened toward the first or the second main surface, wherein a plurality of openings are formed in an exposed outermost resin insulation layer in the second main surface, and terminal outer surfaces of the second main surface side connecting terminals arranged to match with the plurality of the openings are positioned inwardly from an outer main surface of the exposed outermost resin insulation layer, and edges of terminal inner surfaces are rounded.

    摘要翻译： 一种多层布线基板，包括：布置在堆叠结构的第一主表面中的多个第一主表面侧连接端子; 并且多个第二主表面侧连接端子布置在所述堆叠结构的第二主表面中; 其中多个导体层交替地形成在多个堆叠的树脂绝缘层中，并且通过锥形的通孔导体可操作地连接，使得其直径朝向第一或第二主表面加宽，其中形成多个开口 在第二主表面中暴露的最外层树脂绝缘层中，并且布置成与多个开口相匹配的第二主表面侧连接端子的端子外表面从暴露的最外层树脂绝缘层的外主表面位于内侧， 并且端子内表面的边缘是圆形的。

    Multilayer wiring board
    7.
    发明授权
    Multilayer wiring board 有权
    多层接线板

    公开(公告)号：US09119333B2

    公开(公告)日：2015-08-25

    申请号：US13399547

    申请日：2012-02-17

    申请人： Takuya Hando ,  Masahiro Inoue ,  Hajime Saiki ,  Atsuhiko Sugimoto ,  Hidetoshi Wada

    发明人： Takuya Hando ,  Masahiro Inoue ,  Hajime Saiki ,  Atsuhiko Sugimoto ,  Hidetoshi Wada

    IPC分类号： H05K3/40 ,  H01L23/498 ,  H01L23/00 ,  H01L21/683 ,  H05K3/46 ,  H05K3/00

    CPC分类号： H05K3/4007 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/01084 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2201/0367

    摘要： A multilayer wiring board including a build-up layer, formed from one or more conductor and resin insulation layers that are layered one on top of the other, having conductive pads formed on a surface of at least one resin insulation layer so as to project from the surface are provided. The conductive pads may each include a columnar portion situated at a lower part thereof and a convex portion situated at a higher part thereof, wherein a surface of the convex portion may assume a continual curved shape. A solder layer may be formed over an upper surface of the conductive pads. Certain embodiments make it possible to minimize or eliminate the concentration of stress on the conductive pads, and may inhibit the occurrence of defective connections to a semiconductor element and infliction of damage to the conductive pads.

    摘要翻译： 一种多层布线基板，包括由一层或多层导体和树脂绝缘层形成的堆积层，所述导体和树脂绝缘层层叠在另一层之上，具有形成在至少一层树脂绝缘层的表面上的导电焊盘，以便从 提供表面。 导电垫可以各自包括位于其下部的柱状部分和位于其较高部分的凸部，其中凸部的表面可以呈现连续的弯曲形状。 可以在导电焊盘的上表面上形成焊料层。 某些实施例使得可以最小化或消除导电焊盘上的应力集中，并且可以抑制对半导体元件的不良连接的发生以及对导电焊盘的损坏。