公开(公告)号：US20190186841A1

公开(公告)日：2019-06-20

申请号：US16301047

申请日：2017-05-12

Applicant: SABIC Global Technologies B.V.

Inventor： Harindranath SHARMA ,  Anil TIWARI ,  Joseph ASLAN ,  Lashmikant POWALE

IPC: F28D15/04

CPC classification number: F28D15/043 ,  F28D2021/0029

Abstract: Various embodiments of the present invention relate to thermal management devices and methods of making the same. In various embodiments, the present disclosure provides a heat sink system (250, 252) including a heat sink (200, 253) having thermal wicks (214) and cooling structures (205). The thermal wicks (214) can extend from a heat source (48) at a first end (202) of the heat sink (200, 253) to a second end (204) and the cooling structure (205) can include at least one channel (246) configured to receive a thermal transport material positioned within the main body (201) of the heat sink (200, 253).