公开(公告)号：US20230141847A1

公开(公告)日：2023-05-11

申请号：US17916235

申请日：2021-04-01

Applicant: SABIC Global Technologies B.V.

Inventor： Soma GUHATHAKURTA ,  Theodorus Hoeks LAMBERTUS ,  Ramanarayanan Ganapathy Bhotla VENKATA ,  Donald OWENS ,  Pallavi Muchukunte BADARINATH

IPC: H10N30/85 ,  C08L27/16 ,  C08J5/18 ,  C08J3/215 ,  C08J3/00 ,  C08K3/22 ,  H10N30/30 ,  H10N30/092

CPC classification number: H10N30/852 ,  C08L27/16 ,  C08J5/18 ,  C08J3/215 ,  C08J3/005 ,  C08K3/22 ,  H10N30/302 ,  H10N30/092 ,  C08L2205/025 ,  C08L2203/20 ,  C08L2203/16 ,  C08J2327/16 ,  C08J2427/16 ,  C08J2469/00 ,  C08J2471/12 ,  C08K2201/001 ,  C08K2003/2237

Abstract: A polymer composite exhibiting piezoelectric properties can be formed for flexible and/or thin film applications, in which the polymer composite includes a polymer matrix and a piezoelectric ceramic filler embedded in the polymer matrix. The polymer matrix may include at least two polymers: a first polymer and a second polymer. The first polymer may be a fluorinated polymer, and the second polymer may be compatible with the first polymer and have a dielectric constant of less than approximately 20. The piezoelectric ceramic filler may be a lead-free ceramic filler, such as barium titanate, and be approximately 40-70% by volume of the polymer composite. The remaining 30-60% by volume may be the polymer matrix, which may itself be approximately 5-20% by weight second polymer and 80-95% fluorinated polymer.