公开(公告)号：US20140099870A1

公开(公告)日：2014-04-10

申请号：US13779841

申请日：2013-02-28

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： In Ho LEE ,  Ee Hyun An ,  Jun-Hee Lee ,  Sang-Hoon Back ,  Jung Kun Shin

IPC: B24B53/095 ,  B24B53/007

CPC classification number: B24B53/095 ,  B24B53/007 ,  B24B55/02

Abstract: A substrate grinding apparatus according to an exemplary embodiment of the present invention includes a grinding wheel grinding an object substrate, a nozzle unit spraying cooling water to the object substrate and the grinding wheel in a plurality of directions, and a cooling water controller connected to the nozzle unit and controlling spray speed and pressure of the cooling water, in which the nozzle unit includes a cleansing nozzle cleansing the grinding wheel, a cooling nozzle cooling the grinding wheel, and a surface protecting nozzle cooling the object substrate.

Abstract translation: 根据本发明的示例性实施例的基板研磨装置包括研磨对象基板的砂轮，将多个方向喷射到对象基板和砂轮的冷却水的喷嘴单元，以及连接到对象基板的冷却水控制器 喷嘴单元，并且控制冷却水的喷雾速度和压力，其中喷嘴单元包括清洁砂轮的清洁喷嘴，冷却砂轮的冷却喷嘴和冷却对象基板的表面保护喷嘴。