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23 条记录 (耗时 0.014 秒)

    BURNISHING TOOL AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    BURNISHING TOOL AND METHOD OF MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20180339398A1

    公开(公告)日：2018-11-29

    申请号：US15606348

    申请日：2017-05-26

    申请人： General Electric Company

    发明人： Kevin William Meyer

    IPC分类号： B24B53/095 ,  B24B39/02 ,  B24B49/08 ,  B24B55/04

    摘要： A burnishing tool and a method of additively manufacturing components of the burnishing tool are provided. The burnishing tool includes a burnishing element for burnishing a workpiece. The burnishing element is positioned between an upper nozzle and a lower nozzle which are additively manufactured to define a plurality of internal fluid passageways for receiving, distributing, and discharging a burnishing fluid to facilitate cooling and/or lubrication of the burnishing element and/or the workpiece.

    Polishing method
    2.
    发明申请
    Polishing method 审中-公开
    抛光方法

    公开(公告)号：US20050054267A1

    公开(公告)日：2005-03-10

    申请号：US10958248

    申请日：2004-10-06

    申请人： Yutaka Wada ,  Tomohiko Akatsuka ,  Tatsuya Sasaki

    发明人： Yutaka Wada ,  Tomohiko Akatsuka ,  Tatsuya Sasaki

    IPC分类号： B24B7/22 ,  B24B53/007 ,  B24B53/095 ,  H01L21/3105 ,  B24B49/00

    CPC分类号： B24B53/017 ,  B24B7/228 ,  B24B53/095 ,  H01L21/31053

    摘要： A wafer is pressed against a fixed abrasive and brought into sliding contact with the fixed abrasive. Thus, the wafer is polished. A surface of the fixed abrasive is dressed so as to generate free abrasive particles thereon. A liquid or a gas, composed of a mixture of liquid or inert gas and pure water or chemical liquid, is ejected onto the surface of the fixed abrasive during or after the dressing process.

    摘要翻译： 将晶片压靠固定的磨料并与固定的磨料滑动接触。 因此，晶片被抛光。 修整固定磨料的表面以在其上产生游离的磨料颗粒。 由液体或惰性气体与纯水或化学液体的混合物组成的液体或气体在修整过程中或之后被喷射到固定磨料的表面上。

    Method of increasing the service life of grinding wheels
    3.
    发明授权
    Method of increasing the service life of grinding wheels 失效
    增加砂轮使用寿命的方法

    公开(公告)号：US5961376A

    公开(公告)日：1999-10-05

    申请号：US008168

    申请日：1998-01-16

    申请人： Lutz Gottschald

    发明人： Lutz Gottschald

    IPC分类号： B24B9/14 ,  B24B53/007 ,  B24B53/095 ,  B24B1/00

    CPC分类号： B24B53/007 ,  B24B53/095 ,  B24B9/14

    摘要： To increase the service life of a grinding wheel which is intended for grinding the borders of spectacle lenses, wherein the wheel comprises a core wheel, preferably made of plastic, and a ring made of sintered metal with embedded diamond particles, a method comprising treating the grinding surface at least occasionally by a fluid jet under high pressure to clean the surface and keep it sharp. The cooling fluid used during grinding may be the fluid in the jet. It may be fed at lower pressure while higher pressure may be occasionally supplied.

    摘要翻译： 为了增加用于研磨眼镜镜片边缘的砂轮的使用寿命，其中轮包括优选由塑料制成的芯轮和由具有嵌入金刚石颗粒的烧结金属制成的环，包括将 研磨表面至少有时在高压下通过流体射流清洁表面并保持其锋利。 研磨过程中使用的冷却液可能是喷气中的流体。 它可以在较低压力下进料，而有时可能会提供更高的压力。

    PAD CONDITIONER AND METHOD
    5.
    发明申请
    PAD CONDITIONER AND METHOD 失效
    PAD调节器和方法

    公开(公告)号：US20110143640A1

    公开(公告)日：2011-06-16

    申请号：US12636644

    申请日：2009-12-11

    申请人： Rajeev Bajaj

    发明人： Rajeev Bajaj

    IPC分类号： B24B1/00 ,  B24B53/095 ,  B24B53/12

    CPC分类号： B24B53/017 ,  B23K26/3576 ,  B24B53/095

    摘要： A polishing pad conditioning apparatus includes a laser beam generating unit for providing a laser beam, a fluid delivery system for providing a fluid stream and a vacuum line for removing debris. The laser beam may directly impinge on a surface of a polishing pad thereby creating cutting action, while an atomized fluid stream provides cooling and pad debris along with fluid are removed thru the vacuum line. Alternatively, the laser beam may be combined with the atomized fluid stream in a region above the pad surface to substantially impart part of its energy to the fluid stream, generating high energy droplets which provide “cool” cutting action on the pad surface.

    摘要翻译： 抛光垫调节装置包括用于提供激光束的激光束产生单元，用于提供流体流的流体输送系统和用于去除碎屑的真空管线。 激光束可以直接冲击抛光垫的表面，从而产生切割作用，而雾化的流体流提供冷却和垫片碎屑以及流体通过真空管线被去除。 或者，激光束可以与垫表面上方的区域中的雾化流体流组合，以将其能量的一部分基本上赋予流体流，产生在焊盘表面上提供“冷”切割作用的高能量液滴。

    GRINDING METHOD, GRINDING DEVICE AND ELECTRODE THEREFOR
    6.
    发明申请
    GRINDING METHOD, GRINDING DEVICE AND ELECTRODE THEREFOR 审中-公开
    研磨方法，研磨装置及其电极

    公开(公告)号：US20090186558A1

    公开(公告)日：2009-07-23

    申请号：US12357959

    申请日：2009-01-22

    申请人： Ricardo Itiro ORI

    发明人： Ricardo Itiro ORI

    IPC分类号： B24B53/00 ,  B24B53/06 ,  B24B53/095 ,  B23H7/22 ,  B23H7/26

    CPC分类号： B24B53/001 ,  B24B53/06 ,  B24B53/095

    摘要： A grinding device including a multi-wheel grindstone and an electrode arranged opposite to a grinding action surface of the multi-wheel grindstone with an interval, in which a work is ground and machined while the grinding action surface of the multi-wheel grindstone is electrolytic-dressed by supplying conductive machining fluid between an electrode action surface of the electrode and the grinding action surface of the multi-wheel grindstone, and applying a voltage between the multi-wheel grindstone and the electrode, wherein the electrode has a laminate body in which electrode plates whose electrode action surfaces are arranged so as to oppose the grinding action surface of each of the grinding wheels are alternately sandwiched by a plurality of insulating plates; and a flow passage for distributing the machining fluid supplied to between the grinding action surface and the electrode action surface is formed at the electrode plate and the insulating plate.

    摘要翻译： 一种研磨装置，包括多轮磨石和电极，所述电极与所述多轮磨石的研磨作用面相对地间隔设置，所述间隔在所述多轮磨石的研磨作用面被电解的同时研磨和加工工件 通过在电极的电极作用表面和多轮磨石的研磨作用表面之间提供导电加工流体，并且在多轮磨石和电极之间施加电压，其中电极具有层压体，其中 电极作用面配置成与各研磨轮的研磨作用面相对配置的电极板被多个绝缘板交替夹持， 并且在电极板和绝缘板上形成用于分配供给到研磨作用面和电极作用面之间的加工液的流路。

    Method of and apparatus for dressing polishing cloth
    7.
    发明授权
    Method of and apparatus for dressing polishing cloth 失效
    抛光布的修整方法及装置

    公开(公告)号：US5857898A

    公开(公告)日：1999-01-12

    申请号：US974598

    申请日：1997-11-19

    申请人： Hirokuni Hiyama ,  Norio Kimura ,  Tomoyuki Yahiro

    发明人： Hirokuni Hiyama ,  Norio Kimura ,  Tomoyuki Yahiro

    IPC分类号： B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  B24B53/095 ,  B24B57/02 ,  H01L21/304 ,  B24B5/00 ,  B24B29/00

    CPC分类号： B24B53/017

    摘要： A polishing cloth is dressed between polishing processes each for polishing a workpiece such as a semiconductor wafer. The polishing cloth is dressed while supplying a dressing liquid such as water during a dressing process, and an abrasive liquid for polishing a workpiece is supplied to the polishing cloth for a predetermined period of time prior to a polishing process. The predetermined period of time may be present within the dressing process and immediately precedes the polishing process, and the dressing process may be carried out while supplying the abrasive liquid to the polishing cloth. Alternatively, the predetermined period of time may be present between the dressing process and the polishing process.

    摘要翻译： 在抛光工艺之间穿着抛光布，用于抛光诸如半导体晶片的工件。 在修整过程中，在提供诸如水的修整液的同时，对抛光布进行修整，并且在抛光处理之前将抛光工件的研磨液供给到抛光布预定的时间。 预定的时间段可以存在于修整过程中并且紧接在抛光过程之前，并且可以在将磨料液体供应到抛光布的同时进行修整过程。 或者，在修整处理和抛光处理之间可以存在预定时间段。

    Chemical-mechanical wafer polishing device
    8.
    发明授权
    Chemical-mechanical wafer polishing device 有权

    公开(公告)号：US10131031B2

    公开(公告)日：2018-11-20

    申请号：US15373053

    申请日：2016-12-08

    申请人： TSC Inc.

    发明人： Oh Su Kim ,  Byung Ho Kwon

    IPC分类号： B24B53/095 ,  B24B37/20

    摘要： Disclosed is a chemical-mechanical wafer polishing device having an elastic membrane including a circular action plate portion, a membrane circumferential wall portion extending from a circumferential edge of the action plate portion along a direction perpendicular to a plate surface, and a chamber formed between the action plate portion and the membrane circumferential wall portion. The membrane includes a cooling channel portion having an action plate bottom surface section, and a supply penetration section penetrating the action plate portion such that one end is connected to the action plate bottom surface section and the other end is exposed to the upper side of the action plate portion. The chemical-mechanical wafer polishing device includes a cooling fluid supply portion having a cooling fluid supply tube connected to a free end of the supply penetration section, and providing a cooling fluid to the cooling channel portion.

    CHEMICAL-MECHANICAL WAFER POLISHING DEVICE
    9.
    发明申请
    CHEMICAL-MECHANICAL WAFER POLISHING DEVICE 审中-公开

    公开(公告)号：US20170232574A1

    公开(公告)日：2017-08-17

    申请号：US15373053

    申请日：2016-12-08

    申请人： TSC Inc.

    发明人： Oh Su KIM ,  Byung Ho KWON

    IPC分类号： B24B37/20 ,  B24B53/095

    CPC分类号： B24B37/20 ,  B24B53/095

    摘要： Disclosed is a chemical-mechanical wafer polishing device having an elastic membrane including a circular action plate portion, a membrane circumferential wall portion extending from a circumferential edge of the action plate portion along a direction perpendicular to a plate surface, and a chamber formed between the action plate portion and the membrane circumferential wall portion. The membrane includes a cooling channel portion having an action plate bottom surface section, and a supply penetration section penetrating the action plate portion such that one end is connected to the action plate bottom surface section and the other end is exposed to the upper side of the action plate portion. The chemical-mechanical wafer polishing device includes a cooling fluid supply portion having a cooling fluid supply tube connected to a free end of the supply penetration section, and providing a cooling fluid to the cooling channel portion.