公开(公告)号：US20240181599A1

公开(公告)日：2024-06-06

申请号：US18061650

申请日：2022-12-05

申请人： Alex Lee

发明人： Alex Lee

IPC分类号： B24B55/02 ,  B05B17/06 ,  B24B3/36 ,  B24B53/007

CPC分类号： B24B55/02 ,  B05B17/0607 ,  B24B3/36 ,  B24B53/007

摘要： A water atomizing unit that affixes to a blade sharpening device to cool, lubricate and clean the blade and sharpening disc. The unit pumps atomized water vertically downward and funnels the atomized fluid into a linear spray. The length and shape of the linear spray pattern is set by an elliptical array of bristles affixed to the bottom of the funnel. The spray deposits the clean water uniformly onto the blade and disc, keeping the blade temperature uniform across its length and width. The elliptical bristle array allows atomized water droplets to condense onto the bristles so as to define an elliptical ring of larger dripping water drops. The unit uses ultrasonic atomization in which the water is crushed and torn into small droplets by the energy of ultrasonic oscillation. The ultrasonic atomization is accomplished by a single piezo ultrasonic atomization device powered by a USB configured DC power supply.

公开(公告)号：US09610673B2

公开(公告)日：2017-04-04

申请号：US14160928

申请日：2014-01-22

申请人： EBARA CORPORATION

发明人： Tsuneo Torikoshi

IPC分类号： B24B49/18 ,  B24B53/017 ,  B24B53/007 ,  B24B37/005 ,  B24B37/013 ,  B24B37/04 ,  B24B37/34 ,  B24B27/00

CPC分类号： B24B37/042 ,  B24B27/0023 ,  B24B37/005 ,  B24B37/013 ,  B24B37/345 ,  B24B49/18 ,  B24B53/007 ,  B24B53/017

摘要： A polishing method is used for polishing a surface of a substrate such as a semiconductor wafer. The polishing method includes a polishing process for polishing a surface of the substrate in accordance with a preset polishing recipe, a pad cleaning process for removing foreign matters on the polishing pad by ejecting a cleaning fluid onto the polishing pad, and a substrate transferring process in which the polished substrate is removed from the top ring at a substrate transferring position, a subsequent substrate to be polished is loaded onto the top ring, and then the top ring holding the subsequent substrate to be polished is returned to the polishing table. The pad cleaning process is started after the completion of the polishing recipe is detected, and the pad cleaning process is terminated by detecting a position of the subsequent substrate to be polished which is undergoing the substrate transferring process.

公开(公告)号：US20150290766A1

公开(公告)日：2015-10-15

申请号：US14682661

申请日：2015-04-09

申请人： Ebara Corporation

发明人： Mitsunori SUGIYAMA ,  Masafumi INOUE

IPC分类号： B24B53/007

CPC分类号： B24B53/007

摘要： The CMP apparatus is provided with a polishing unit 3; a cleaning unit 4; a load/unload unit for transferring substrates to the polishing unit 3 and receiving substrates from the cleaning unit 4; a wafer transporting unit; and a control section 5 for controlling the timing of loading wafers into the CMP apparatus. The control section 5 creates a time table correlating treatment ending times or scheduled treatment ending times in polishing sections, cleaning sections and transporting sections for each plurality of wafers to be loaded into the CMP apparatus and controls the timing of loading the plurality of wafers into the CMP apparatus on the basis of the time table, so that a standby state does not occur in a period from when the wafers are loaded into the CMP apparatus to when cleaning treatment is completed.

摘要翻译： CMP装置设置有抛光单元3; 清洁单元4; 用于将基板传送到抛光单元3并从清洁单元4接收基板的装载/卸载单元; 晶片输送单元; 以及控制部分5，用于控制将晶片装载到CMP装置中的定时。 控制部分5创建将要装载到CMP装置中的每个多个晶片的抛光部分，清洁部分和传送部分中的处理结束时间或预定处理结束时间相关联的时间表，并且控制将多个晶片装载到 CMP装置，使得在将晶片装载到CMP装置中到清洁处理完成之间的时间段内不发生待机状态。

公开(公告)号：US20150283670A1

公开(公告)日：2015-10-08

申请号：US14662491

申请日：2015-03-19

申请人： DISCO CORPORATION

发明人： Takahiko Tsuno

IPC分类号： B24B53/007 ,  B08B9/093 ,  B24D7/18

CPC分类号： B24B53/007 ,  B08B1/007 ,  B08B3/02 ,  B08B9/00 ,  B08B9/093 ,  B24D7/18

摘要： A grinding wheel includes an annular base and a plurality of abrasive members fixed to the lower surface of the base and arranged annularly. The base has a plurality of through holes for discharging a grinding water. The plural through holes radially extend from the inner side surface to the outer side surface of the base. The plural through holes are arranged at given intervals in the circumferential direction of the base so that the grinding water is scattered in different directions from the through holes.

摘要翻译： 砂轮包括环形基座和固定到基座的下表面并且环形布置的多个研磨构件。 底座具有用于排出研磨水的多个通孔。 多个通孔从基部的内侧面向外侧面径向延伸。 多个通孔在基座的圆周方向上以给定的间隔布置，使得研磨水在与通孔不同的方向上散射。

公开(公告)号：US08893734B2

公开(公告)日：2014-11-25

申请号：US13116560

申请日：2011-05-26

申请人： Scott S. McLain

发明人： Scott S. McLain

IPC分类号： B08B3/02 ,  B08B1/00 ,  B24B53/007 ,  B24D13/00

CPC分类号： B24B53/007 ,  B08B1/00 ,  B08B1/007 ,  B24D13/00

摘要： A cleaning apparatus for a power driven buffing pad includes a wash plate mounted in a cleaning solution reservoir that provides agitating and cleaning contact with the pad mounted on an operating driver. The wash plate can be reciprocated vertically by the operator against a biasing arrangement to operate a pump to deliver cleaning solution from the reservoir to the face of the pad in contact with the wash plate.

摘要翻译： 用于动力驱动抛光垫的清洁装置包括安装在清洁溶液储存器中的洗涤板，其提供与安装在操作驱动器上的垫的搅拌和清洁接触。 洗涤板可以由操作者垂直地抵靠偏压装置往复运动，以操作泵以将清洁溶液从储存器输送到与洗涤板接触的垫的表面。

公开(公告)号：US20120298148A1

公开(公告)日：2012-11-29

申请号：US13116560

申请日：2011-05-26

申请人： Scott S. McLain

发明人： Scott S. McLain

IPC分类号： B08B3/00

CPC分类号： B24B53/007 ,  B08B1/00 ,  B08B1/007 ,  B24D13/00

摘要： A cleaning apparatus for a power driven buffing pad includes a wash plate mounted in a cleaning solution reservoir that provides agitating and cleaning contact with the pad mounted on an operating driver. The wash plate can be reciprocated vertically by the operator against a biasing arrangement to operate a pump to deliver cleaning solution from the reservoir to the face of the pad in contact with the wash plate.

摘要翻译： 用于动力驱动抛光垫的清洁装置包括安装在清洁溶液储存器中的洗涤板，其提供与安装在操作驱动器上的垫的搅拌和清洁接触。 洗涤板可以由操作者垂直地抵靠偏压装置往复运动，以操作泵以将清洁溶液从储存器输送到与洗涤板接触的垫的表面。

公开(公告)号：US20120220205A1

公开(公告)日：2012-08-30

申请号：US13393774

申请日：2010-08-31

申请人： Jianhui Wu ,  Richard W. J. Hall ,  Eric M. Schulz ,  Srinivasan Ramanath

发明人： Jianhui Wu ,  Richard W. J. Hall ,  Eric M. Schulz ,  Srinivasan Ramanath

IPC分类号： B24B53/017 ,  B32B18/00

CPC分类号： B24B53/007

摘要： A chemical mechanical polishing (CMP) conditioner includes a ceramic substrate having a major surface, and an abrasive coating overlying the major surface. The major surface can include micro-protrusions arranged in a curved pattern. Alternatively, the micro-protrusions can be arranged in an irregular pattern.

摘要翻译： 化学机械抛光（CMP）调理剂包括具有主表面的陶瓷基材和覆盖主表面的研磨涂层。 主表面可以包括以弯曲图案布置的微突起。 或者，微突起可以以不规则图案排列。

公开(公告)号：US20070275642A1

公开(公告)日：2007-11-29

申请号：US11730737

申请日：2007-04-03

申请人： Mitsuo Oota ,  Toshiyuki Yasuda ,  Makoto Yuitou ,  Kouichi Kobayashi

发明人： Mitsuo Oota ,  Toshiyuki Yasuda ,  Makoto Yuitou ,  Kouichi Kobayashi

IPC分类号： B24B55/02

CPC分类号： B24B53/007 ,  B24B9/00 ,  B24B15/02 ,  B24B33/025 ,  B24B55/02

摘要： A work having a portion to be ground, such as a tapered surface, is ground by a grinder driven by a driving device. During grinding operation, coolant is supplied to a grinding surface of the grinder and the portion to be ground. After the grinding operation is completed, the coolant is continued to be supplied for removing sludge on the grinder while the grinder is leaving the work and returning to its original position. The coolant may be pressurized to a higher level when it is supplied for removing the sludge than when it is supplied during the grinding operation. The number of works that have been already ground may be counted, and the coolant for removing the sludge may be supplied only when the number of works exceeds a predetermined number. Alternatively, the sludge is removed by brushing when the number of works does not reach the predetermined number.

摘要翻译： 具有被研磨部分的工件，例如锥形表面，由驱动装置驱动的研磨机研磨。 在研磨操作期间，将冷却剂供应到研磨机的研磨表面和待研磨部分。 在研磨操作完成之后，继续供应冷却剂以在研磨机离开工作并返回其原始位置时除去研磨机上的污泥。 当提供用于除去污泥的冷却剂比在研磨操作期间供应时，其可以被加压到更高的水平。 可以计算已经研磨的作品的数量，并且仅当作品的数量超过预定数量时可以提供用于除去污泥的冷却剂。 或者，当工件数量未达到预定数量时，通过刷洗除去污泥。

公开(公告)号：US07131185B2

公开(公告)日：2006-11-07

申请号：US11082964

申请日：2005-03-18

申请人： Shigemi Kato ,  Hideo Kawamura

发明人： Shigemi Kato ,  Hideo Kawamura

IPC分类号： G11B5/127 ,  B24B1/00

CPC分类号： G11B5/84 ,  B24B53/007 ,  Y10T29/49044 ,  Y10T29/49046 ,  Y10T29/49048 ,  Y10T29/4905 ,  Y10T29/4906

摘要： A method for manufacturing a magnetic recording medium, including the steps of applying a magnetic coating containing ferromagnetic powder and a binder onto a nonmagnetic band-shaped flexible base material to be transferred to form a magnetic layer, and grinding the magnetic layer continuously with a grinding wheel on the downstream side of transfer, wherein a cleaning device which cleans a grindstone of the grinding wheel is additionally provided in close proximity of the grinding wheel to clean the grindstone during the grinding operation.

摘要翻译： 一种制造磁记录介质的方法，包括以下步骤：将含有铁磁粉末和粘合剂的磁性涂层施加到要转移的非磁性带状柔性基材上以形成磁性层，并用研磨剂连续研磨该磁性层 在转移的下游侧的轮，其中清洁砂轮磨石的清洁装置另外设置在砂轮的紧邻处，以在研磨操作期间清洁磨石。

公开(公告)号：US20050148285A1

公开(公告)日：2005-07-07

申请号：US10986176

申请日：2004-11-12

申请人： Takashi Hosoda

发明人： Takashi Hosoda

IPC分类号： G02C13/00 ,  B08B1/00 ,  B08B1/04 ,  B08B3/04 ,  B08B7/02 ,  B08B7/04 ,  B24B13/00 ,  B24B53/007 ,  B24B49/00

CPC分类号： G02C13/006 ,  B08B1/007 ,  B08B1/04 ,  B08B7/02 ,  B24B13/00 ,  B24B53/007

摘要： A self-cleaning step for cleaning an elastic abrasive body 231 itself by pressing the rotating elastic abrasive body 231 against a pressing member 221 to deform the elastic body 231 while supplying slurry L containing abrasive to the elastic abrasive body 231 so as to clean the elastic abrasive body 231 is added to a scrub cleaning step in which a plastic optical component 1 is rotated and the rotating elastic abrasive body 231 is pressed against a surface of the plastic optical component 1 while supplying slurry L containing abrasive between the surface of the plastic optical component 1 and the elastic abrasive body 231 so as to clean the plastic optical component 1.

摘要翻译： 用于通过将旋转的弹性研磨体231压靠在按压部件221上以使弹性体231变形同时向弹性研磨体231供给含有研磨剂的浆料L以清洁弹性研磨体231自身的自清洁步骤 研磨体231被添加到擦洗清洁步骤中，其中塑料光学部件1旋转，并且旋转的弹性研磨体231被压靠在塑料光学部件1的表面上，同时在塑料光学部件1的表面之间提供含有磨料的浆料L 组件1和弹性研磨体231，以便清洁塑料光学部件1。