Apparatus and method of treating substrate
    1.
    发明授权
    Apparatus and method of treating substrate 有权
    底物处理装置及方法

    公开(公告)号:US09266186B2

    公开(公告)日:2016-02-23

    申请号:US13714738

    申请日:2012-12-14

    CPC classification number: B23K10/00 H01J37/32091 H01J37/32137 H01J37/32532

    Abstract: A substrate-treating apparatus includes a process chamber including a space therein, a lower electrode which is in the space of the process chamber and supports the substrate, an upper electrode which faces the lower electrode in the process chamber, a high frequency supply line which includes a feed point which applies a high frequency power to the lower electrode, and a modulator which asymmetrically supplies a dielectric substance to a lower portion of the lower electrode with reference to a center portion of the lower electrode.

    Abstract translation: 基板处理装置包括其中包括空间的处理室,位于处理室的空间中并支撑基板的下电极,与处理室中的下电极相对的上电极,高频电源线, 包括向下部电极施加高频电力的馈电点,以及相对于下部电极的中心部分将介电物质非对称地供给到下部电极的下部的调制器。

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