公开(公告)号：US20210245488A1

公开(公告)日：2021-08-12

申请号：US17093940

申请日：2020-11-10

Applicant: SAMSUNG DISPLAY CO., LTD ,  JASTECH, LTD.

Inventor： OHJUNE KWON ,  Juchan Kang ,  Dongun Jin ,  Yumhyun Hwang

IPC: B32B38/00 ,  B32B37/10

Abstract: A display module manufacturing apparatus includes a stage on which a display module is disposed, a heater disposed on the stage, and configured to heat a first area of the display module, and wherein the heater includes a plurality of side surfaces and a contact surface, and a first bump controller detachably coupled to one side surface among the plurality of side surfaces and including a first bottom surface facing an upper surface of the stage. The contact surface is closer to the upper surface of the stage than the first bottom surface.

公开(公告)号：US11691407B2

公开(公告)日：2023-07-04

申请号：US17093940

申请日：2020-11-10

Applicant: SAMSUNG DISPLAY CO., LTD. ,  JASTECH, LTD.

Inventor： Ohjune Kwon ,  Juchan Kang ,  Dongun Jin ,  Yumhyun Hwang

IPC: B32B38/00 ,  B32B37/10 ,  G06F1/16 ,  G02B1/14

CPC classification number: B32B38/004 ,  B32B37/1018 ,  B32B2457/20 ,  G02B1/14 ,  G06F1/1607 ,  G06F1/1652

Abstract: A display module manufacturing apparatus includes a stage on which a display module is disposed, a heater disposed on the stage, and configured to heat a first area of the display module, and wherein the heater includes a plurality of side surfaces and a contact surface, and a first bump controller detachably coupled to one side surface among the plurality of side surfaces and including a first bottom surface facing an upper surface of the stage. The contact surface is closer to the upper surface of the stage than the first bottom surface.