Multilayer ceramic electronic component

    公开(公告)号:US11094468B2

    公开(公告)日:2021-08-17

    申请号:US16255077

    申请日:2019-01-23

    Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers disposed therebetween to be exposed to first and second external surfaces of the ceramic body, and first and second external electrodes disposed on the first and second external surfaces of the ceramic body and connected to corresponding internal electrodes, among the first and second internal electrodes, respectively. The dielectric layer includes a portion, disposed between the first and second external electrodes, having a thickness of 3.5 micrometers or more to 3.7 micrometers or less.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    7.
    发明申请

    公开(公告)号:US20200152388A1

    公开(公告)日:2020-05-14

    申请号:US16255077

    申请日:2019-01-23

    Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers disposed therebetween to be exposed to first and second external surfaces of the ceramic body, and first and second external electrodes disposed on the first and second external surfaces of the ceramic body and connected to corresponding internal electrodes, among the first and second internal electrodes, respectively. The dielectric layer includes a portion, disposed between the first and second external electrodes, having a thickness of 3.5 micrometers or more to 3.7 micrometers or less.

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