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公开(公告)号：US11037733B2
公开(公告)日：2021-06-15
申请号：US16561372
申请日：2019-09-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ho In Jun , Sun Cheol Lee , Kyeong Jun Kim
Abstract: A multilayer ceramic capacitor includes a ceramic body including a plurality of dielectric layers stacked therein in a stacking direction; first and second external electrodes disposed externally on the ceramic body; first and second internal electrodes alternately stacked with the plurality of dielectric layers, forming an internal active layer of the ceramic body, and respectively connected to the first and second external electrodes; a dummy layer, including a conductive material and having a mesh shape, disposed in at least one of an upper cover layer or a lower cover layer respectively disposed above or below the internal active layer of the ceramic body in the stacking direction.
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公开(公告)号：US10658115B1
公开(公告)日：2020-05-19
申请号：US16277454
申请日：2019-02-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hye Won Ryoo , Ji Hong Jo , Ho In Jun , Seok Keun Ahn , Ji Hye Yu , A Reum Jun , Gi Seok Jeong , Seon Young Yoo
Abstract: A method for manufacturing a capacitor component includes an operation of sintering under a moderately-or-more reducing atmosphere for hydrogen, a body in which a plurality of dielectric layers having internal electrodes printed thereon are laminated; a first reoxidation operation of subjecting the sintered body to a first reoxidation heat treatment under an oxidizing atmosphere; and a second reoxidation operation of subjecting the body having undergone the first reoxidation heat treatment to a second reoxidation heat treatment under an oxidizing atmosphere.
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公开(公告)号：US11657966B2
公开(公告)日：2023-05-23
申请号：US17338124
申请日：2021-06-03
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kyeong Jun Kim , Ho In Jun , Seul Gi Kim , Jin Sung Chun , Jun Ho Yun
Abstract: A multilayer electronic component includes: a body including first and second dielectric layers alternately disposed in a first direction; and external electrodes disposed on opposing end surfaces, respectively. A first internal electrode exposed to a first end surface and a first dummy pattern spaced apart from the first internal electrode and exposed to a second end surface are disposed on the first dielectric layer. A second internal electrode exposed to the second end surface and a second dummy pattern spaced apart from the second internal electrode and exposed to the first end surface are disposed on the second dielectric layer. The first and second internal electrodes include first and second main portions, respectively, and the first main portion and the second main portion are arranged in a staggered manner in a width direction.
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公开(公告)号：US11062847B2
公开(公告)日：2021-07-13
申请号：US16848107
申请日：2020-04-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hye Won Ryoo , Ji Hong Jo , Ho In Jun , Seok Keun Ahn , Ji Hye Yu , A Reum Jun , Gi Seok Jeong , Seon Young Yoo
Abstract: A method for manufacturing a capacitor component includes an operation of sintering under a moderately-or-more reducing atmosphere for hydrogen, a body in which a plurality of dielectric layers having internal electrodes printed thereon are laminated,; a first reoxidation operation of subjecting the sintered body to a first reoxidation heat treatment under an oxidizing atmosphere; and a second reoxidation operation of subjecting the body having undergone the first reoxidation heat treatment to a second reoxidation heat treatment under an oxidizing atmosphere.
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公开(公告)号：US20210057153A1
公开(公告)日：2021-02-25
申请号：US16776610
申请日：2020-01-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ho In Jun , Kyeong Jun Kim , Jin Sung Chun , Woo Chul Shin , Seul Gi Kim
Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.
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Patent Agency Ranking
公开(公告)号：US12224123B2
公开(公告)日：2025-02-11
申请号：US18084075
申请日：2022-12-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ho In Jun , Kyeong Jun Kim , Mi Kyeong Kim , Eon Ju Noh , Hye Won Ryoo
Abstract: A multilayer electronic component includes: a body including a plurality of dielectric layers and internal electrodes disposed to face each other with each of the plurality of dielectric layers interposed therebetween; and external electrodes connected to the internal electrodes and disposed on outer surfaces of the body, wherein each of the plurality of dielectric layers includes a BaTiO3-based base material main component and an accessory component including dysprosium (Dy) and terbium (Tb), a content of terbium (Tb) is 0.2 mol or more and less than 1.0 mol based on 100 mol of the base material main component, and the dielectric layer includes a plurality of dielectric crystal grains having a particle size of 60 nm or more and 250 nm or less at a point (D50) at which a cumulative volume is 50% in a cumulative particle size distribution according to a particle size distribution system.
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公开(公告)号：US20230335337A1
公开(公告)日：2023-10-19
申请号：US18211707
申请日：2023-06-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ho In Jun , Kyeong Jun Kim , Jin Sung Chun , Woo Chul Shin , Seul Gi Kim
Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.
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公开(公告)号：US20230230768A1
公开(公告)日：2023-07-20
申请号：US18084075
申请日：2022-12-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ho In Jun , Kyeong Jun Kim , Mi Kyeong Kim , Eon Ju Noh , Hye Won Ryoo
CPC classification number: H01G4/1227 , C04B35/4682 , H01G4/008 , H01G4/30 , H01G4/248 , H01G4/2325 , C04B2235/3224 , C04B2235/3236
Abstract: A multilayer electronic component includes: a body including a plurality of dielectric layers and internal electrodes disposed to face each other with each of the plurality of dielectric layers interposed therebetween; and external electrodes connected to the internal electrodes and disposed on outer surfaces of the body, wherein each of the plurality of dielectric layers includes a BaTiO3-based base material main component and an accessory component including dysprosium (Dy) and terbium (Tb), a content of terbium (Tb) is 0.2 mol or more and less than 1.0 mol based on 100 mol of the base material main component, and the dielectric layer includes a plurality of dielectric crystal grains having a particle size of 60 nm or more and 250 nm or less at a point (D50) at which a cumulative volume is 50% in a cumulative particle size distribution according to a particle size distribution system.
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公开(公告)号：US11605502B2
公开(公告)日：2023-03-14
申请号：US17330024
申请日：2021-05-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hye Sung Pyo , Ho In Jun , Ki Hun Jeon , Do Hyun Hong
IPC: H01G4/005
Abstract: A multilayer electronic component includes a body including a dielectric layer and a plurality of internal electrodes laminated with the dielectric layer interposed therebetween; and an external electrode disposed on the body and connected to the plurality of internal electrodes. The plurality of internal electrodes includes two or more internal electrodes having different thicknesses, a most thick internal electrode having a greatest thickness and a least thick internal electrode having a lowest thickness among the plurality of internal electrodes are disposed on first and second outermost sides opposing each other in a lamination direction of the plurality of internal electrodes. Each internal electrode disposed between the most thick internal electrode and the least thick internal electrode has a thickness the same as or greater than a thickness of an adjacent internal electrode, which is adjacent to that internal electrode in the lamination direction toward the second outermost side.
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公开(公告)号：US11017953B2
公开(公告)日：2021-05-25
申请号：US16943463
申请日：2020-07-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kyeong Jun Kim , Jang Hyun Lee , Hae Suk Chung , Do Lee , Byung Sung Kang , Ho In Jun
Abstract: A multilayer ceramic electronic component includes: a ceramic body having a dielectric layer, and a plurality of first and second internal electrodes facing each other with the dielectric layer interposed therebetween; and first and second external electrodes disposed on an outer surface of the ceramic body, respectively. The ceramic body includes an active portion including a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween to form capacitance, and cover portions formed on upper and lower portions of the active portion. A buffer region is disposed between at least one pair of first and second internal electrodes among the plurality of first and second internal electrodes disposed inside the active portion, and satisfies the relation 0
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