公开(公告)号：US20240355547A1

公开(公告)日：2024-10-24

申请号：US18230854

申请日：2023-08-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seok Hyun YOON ,  Hyung Soon KWON ,  In Ho JEON ,  Byung Ho LEE ,  Mi Yang KIM

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1227

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body, wherein the dielectric layer includes a rare earth element, a secondary phase of the rare earth element and a dielectric grain, wherein, when an average thickness of the dielectric layer is defined as td and a maximum size of the dielectric layer of a secondary phase of the rare earth element in the thickness direction is defined as D, the dielectric layer includes two or more secondary phases of a rare earth element satisfying D/td≤0.2.