公开(公告)号：US20200381179A1

公开(公告)日：2020-12-03

申请号：US16574618

申请日：2019-09-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seok Hyun YOON ,  Mi Yang KIM ,  Jin Woo KIM ,  Dong Hun KIM ,  Jung Deok PARK

IPC: H01G4/12 ,  C04B35/26 ,  C04B35/468 ,  C04B35/48 ,  C04B35/14

Abstract: A dielectric ceramic composition and a multilayer ceramic electronic component are provided, the dielectric ceramic composition includes a barium titanate base material main component and a subcomponent, a microstructure after sintering includes a first crystal grain including 3 or less domain boundaries and a second crystal grain including 4 or more domain boundaries, and an area ratio of the second crystal grain to the total crystal grains is 20% or less.

公开(公告)号：US20240153705A1

公开(公告)日：2024-05-09

申请号：US18242833

申请日：2023-09-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： In Ho JEON ,  Seok Hyun YOON ,  Jin Woo KIM ,  Byung Kil YUN ,  Bon Hyeong KOO ,  Min Jung JANG ,  Mi Yang KIM

IPC: H01G4/12 ,  H01G4/008 ,  H01G4/012 ,  H01G4/30

CPC classification number: H01G4/1227 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/30

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode disposed alternately with the dielectric layer; and an external electrode disposed on the body, wherein the dielectric layer includes a first region extending from an interfacial surface with the internal electrode to 50 nm of the dielectric layer in an inward direction and a second region excluding the first region, and wherein, in the first region, an average content of In based on overall elements excluding oxygen is 0.5 at % or more and 2.0 at % or less, and an average content of Sn based on overall elements excluding oxygen is 0.5 at % or more and 1.75 at % or less.

公开(公告)号：US20140174193A1

公开(公告)日：2014-06-26

申请号：US13772481

申请日：2013-02-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Gyu Seok KIM ,  Hee Suk CHUNG ,  Hyun Jung LEE ,  Suk-Jin HAM ,  Ju Wan NAM ,  Jin Uk CHA ,  Mi Yang KIM

IPC: G01N3/08

CPC classification number: G01N19/04 ,  G01N1/286 ,  G01N2203/0023 ,  G01N2203/0298

Abstract: There are provided a method, an apparatus and a sample for evaluating bonding strength, the method including setting a micro-region including a bonded interface in an evaculated sample, forming a first groove in a circumferential portion of the micro-region to have a predetermined depth, processing a side of the micro-region to form a second groove connected to the bonded interface, and applying pressure on the micro-region to measure a critical point at which a delamination of the micro-region is generated.

Abstract translation: 提供了用于评估接合强度的方法，装置和样品，所述方法包括将包括接合界面的微区域设置在抽空样品中，在微区域的周向部分中形成第一槽以具有预定的 深度处理微区域的一侧以形成连接到接合界面的第二凹槽，并且在微区域上施加压力以测量产生微区域分层的临界点。

公开(公告)号：US20140152980A1

公开(公告)日：2014-06-05

申请号：US13772491

申请日：2013-02-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Gyu Seok KIM ,  Hee Suk CHUNG ,  Suk Jin HAM ,  Dong Yong KIM ,  Yong Choon PARK ,  Mi Yang KIM ,  Tae Yoon KIM

IPC: G01N1/28

CPC classification number: G01N1/28 ,  G01M99/002 ,  G01N3/60 ,  G01N2203/0023 ,  G01N2203/0282 ,  G01N2203/0647

Abstract: There are provided an inspection device for substrate deformation at high temperatures and an inspection method for substrate deformation at high temperatures, the inspection device for substrate deformation at high temperatures, including a crucible including an internal space, an inspection hole disposed in an upper portion thereof so as to inspect the internal space, and a heating unit heating the internal space, an indenter tip disposed in the crucible such that a substrate fixed to the internal space is warped, and an inspection unit disposed above the crucible so as to inspect a cross-section of the substrate.

Abstract translation: 在高温下设置基板变形检查装置和高温基板变形检查方法，高温基板变形检查装置，包括内部空间的坩埚，设置在其上部的检查孔 检查内部空间，加热单元加热内部空间，设置在坩埚中的压头，使得固定在内部空间的基板翘曲;以及检查单元，其设置在坩埚上方，以检查十字 切片的底物。

公开(公告)号：US20140138611A1

公开(公告)日：2014-05-22

申请号：US13782864

申请日：2013-03-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hee Suk CHUNG ,  Gyu Seok KIM ,  Han Wool KANG ,  Kyung Ho LEE ,  Mi Yang KIM ,  Suk Jin HAM

IPC: H01L21/02 ,  H01L29/06

CPC classification number: H01L29/0676 ,  B82Y10/00 ,  B82Y40/00 ,  H01L21/0254 ,  H01L21/02603 ,  H01L21/02614 ,  H01L29/66469 ,  H01L29/775 ,  H01L33/18

Abstract: There is provided an In nanowire including a substrate, an indium thin film formed on the substrate, an insulating film formed on the indium thin film and having at least one through hole through formation of a pattern, and an In nanowire vertically protruded from the indium thin film through the at least one through hole.

Abstract translation: 提供了一种In纳米线，其包括基板，形成在基板上的铟薄膜，形成在铟薄膜上并具有通过形成图案的至少一个通孔的绝缘膜，以及从铟垂直地突出的In纳米线 薄膜通过至少一个通孔。

公开(公告)号：US20240355547A1

公开(公告)日：2024-10-24

申请号：US18230854

申请日：2023-08-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seok Hyun YOON ,  Hyung Soon KWON ,  In Ho JEON ,  Byung Ho LEE ,  Mi Yang KIM

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1227

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body, wherein the dielectric layer includes a rare earth element, a secondary phase of the rare earth element and a dielectric grain, wherein, when an average thickness of the dielectric layer is defined as td and a maximum size of the dielectric layer of a secondary phase of the rare earth element in the thickness direction is defined as D, the dielectric layer includes two or more secondary phases of a rare earth element satisfying D/td≤0.2.

公开(公告)号：US20150253909A1

公开(公告)日：2015-09-10

申请号：US14341096

申请日：2014-07-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Gyu Seok KIM ,  Hee Suk CHUNG ,  Dong Yong KIM ,  Dek Gin YANG ,  Mi Yang KIM ,  Tae Young KIM

IPC: G06F3/047

CPC classification number: G06F3/047

Abstract: Embodiments of the invention provide a touch sensor including a base substrate, and an electrode pattern formed on the base substrate. The electrode pattern is formed by continuously connecting one or more unit patterns, and each unit pattern has closed figures formed to be irregularly arranged therein.

Abstract translation: 本发明的实施例提供一种触摸传感器，其包括基底基板和形成在基底基板上的电极图案。 电极图案通过连续地连接一个或多个单元图案而形成，并且每个单元图案具有形成为不规则地布置在其中的封闭图形。