公开(公告)号：US20190122808A1

公开(公告)日：2019-04-25

申请号：US16029346

申请日：2018-07-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Hui JO ,  Hye Won JUNG ,  Sa Yong LEE

IPC: H01F27/28 ,  H01F27/29

Abstract: A coil electronic component includes a body having a multilayer structure formed by stacking a plurality of sheets and external electrodes disposed on outer surfaces of the body. A coil pattern is printed on each of the plurality of sheets. The coil pattern includes a coil body and a corner pattern spaced apart from the coil pattern and coupled to the external electrodes. An inner edge of the second coil pattern facing the coil body is formed as a curved line or a linear line.

公开(公告)号：US20170301453A1

公开(公告)日：2017-10-19

申请号：US15232325

申请日：2016-08-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Hui JO ,  Han LEE ,  Mi Sun HWANG ,  Jeong Min CHO ,  Myung Sam KANG ,  Seok Hwan AHN ,  Tae Hoon KIM

IPC: H01F27/28 ,  H01F27/29 ,  H01F41/04

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F27/292 ,  H01F41/041 ,  H01F2027/2809

Abstract: A coil electronic component includes a body portion and an external electrode. The body portion includes a coil layer and a reinforcing layer disposed on at least one of an upper portion and a lower portion of the coil layer. The external electrode is disposed on an outer surface of the body portion. The coil layer includes an insulating layer, a coil pattern, and a first conductivity type via penetrating through the insulating layer to be connected to the coil pattern, and the reinforcing layer has a higher degree of rigidity than the insulating layer.