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    PRINTED CIRCUIT BOARD
    5.
    发明申请
    PRINTED CIRCUIT BOARD 有权

    公开(公告)号：US20220104345A1

    公开(公告)日：2022-03-31

    申请号：US17117307

    申请日：2020-12-10

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Ga Young YOO ,  Mi Sun HWANG ,  Jun Hyeong JANG

    IPC: H05K1/02 ,  H05K1/11

    Abstract: A printed circuit board includes: an insulating layer; and a first circuit layer disposed on an upper surface of the insulating layer. A lower surface of the first circuit layer is in contact with at least a portion of the insulating layer, and the first circuit layer includes a first region embedded in the insulating layer, and a second region protruding from the upper surface of the insulating layer.

    PRINTED CIRCUIT BOARD
    7.
    发明申请
    PRINTED CIRCUIT BOARD 审中-公开
    印刷电路板

    公开(公告)号：US20150136446A1

    公开(公告)日：2015-05-21

    申请号：US14213282

    申请日：2014-03-14

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Joung Gul RYU ,  Sung Taek LIM ,  Mi Sun HWANG

    IPC: H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K1/09 ,  H05K1/11

    CPC classification number: H05K1/0271 ,  H05K1/0366 ,  H05K3/445 ,  H05K3/4688

    Abstract: Embodiments of the invention provide a printed circuit board having a structure in which a plurality of insulating layers having a metal wiring formed on one surface thereof are stacked, wherein a metal layer is interposed in the insulating layers, in order to improve warpage property of the board.

    Abstract translation: 本发明的实施例提供了一种印刷电路板，其结构是在其一个表面上堆叠形成有金属布线的多个绝缘层，其中在绝缘层中插入有金属层，以提高绝缘层的翘曲性能 板。

    METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
    8.
    发明申请
    METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD 审中-公开
    制造印刷电路板的方法

    公开(公告)号：US20140090245A1

    公开(公告)日：2014-04-03

    申请号：US14099714

    申请日：2013-12-06

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Mi Sun HWANG ,  Myung Sam KANG ,  Ok Tae KIM ,  Seon Ha Kang ,  Gil Yong SHIN ,  Kil Yong YUN ,  Min Jung CHO

    IPC: H05K3/46

    CPC classification number: H05K3/4685 ,  H05K3/0097 ,  H05K3/205 ,  H05K3/421 ,  H05K2201/0376 ,  H05K2203/0152 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

    Abstract: In accordance with various embodiments, there is provided a method of manufacturing a printed circuit board, the method including the steps of preparing a first carrier including a first pattern formed on one side thereof, preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof, pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates, attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other, and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.

    Abstract translation: 根据各种实施例，提供一种制造印刷电路板的方法，所述方法包括以下步骤：制备包括在其一侧上形成的第一图案的第一载体，制备第二载体，所述第二载体包括第一阻焊层和 第二图案顺序地形成在其一侧上，按压第一载体和第二载体，使得第一图案嵌入绝缘层的一侧，并且第二图案嵌入绝缘层的另一侧，然后移除第一图案 载体和第二载体以制造两个基板，使用粘合层将两个基板彼此附接，使得第一阻焊层彼此面对，并且形成用于将绝缘层中的第一图案与第二图案连接的通孔， 在设置有第一图案的绝缘层上形成第二阻焊剂，然后除去粘合层。

    INDUCTOR AND MANUFACTURING METHOD THEREOF
    9.
    发明申请
    INDUCTOR AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20190318867A1

    公开(公告)日：2019-10-17

    申请号：US16206582

    申请日：2018-11-30

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sa Yong LEE ,  Mi Sun HWANG

    IPC: H01F27/32 ,  H01F27/29 ,  H01F41/12 ,  H01F5/06

    Abstract: An inductor includes a body in which a plurality of insulating layers on which a plurality of coil patterns are arranged are stacked, and first and second external electrodes disposed inside the body, wherein the plurality of coil patterns are connected by coil connecting portions and form a coil in which opposing ends thereof are connected to the first and second external electrodes, and the first and second external electrodes are directly connected to the opposing ends of the plurality of coil patterns inside the body.

    MULTILAYER CAPACITOR AND MANUFACTURING METHOD THEREOF
    10.
    发明申请
    MULTILAYER CAPACITOR AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20180090273A1

    公开(公告)日：2018-03-29

    申请号：US15481157

    申请日：2017-04-06

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Mi Sun HWANG ,  Myung Sam KANG ,  Dong Keun LEE

    IPC: H01G4/248 ,  H01G4/30 ,  H01G4/012

    CPC classification number: H01G4/248 ,  H01G4/012 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/1236 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30 ,  H01G4/308 ,  Y02E60/13

    Abstract: A multilayer capacitor includes a body including dielectric layers and first and second internal electrodes alternately disposed with dielectric layers interposed therebetween. First and second external electrodes are on the body and connected to the first and second internal electrodes, respectively. The first and second internal electrodes are plating layers. A manufacturing method of a multilayer capacitor includes preparing a plurality of laminated sheets including internal electrodes, dummy electrodes, and dielectric layers. The plurality of laminated sheets, and covers on and below the laminated sheets, are simultaneously stacked and then cured to prepare a cured product. The cured product is then diced depending on the size of the capacitor to prepare a body where the internal electrodes and the dummy electrodes are partially exposed. External electrodes are formed on external surfaces of the body using the dummy electrodes as seeds in a plating method.

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