公开(公告)号：US20140226254A1

公开(公告)日：2014-08-14

申请号：US13871796

申请日：2013-04-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ho KIM ,  Kyung Jin CHOI ,  Young Sik CHOI ,  Ji Hwan KIM ,  Dae Yu KIM ,  Ro Woon LEE

IPC: H01G4/30 ,  H01G13/00 ,  H01G4/008

CPC classification number: H01G4/30 ,  H01G4/0085 ,  H01G4/1227

Abstract: There are provided a conductive paste composition, a multilayer ceramic capacitor using the same, and a manufacturing method thereof. The conductive paste composition includes a conductive metal powder; a ceramic powder; and a resin, wherein the conductive paste composition has a theoretical density of 6 g/cm3 or higher and a relative density of 95% or more.

Abstract translation: 提供导电糊剂组合物，使用其的多层陶瓷电容器及其制造方法。 导电糊组合物包含导电金属粉末; 陶瓷粉 和树脂，其中导电糊组合物的理论密度为6g / cm 3以上，相对密度为95％以上。