公开(公告)号：US20140177133A1

公开(公告)日：2014-06-26

申请号：US13846299

申请日：2013-03-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ro Woon LEE ,  Young Ho KIM ,  Kyung Jin CHOI ,  Yoon Hee LEE ,  Ki Chun YANG

IPC: H01G4/12

CPC classification number: H01G4/1209 ,  H01G4/012 ,  H01G4/30

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body including dielectric layer; and first and second internal electrodes formed inside the ceramic body and disposed to face each other with the dielectric layer interposed therebetween, wherein, on a cross section of the ceramic body taken in length-thickness (L-T) directions thereof, a secondary phase material is formed at interfaces between the first and second internal electrodes and the dielectric layers, and a ratio of an area occupied by the secondary phase material to an overall area of the ceramic body is 0.1% to 0.5%.

Abstract translation: 提供了一种多层陶瓷电子部件，其包括：包括电介质层的陶瓷体; 以及第一和第二内部电极，其形成在所述陶瓷体内部并且彼此相对地设置，其间插入有所述电介质层，其中，在所述陶瓷体的沿其长度方向（LT）方向截取的截面上，第二相材料为 形成在第一和第二内部电极和电介质层之间的界面处，并且第二相材料占据的面积与陶瓷体的总面积的比率为0.1％至0.5％。

公开(公告)号：US20140226254A1

公开(公告)日：2014-08-14

申请号：US13871796

申请日：2013-04-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ho KIM ,  Kyung Jin CHOI ,  Young Sik CHOI ,  Ji Hwan KIM ,  Dae Yu KIM ,  Ro Woon LEE

IPC: H01G4/30 ,  H01G13/00 ,  H01G4/008

CPC classification number: H01G4/30 ,  H01G4/0085 ,  H01G4/1227

Abstract: There are provided a conductive paste composition, a multilayer ceramic capacitor using the same, and a manufacturing method thereof. The conductive paste composition includes a conductive metal powder; a ceramic powder; and a resin, wherein the conductive paste composition has a theoretical density of 6 g/cm3 or higher and a relative density of 95% or more.

Abstract translation: 提供导电糊剂组合物，使用其的多层陶瓷电容器及其制造方法。 导电糊组合物包含导电金属粉末; 陶瓷粉 和树脂，其中导电糊组合物的理论密度为6g / cm 3以上，相对密度为95％以上。