公开(公告)号：US20200075252A1

公开(公告)日：2020-03-05

申请号：US16164237

申请日：2018-10-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Je Jung KIM ,  Do Young JEONG ,  Dong Hwi SHIN ,  Sang Soo PARK ,  Woo Chul SHIN

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/232 ,  H01G4/008

Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween; and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, wherein the external electrodes including, respectively, electrode layers electrically connected to the internal electrodes, respectively, and conductive resin layers disposed on the electrode layers, respectively.

公开(公告)号：US20200043663A1

公开(公告)日：2020-02-06

申请号：US16272066

申请日：2019-02-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Je Jung KIM ,  Do Young JEONG ,  Do Yeon KIM

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232

Abstract: A multilayer capacitor includes a capacitor body including an active region, and upper and lower cover regions disposed on upper and lower portions of the active region, respectively. First and second external electrode are disposed on both ends of the capacitor body, respectively. The active region includes a plurality of first dielectric layers, first and second internal electrodes alternately disposed with the first dielectric layer interposed therebetween, and first and second auxiliary electrodes disposed on the first dielectric layers on which the first and second internal electrodes are disposed, respectively. The upper and lower cover regions each include a plurality of second dielectric layers having a thickness less than that of each of the first dielectric layers, and a dummy electrode disposed on the second dielectric layers.

公开(公告)号：US20180082933A1

公开(公告)日：2018-03-22

申请号：US15469709

申请日：2017-03-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Ho KO ,  Dae Hee LEE ,  Bong Soo KIM ,  Myeong Ho HONG ,  Do Young JEONG ,  Joon Seok OH

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49816 ,  H01L23/3171 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/14 ,  H01L2224/02373 ,  H01L2224/0401 ,  H01L2224/12105

Abstract: A fan-out semiconductor package includes a first connection member having a through-hole, a semiconductor chip disposed in the through-hole, a first encapsulant encapsulating at least portions of the first connection member and the semiconductor chip, a second connection member disposed on the first connection member and the semiconductor chip. The first connection member and the second connection member respectively include redistribution layers electrically connected to the connection pads of the semiconductor chip. The fan-out semiconductor package may have excellent rigidity, may be thinned, and may be manufactured in a simplified process.

公开(公告)号：US20220165497A1

公开(公告)日：2022-05-26

申请号：US17379456

申请日：2021-07-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Eun Hee JEONG ,  Do Young JEONG ,  Dong Hwi SHIN ,  Hyung Duk YUN

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/248 ,  H01G4/008

Abstract: A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes; a first external electrode including a first electrode layer connected to the first internal electrodes, a first conductive resin layer on the first electrode layer, and a first plating layer on the first conductive resin layer, and including a first connection portion on a third surface of the body and a first band portion extending on first and second surfaces of the body; and a second external electrode connected to the second internal electrodes. L2-L1 is greater than 10 μm in which L1 is a distance from the third surface to a distal end of the first conductive resin layer in the first band portion, and L2 is a distance from the third surface to a distal end of the first plating layer in the first band portion.

公开(公告)号：US20200350122A1

公开(公告)日：2020-11-05

申请号：US16933068

申请日：2020-07-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Yeon KIM ,  Je Jung KIM ,  Do Young JEONG

IPC: H01G4/012 ,  H01G4/232 ,  H01G4/30

Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and first and second internal electrodes alternately exposed to first and second outer surfaces with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second outer surfaces of the ceramic body so as to be connected to the first and second internal electrodes, respectively. The ceramic body further includes a protective layer including a protective layer dummy electrode disposed on at least one of upper and lower portions of the first and second internal electrodes, and the protective layer dummy electrode has a thickness ranging from greater than to 1.2 times or less a thickness of each of the first and second internal electrodes.

公开(公告)号：US20220208468A1

公开(公告)日：2022-06-30

申请号：US17471382

申请日：2021-09-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Young JEONG ,  Ga Young AN

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/008

Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode disposed to be alternately stacked with the dielectric layer interposed therebetween; a first external electrode including a first electrode layer, a first conductive layer, and a first metal layer; a second external electrode including a second electrode layer, a second conductive layer, and a second metal layer; and a protective layer disposed on the ceramic body, the first electrode layer, and the second electrode layer, wherein a sum of through areas of the through portions disposed on the first electrode layer and the second electrode layer among the protective layers may be 50% or more of a sum of surface areas of the first electrode layer and the second electrode layer.

公开(公告)号：US20220139627A1

公开(公告)日：2022-05-05

申请号：US17574087

申请日：2022-01-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Je Jung KIM ,  Do Young JEONG ,  Eun Hee JEONG ,  Min Hyang KIM

IPC: H01G4/232 ,  H01G4/012 ,  H01G4/30 ,  H01G4/248 ,  H01G4/12

Abstract: A multilayer ceramic electronic component includes a ceramic body including pluralities of first and second internal electrodes alternately disposed to face each other with respective dielectric layers interposed therebetween. First and second external electrodes are disposed on external surfaces of the ceramic body and are respectively electrically connected to the first and second external electrodes. A first dummy electrode is disposed in a margin portion of the ceramic body adjacent the first internal electrode in a third direction, and a second dummy electrode is disposed in a margin portion of the ceramic body adjacent the second internal electrode in the third direction. A distance (Ld) between the first and second dummy electrodes in a second direction, and a length (Lm) of each margin portion between one of the first and second internal electrodes and an external surface of the ceramic body in the second direction, satisfy Ld≤Lm.

公开(公告)号：US20230215627A1

公开(公告)日：2023-07-06

申请号：US17981851

申请日：2022-11-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Young JEONG ,  Jin Mo AHN ,  Ji Hong JO

IPC: H01G2/10 ,  H01G4/30 ,  H01G4/248 ,  H01G4/008

CPC classification number: H01G2/10 ,  H01G4/30 ,  H01G4/248 ,  H01G4/008

Abstract: A multilayer electronic component may include a cover layer disposed on a first surface of a body and extending onto a first band portion of a first external electrode and a second band portion of a second external electrode, in which the cover layer includes an insulating portion disposed between the first external electrode and the second external electrode and including an insulating material, a first conductive portion connected to the insulating portion and disposed on the first band portion, and a second conductive portion connected to the insulating portion and disposed on the second band portion, and the first and second conductive portions include a conductive metal and a resin.

公开(公告)号：US20200118748A1

公开(公告)日：2020-04-16

申请号：US16200643

申请日：2018-11-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Yeon KIM ,  Je Jung KIM ,  Do Young JEONG

IPC: H01G4/012 ,  H01G4/30 ,  H01G4/232

Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and first and second internal electrodes alternately exposed to first and second outer surfaces with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second outer surfaces of the ceramic body so as to be connected to the first and second internal electrodes, respectively. The ceramic body further includes a protective layer including a protective layer dummy electrode disposed on at least one of upper and lower portions of the first and second internal electrodes, and the protective layer dummy electrode has a thickness ranging from greater than to 1.2 times or less a thickness of each of the first and second internal electrodes.