公开(公告)号：US20190019757A1

公开(公告)日：2019-01-17

申请号：US15819541

申请日：2017-11-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ji Hyun LEE ,  Jin Gu KIM ,  Chang Bae LEE ,  Jin Su KIM

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/00

Abstract: A fan-out semiconductor package includes: a semiconductor chip; an encapsulant encapsulating at least portions of the semiconductor chip; and a first connection member disposed on the semiconductor chip and including a first redistribution layer electrically connected to the connection pads and a second redistribution layer electrically connected to the connection pads and disposed on the first redistribution layer. The first redistribution layer includes a first pattern having a plurality of degassing holes, the second redistribution layer includes a second pattern having a first line portion having a first line width and a second line portion connected to the first line portion and having a second line width greater than the first line width, and the second line portion overlaps at least one of the plurality of degassing holes when being projected in a direction perpendicular to the active surface.

公开(公告)号：US20180197827A1

公开(公告)日：2018-07-12

申请号：US15913270

申请日：2018-03-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ji Hyun LEE ,  Kyoung Moo HARR ,  Seung Yeop KOOK ,  Ji Hoon KIM ,  Young Gwan KO

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/538 ,  H01L23/31

CPC classification number: H01L23/562 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3135 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/18162 ,  H01L2924/3025 ,  H01L2924/3511

Abstract: The present disclosure relates to a fan-out semiconductor package including a frame having a through hole, a semiconductor chip disposed in the through hole, a first encapsulant disposed in a space between the frame and the semiconductor chip, a second encapsulant disposed on one sides of the frame and the semiconductor chip, and a redistribution layer disposed on the other sides of the frame and the semiconductor chip, and a method of manufacturing the same. The first encapsulant and the second encapsulant may include different materials.

公开(公告)号：US20170141063A1

公开(公告)日：2017-05-18

申请号：US15183292

申请日：2016-06-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ji Hyun LEE ,  Sung Won JEONG ,  Ha Young AHN ,  Shang Hoon SEO ,  Seung Yeop KOOK

IPC: H01L23/00 ,  H01L23/48 ,  H01L23/31

CPC classification number: H01L24/14 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/06 ,  H01L2224/0237 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05111 ,  H01L2224/05116 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/12105 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13023 ,  H01L2224/13024 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/145 ,  H01L2924/186 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/3512

Abstract: An electronic component package includes an electronic component, a redistribution layer electrically connected to the electronic component and having terminal connection pads, a passivation layer disposed on one side of the redistribution layer and having openings exposing at least portions of the terminal connection pads, and connection terminals disposed in the openings of the passivation layer and connected to the terminal connection pads. At least one of the openings of the passivation layer has a plurality of protrusion parts.

公开(公告)号：US20250125097A1

公开(公告)日：2025-04-17

申请号：US18775131

申请日：2024-07-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jong Hoon YOO ,  Ji Hyun LEE ,  Dong Geon YOO ,  Eun Hye CHO

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes, the body having a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction, and a fifth surface and a sixth surface opposing each other in a third direction, an external electrode including a lower electrode layer, the lower electrode layer disposed between extension lines of the first and second surfaces, an upper electrode layer disposed on the lower electrode layer, the upper electrode layer disposed to extend onto a portion of the first and the second surfaces, and a glass layer disposed between the lower and upper electrode layers. The lower electrode layer includes Ag and a first glass. The upper electrode layer includes Cu and a second glass.

公开(公告)号：US20180226350A1

公开(公告)日：2018-08-09

申请号：US15689659

申请日：2017-08-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ji Hyun LEE ,  Hyoung Joon KIM ,  Kyoung Moo HARR

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/5389 ,  H01L23/3114 ,  H01L23/5383 ,  H01L23/5386 ,  H01L24/20 ,  H01L2224/214 ,  H01L2924/19041 ,  H01L2924/19106

Abstract: A fan-out semiconductor package includes: a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a connection member disposed on the active surface of the semiconductor chip. The connection member includes a plurality of insulating layers, a plurality of redistribution layers disposed on the plurality of insulating layers, respectively, and a plurality of via layers penetrating through the plurality of insulating layers, respectively, and at least two of the plurality of insulating layers or at least two of the plurality of via layers have different thicknesses.

公开(公告)号：US20170271272A1

公开(公告)日：2017-09-21

申请号：US15352100

申请日：2016-11-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ji Hyun LEE ,  Kyoung Moo HARR ,  Seung Yeop KOOK ,  Ji Hoon KIM ,  Young Gwan KO

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/538 ,  H01L23/31

CPC classification number: H01L23/562 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3135 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/18162 ,  H01L2924/3025 ,  H01L2924/3511

Abstract: The present disclosure relates to a fan-out semiconductor package including a frame having a through hole, a semiconductor chip disposed in the through hole, a first encapsulant disposed in a space between the frame and the semiconductor chip, a second encapsulant disposed on one sides of the frame and the semiconductor chip, and a redistribution layer disposed on the other sides of the frame and the semiconductor chip, and a method of manufacturing the same. The first encapsulant and the second encapsulant may include different materials.

公开(公告)号：US20250132093A1

公开(公告)日：2025-04-24

申请号：US18781000

申请日：2024-07-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jong Hoon YOO ,  Ji Hyun LEE ,  Dong Geon YOO ,  Eun Hye CHO

IPC: H01G4/232 ,  H01G4/008 ,  H01G4/12 ,  H01G4/30

Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, and a plating layer disposed on the electrode layer, wherein the electrode layer includes a connection electrode layer including copper (Cu) and glass, and a band electrode layer including silver (Ag) and glass, and the external electrode further includes a conductive resin layer disposed between the band electrode layer and the plating layer and including a conductive metal and a resin.

公开(公告)号：US20210166881A1

公开(公告)日：2021-06-03

申请号：US16877902

申请日：2020-05-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dong Hun KIM ,  Hyun Min LEE ,  Jong Suk JEONG ,  Dong Geon YOO ,  Ji Hyun LEE ,  Seok Hyun YOON

IPC: H01G4/30 ,  H01G4/012

Abstract: A multilayer ceramic capacitor includes a ceramic body including a dielectric layer, a plurality of first and second internal electrodes disposed inside the ceramic body, exposed to the first and second surfaces, and having ends exposed to the third or fourth surface, and a first side margin portion and a second side margin portion disposed on side portions of the plurality of first and second internal electrodes exposed to the first and second surfaces. A ratio Db/Da satisfies 1.00 to 1.07, inclusive, where ‘Db’ is a distance, in a stacking direction of the dielectric layer, between both end points of respective edge regions of the first side margin portion and the second side margin portion, and ‘Da’ is a distance in a central region of the ceramic body in the stacking direction.

公开(公告)号：US20170358548A1

公开(公告)日：2017-12-14

申请号：US15670711

申请日：2017-08-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ji Hyun LEE ,  Sung Won JEONG ,  Ha Young AHN ,  Shang Hoon SEO ,  Seung Yeop KOOK

IPC: H01L23/00 ,  H01L23/48 ,  H01L23/31

CPC classification number: H01L24/14 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/06 ,  H01L2224/0237 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05111 ,  H01L2224/05116 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/12105 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13023 ,  H01L2224/13024 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/145 ,  H01L2924/186 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/3512

Abstract: An electronic component package includes an electronic component, a redistribution layer electrically connected to the electronic component and having terminal connection pads, a passivation layer disposed on one side of the redistribution layer and having openings exposing at least portions of the terminal connection pads, and connection terminals disposed in the openings of the passivation layer and connected to the terminal connection pads. At least one of the openings of the passivation layer has a plurality of protrusion parts.