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公开(公告)号：US12224127B2
公开(公告)日：2025-02-11
申请号：US17973132
申请日：2022-10-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chung Yeol Lee , Yoo Jeong Lee , Hyung Jong Choi , Kwang Yeun Won , So Jung An , Woo Kyung Sung , Kang Ha Lee , Myung Jun Park , Jong Ho Lee , Jun Hyeong Kim
Abstract: An electronic component includes a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a first connection portion on the third surface and a first band portion on the first surface; a second external electrode including a second connection portion on the fourth surface and a second band portion on the first surface; an insulating layer on the second surface and the first and second connection portions; and a plating layer on the first and second band portions. The plating layer extends onto the first and second connection portions and is in contact with the insulating layer. A thickness of an end of the insulating layer decreases toward the plating layer. An end of the plating layer includes a first region between the insulating layer and the first or second connection portion and a second region covering the insulating layer.
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公开(公告)号：US12080480B2
公开(公告)日：2024-09-03
申请号：US17888909
申请日：2022-08-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dae Hee Lee , Soo Jeong Jo , Kang Ha Lee , Yoon A Park , Jin Woo Chun , Berm Ha Cha , Myung Jun Park , Jong Ho Lee
CPC classification number: H01G4/0085 , H01G4/30
Abstract: A multilayer capacitor includes a body including a dielectric layer and a plurality of internal electrodes stacked on one another with the dielectric layer interposed therebetween, and external electrodes disposed externally on the body, and each connected to the plurality of internal electrodes, wherein at least one of the plurality of internal electrodes includes an alloy region formed in a region in contact with a corresponding external electrode of the external electrodes, and the alloy region includes a nickel (Ni)-chromium (Cr) alloy.
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公开(公告)号：US20250140474A1
公开(公告)日：2025-05-01
申请号：US18911956
申请日：2024-10-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Min Kim , Bum Suk Kang , Hyun Hee Gu , Kang Ha Lee , Chung Eun Lee
Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer, an external electrode disposed on the body and connected to the internal electrode, and a region containing Ni, Al and Cu. The internal electrode includes Ni, and the external electrode contains Al and Cu.
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公开(公告)号：US20250125095A1
公开(公告)日：2025-04-17
申请号：US18816559
申请日：2024-08-27
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seung Ah Kim , Chae Dong Lee , Gyu Ho Yeon , Kang Ha Lee
Abstract: A multilayer electronic component includes a body containing a dielectric layer and an internal electrode alternately disposed with the dielectric layer, and an external electrode disposed on the body and connected to the internal electrode. The external electrode includes a conductive resin layer including metal particles, core-shell particles including a polymer core and a metal shell disposed on at least a portion of the polymer core, and a resin. The conductive resin layer includes a first region adjacent to the body and a second region adjacent to an outside of the conductive resin layer. In at least one cross section passing through the body, an area fraction occupied by the core-shell particles in the second region is greater than an area fraction occupied by the core-shell particles in the first region.
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Patent Agency Ranking
公开(公告)号：US12170170B2
公开(公告)日：2024-12-17
申请号：US17523198
申请日：2021-11-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jun Hyeong Kim , Myung Jun Park , Jin Soo Park , Yeon Song Kang , Eun Jin Kim , Kyu Sik Park , Kang Ha Lee
Abstract: A multilayer electronic component, includes: a body including a dielectric layer, and first and second internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween; a first connection portion including a first conductive layer disposed on the third surface and connected to the first internal electrode, and a first insulating layer disposed on the first conductive layer; a second connection portion including a second conductive layer disposed on the fourth surface and connected to the second internal electrode, and a second insulating layer disposed on the second conductive layer; a first external electrode including a first electrode layer connected to the first conductive layer, wherein the first external electrode is disposed on any one of the first, second, fifth, and sixth surfaces; and a second external electrode including a second electrode layer connected to the second conductive layer.
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公开(公告)号：US12112892B2
公开(公告)日：2024-10-08
申请号：US17943606
申请日：2022-09-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyung Jong Choi , Yoo Jeong Lee , Chung Yeol Lee , Kwang Yeun Won , So Jung An , Kang Ha Lee , Woo Kyung Sung , Myung Jun Park , Jong Ho Lee
CPC classification number: H01G4/224 , H01G4/2325 , H01G4/248 , H01G4/30
Abstract: A multilayer electronic component includes a body including a dielectric layer and a first internal electrode and a second internal electrode and having first to sixth surfaces, a first external electrode including a first connection portion on the third surface, a first band portion on the first surface, and a third band portion on the second surface, a second external electrode including a second connection portion on the fourth surface, a second band portion on the first surface, and a fourth band portion on the second surface, an insulating layer disposed on the second surface and extending onto the first and second connection portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion. The insulating layer includes glass, and a region disposed on the second surface in the insulating layer has a convex shape in the first direction.
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公开(公告)号：US20230215647A1
公开(公告)日：2023-07-06
申请号：US17954099
申请日：2022-09-27
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yoo Jeong Lee , Chung Yeol Lee , Hyung Jong Choi , Kwang Yeun Won , So Jung An , Kang Ha Lee , Woo Kyung Sung , Myung Jun Park , Jong Ho Lee
Abstract: A multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately disposed with respective dielectric layers interposed therebetween; a first external electrode including a first connection portion, and first and second band portions extending from the first connection portion; a second external electrode including a second connection portion, and second and fourth band portions extending from the second connection portion; an insulating layer disposed to extend to a portion on the first and second connection portions; a first plating layer disposed on the first band portion and disposed to extend to be in contact with the insulating layer; and a second plating layer disposed on the second band portion and disposed to extend to be in contact with the insulating layer. An average thickness of the first or second plating layer is smaller than an average thickness of the insulating layer.
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公开(公告)号：US20230215643A1
公开(公告)日：2023-07-06
申请号：US17973132
申请日：2022-10-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chung Yeol Lee , Yoo Jeong Lee , Hyung Jong Choi , Kwang Yeun Won , So Jung An , Woo Kyung Sung , Kang Ha Lee , Myung Jun Park , Jong Ho Lee , Jun Hyeong Kim
CPC classification number: H01G4/2325 , H01G4/30 , H01G4/012
Abstract: An electronic component includes a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a first connection portion on the third surface and a first band portion on the first surface; a second external electrode including a second connection portion on the fourth surface and a second band portion on the first surface; an insulating layer on the second surface and the first and second connection portions; and a plating layer on the first and second band portions. The plating layer extends onto the first and second connection portions and is in contact with the insulating layer. A thickness of an end of the insulating layer decreases toward the plating layer. An end of the plating layer includes a first region between the insulating layer and the first or second connection portion and a second region covering the insulating layer.
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公开(公告)号：US20230187138A1
公开(公告)日：2023-06-15
申请号：US17969962
申请日：2022-10-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Soo Park , Jong Ho Lee , Kang Ha Lee , Yoon A Park , Eui Hyun Jo , Myung Jun Park , Hyun Hee Gu , Woo Kyung Sung
CPC classification number: H01G4/2325 , H01G4/30
Abstract: A ceramic electronic component, includes: a body including a dielectric layer and first and second internal electrodes, the body having first and second surfaces, third and fourth surfaces, and fifth and sixth surfaces; a first external electrode disposed on the first surface, and extending onto a portion of each of the third to sixth surfaces; a second external electrode disposed on the second surface, and extending onto a portion of each of the third to sixth surfaces, wherein, in at least one of cross-sections in first and second directions or in first and third directions, in at least one of the first and second external electrodes, a maximum thickness in a peripheral portion of the first and second surfaces is greater than a maximum thickness in a center portion, and a maximum thickness in a center portion is greater than a maximum thickness in a corner portion.
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