公开(公告)号：US20240057251A1

公开(公告)日：2024-02-15

申请号：US18113834

申请日：2023-02-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Hong Min ,  Eun Su Kwon

IPC: H05K1/02

CPC classification number: H05K1/0296 ,  H05K2201/10227 ,  H05K2201/10984

Abstract: A printed circuit board includes a first insulating layer, a first pattern buried in a surface of the first insulating layer, the first pattern having a surface exposed from the surface of the first insulating layer, and a metal post disposed on the exposed surface of the first pattern. The metal post includes a first metal layer and a second metal layer. The first metal layer and the second metal layer include different metals.

公开(公告)号：US12262467B2

公开(公告)日：2025-03-25

申请号：US18113834

申请日：2023-02-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Hong Min ,  Eun Su Kwon

IPC: H05K1/02

Abstract: A printed circuit board includes a first insulating layer, a first pattern buried in a surface of the first insulating layer, the first pattern having a surface exposed from the surface of the first insulating layer, and a metal post disposed on the exposed surface of the first pattern. The metal post includes a first metal layer and a second metal layer. The first metal layer and the second metal layer include different metals.