公开(公告)号：US12108533B2

公开(公告)日：2024-10-01

申请号：US17855032

申请日：2022-06-30

申请人： Avary Holding (Shenzhen) Co., Ltd. ,  QingDing Precision Electronics(Huai'an) Co., Ltd. ,  Garuda Technology Co., Ltd.

发明人： Zhi Guo ,  Chen Xiong ,  Po-Yuan Chen

IPC分类号： H05K1/18 ,  H05K3/32

CPC分类号： H05K1/183 ,  H05K3/321 ,  H05K2201/10984

摘要： A method for manufacturing a circuit board includes disposing an electronic component in a recess formed in a first circuit substrate, and bonding a second circuit substrate to the first circuit substrate to form a third circuit substrate with the electronic component embedded. The method includes forming an opening in the third circuit substrate to expose the electronic component and an inner surface of the third circuit substrate. The method includes disposing an insulation case in the opening. The insulation case has a first segment directly contacting the electronic component, a second segment facing the inner surface, an inner wall between the first and second segments, a first chamber surrounded by the first segment and the inner wall, and a second chamber surrounded by the second segment and the inner wall. The method includes adding a heat-exchanging fluid into the first chamber.

公开(公告)号：US20240215162A1

公开(公告)日：2024-06-27

申请号：US18543994

申请日：2023-12-18

申请人： Micron Technology, Inc.

发明人： Shriram Harihara Subramanian

IPC分类号： H05K1/11 ,  H01L29/78

CPC分类号： H05K1/111 ,  H01L29/783 ,  H01L2924/13091 ,  H05K2201/10984

摘要： A printed circuit board (PCB) land pad for a three-pin metal-oxide-semiconductor field-effect transistor (MOSFET) component comprises four pads with a split pad for a drain terminal of the MOSFET component. The PCB land pad comprises: a first pad to connect a gate terminal of the MOSFET component to a PCB; a second pad to connect a source terminal of the MOSFET component to the PCB; a third pad corresponding to connect a drain terminal of the MOSFET component to the PCB; and a fourth pad to connect the drain terminal of the MOSFET component to the PCB.

公开(公告)号：US20240147622A1

公开(公告)日：2024-05-02

申请号：US18118217

申请日：2023-03-07

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Sang Yoon LEE ,  Seung Eun LEE

IPC分类号： H05K1/14 ,  H05K1/02 ,  H05K1/18

CPC分类号： H05K1/14 ,  H05K1/0298 ,  H05K1/144 ,  H05K1/185 ,  H05K2201/041 ,  H05K2201/10015 ,  H05K2201/10984 ,  H05K2201/2081

摘要： A printed circuit board includes a first core portion in which a first passive component is embedded, a second core portion in which a second passive component is embedded, and a first bonding layer disposed between the first and second core portions and including first conductive particles connected to the first and second passive components.

公开(公告)号：US20240064907A1

公开(公告)日：2024-02-22

申请号：US18271754

申请日：2022-02-22

申请人： FICT LIMITED

发明人： Taiji Sakai ,  Kenji Iida ,  Norikazu Ozaki ,  Kenji Takano ,  Takashi Nakagawa ,  Takayuki Inaba ,  Tetsuro Miyagawa ,  Akira Yajima ,  Shin Hirano ,  Kota Aoi ,  Yoichi Abe ,  Mio Emura

IPC分类号： H05K1/18 ,  H05K1/02 ,  H05K3/46

CPC分类号： H05K1/185 ,  H05K1/0201 ,  H05K1/0274 ,  H05K3/4644 ,  H05K2201/10121 ,  H05K2201/0175 ,  H05K2201/062 ,  H05K2201/10984 ,  H05K2201/0129 ,  H05K2201/09545 ,  H05K2201/096

摘要： An object is to provide a circuit board that includes a built-in semiconductor device and has a configuration that prevents cracking and has excellent reliability in operation over a wide temperature range. As a solution, a circuit board (10A) has a configuration in which a first insulating substrate (1) is laminated on a second insulating substrate (2) while interposing a first adhesive layer (7a), and a semiconductor device (9) is embedded in an embedment portion (1c) formed in the first insulating substrate (1).

公开(公告)号：US20230309214A1

公开(公告)日：2023-09-28

申请号：US18180392

申请日：2023-03-08

申请人： CANON KABUSHIKI KAISHA

发明人： SHUICHI NAKAMURA

IPC分类号： H05K1/02 ,  H05K9/00 ,  H05K1/11 ,  H05K3/40

CPC分类号： H05K1/0224 ,  H05K9/0032 ,  H05K1/115 ,  H05K3/4038 ,  H05K2201/10984

摘要： An electronic device that is capable of keeping the impedance (ground impedance) between a printed circuit board and a shield case low. The electronic device includes a printed circuit board that has ground layer(s) which is conductive and is provided at a location in the thickness direction of the printed circuit board, and the shield case which is disposed on one side of the printed circuit board and consists of a hollow body that has conductivity. A through hole(s) passing through the ground layer is formed in the printed circuit board. A projecting portion(s), which is inserted into the through hole(s), is formed in a projecting manner in the shield case. In a state of being inserted in the through hole(s), the projecting portion(s) is electrically connected to the ground layer via solder.

公开(公告)号：US20230292438A1

公开(公告)日：2023-09-14

申请号：US18200230

申请日：2023-05-22

申请人： Shenzhen Newsonic Technologies Co., Ltd.

发明人： Guojun WENG ,  Xiaolong WANG

IPC分类号： H05K1/14 ,  H05K1/11 ,  H05K3/34 ,  H05K3/40

CPC分类号： H05K1/144 ,  H05K1/115 ,  H05K3/34 ,  H05K3/4038 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2201/09036 ,  H05K2201/042 ,  H05K2201/10098 ,  H05K2201/09509

摘要： A radio frequency front-end module, a manufacturing method thereof and a communication device are provided. The radio frequency front-end module includes a first base substrate and a metal bonding structure; a second functional substrate, including a second base substrate, a groove in the second base substrate, and a bonding metal layer; and a first radio frequency front-end component, at least partially located in the groove, the first base substrate and the second base substrate are oppositely arranged, and a surface of the second base substrate close to the first base substrate includes a groove surface inside the groove and a substrate surface outside the groove, and the bonding metal layer includes a first metal portion located on the groove surface and a second metal portion located on the substrate surface, the first radio frequency front-end component is at least partially surrounded by the first metal portion.

公开(公告)号：US20230230749A1

公开(公告)日：2023-07-20

申请号：US18117374

申请日：2023-03-03

申请人： Delta Electronics, Inc.

发明人： Yahong Xiong ,  Da Jin ,  Qinghua Su

IPC分类号： H02M3/00 ,  H02M3/158 ,  H05K7/14 ,  H05K1/11 ,  H05K1/18 ,  H05K3/28 ,  H05K1/02 ,  H05K7/20 ,  H01F27/24 ,  H01R12/52 ,  H05K1/14

CPC分类号： H02M3/003 ,  H01F27/24 ,  H01R12/52 ,  H02M3/1584 ,  H05K1/117 ,  H05K1/145 ,  H05K1/181 ,  H05K1/0203 ,  H05K3/284 ,  H05K7/1427 ,  H05K7/2089 ,  H05K2201/1003 ,  H05K2201/10015 ,  H05K2201/10053 ,  H05K2201/10734 ,  H05K2201/10984

摘要： A power system includes a power module, an electronic load and a system board. The power module includes a first surface, a second surface, a switch and a plurality of conductive parts, wherein the switch is disposed on the first surface of the power module and the plurality of conductive parts are disposed on the second surface of the power module. The electronic load includes a plurality of conductive parts. The power module and the electronic load are disposed on two opposite sides of the system board, the power module delivers power to the electronic load through the system board, and gaps and networks of the plurality of conductive parts of the power module correspond to those of the plurality of conductive parts of the electronic load.

公开(公告)号：US10057995B2

公开(公告)日：2018-08-21

申请号：US14806895

申请日：2015-07-23

申请人： FUJITSU LIMITED

发明人： Shinya Iijima ,  Yoshikatsu Ishizuki

IPC分类号： H05K1/18 ,  H05K3/34 ,  H01L23/00 ,  H05K7/00 ,  H01L23/28 ,  H05K3/28 ,  H01L21/56

CPC分类号： H05K3/3436 ,  H01L21/568 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/19105 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/0367 ,  H05K2201/10984 ,  Y02P70/613

摘要： An electronic device includes a resin layer, a conductive layer buried in the resin layer, an electronic part buried in the resin layer, and a wiring layer arranged on the resin layer, the wiring layer including wiring and an opening, the wiring being connected electrically to the conductive layer and the electronic part, the opening communicating with the conductive layer.

公开(公告)号：US09984820B2

公开(公告)日：2018-05-29

申请号：US14475656

申请日：2014-09-03

申请人： Lexmark International, Inc.

发明人： Keith Bryan Hardin ,  John Thomas Fessler ,  Paul Kevin Hall ,  Robert Aaron Oglesbee

IPC分类号： H01G4/12 ,  H01G4/012 ,  H01G2/06 ,  H01G4/00 ,  H01G4/005 ,  H01G4/228 ,  H05K1/18 ,  H05K3/40 ,  H01G4/28 ,  H05K1/02

CPC分类号： H01G2/06 ,  H01G4/228 ,  H01G4/28 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0248 ,  H05K1/0251 ,  H05K1/0298 ,  H05K1/184 ,  H05K3/4046 ,  H05K2201/09645 ,  H05K2201/10015 ,  H05K2201/10984

摘要： A Z-directed capacitor according to one embodiment includes a body having top, bottom and side surfaces, a cross-sectional shape that is insertable into a mounting hole in a printed circuit board, and a plurality of stacked support members. Each support member includes an annular plate mounted on a surface thereof. A first conductive side channel and a second conductive side channel are formed in the side surface and extend along a top-to-bottom dimension of the body. A first set of the annular plates electrically contact the first conductive side channel but not the second conductive side channel and a second set of the annular plates electrically contact the second conductive side channel but not the first conductive side channel. A third conductive side channel is formed in the side surface, extends along the top-to-bottom dimension of the body and is electrically separated from the annular plates.

公开(公告)号：US09155200B2

公开(公告)日：2015-10-06

申请号：US13926069

申请日：2013-06-25

申请人： Interplex Industries, Inc.

发明人： Jack Seidler

IPC分类号： H01R9/00 ,  H05K3/00 ,  B23K35/02 ,  H01R43/02 ,  H05K3/34 ,  H01R12/57 ,  H01R12/70

CPC分类号： H05K3/00 ,  B23K35/0244 ,  H01R12/57 ,  H01R12/707 ,  H01R43/0235 ,  H05K3/3426 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2201/0311 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/1084 ,  H05K2201/10924 ,  H05K2201/10984 ,  H05K2203/0405 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49147

摘要： A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.

摘要翻译： 将可回流元件固定在电触点上的方法。 该方法包括提供具有多个电触点的条带，每个触点包括接触体和远离接触体延伸的尾部。 然后将触头的尾部设置在细长的可回流构件附近。 细长的可回流构件被推到多个触点的尾部。 随后，细长可回流构件被切割成多个单独的可回流元件，每个可回流元件对应于尾部中的一个。 与附接到其上的可回流元件的电接触与条分离。