-
公开(公告)号：US12262467B2
公开(公告)日：2025-03-25
申请号：US18113834
申请日：2023-02-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong Min , Eun Su Kwon
IPC: H05K1/02
Abstract: A printed circuit board includes a first insulating layer, a first pattern buried in a surface of the first insulating layer, the first pattern having a surface exposed from the surface of the first insulating layer, and a metal post disposed on the exposed surface of the first pattern. The metal post includes a first metal layer and a second metal layer. The first metal layer and the second metal layer include different metals.
-
公开(公告)号：US12219692B2
公开(公告)日：2025-02-04
申请号：US18517393
申请日：2023-11-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dae Jung Byun , Jung Soo Kim , Sang Hyun Sim , Chang Min Ha , Tae Hong Min , Jin Won Lee
IPC: H05K1/02
Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.
-
公开(公告)号：US11864307B2
公开(公告)日：2024-01-02
申请号：US17124893
申请日：2020-12-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dae Jung Byun , Jung Soo Kim , Sang Hyun Sim , Chang Min Ha , Tae Hong Min , Jin Won Lee
IPC: H05K1/02
CPC classification number: H05K1/0218 , H05K1/024 , H05K1/0256 , H05K1/0298 , H05K2201/0141
Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.
-
公开(公告)号：US20150101851A1
公开(公告)日：2015-04-16
申请号：US14459320
申请日：2014-08-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Young Gwan Ko , Tae Hong Min , Sang Hoon Kim , Suk Hyeon Cho
CPC classification number: H05K1/0306 , C03B27/04 , C03C21/002 , H05K1/0271 , H05K3/4605 , H05K2201/017
Abstract: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board according to an exemplary embodiment of the present disclosure includes an insulating layer including a glass core and a tempering treatment layer formed on one surface of the glass core, such that a problem about warpage may be minimized and an effect capable of thinning the printed circuit board may be achieved.
Abstract translation: 提供了一种印刷电路板及其制造方法。 根据本公开的示例性实施例的印刷电路板包括包括玻璃芯和形成在玻璃芯的一个表面上的回火处理层的绝缘层，使得可以使翘曲的问题最小化并且能够变薄的效果 可以实现印刷电路板。
-
公开(公告)号：US11490512B2
公开(公告)日：2022-11-01
申请号：US16794741
申请日：2020-02-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong Min , Ju Ho Kim
Abstract: A printed circuit board and an antenna module including the same are provided. The printed circuit board includes a core layer; a first build-up structure disposed on an upper side of the core layer, including first insulating layers and first bonding layers, alternately stacked, and further including first wiring layers disposed on upper surfaces of the first insulating layers, respectively, and embedded in the first bonding layers, respectively; and a second build-up structure disposed on a lower side of the core layer, including second insulating layers and second bonding layers, alternately stacked, and further including second wiring layers disposed on lower surfaces of the second insulating layers, respectively, and embedded in the second bonding layers, respectively. The printed circuit board has a through-portion penetrating through the core layer and the second build-up structure, and has a region in which the through-portion is disposed as a flexible region.
-
Patent Agency Ranking
公开(公告)号：US11057993B2
公开(公告)日：2021-07-06
申请号：US16671611
申请日：2019-11-01
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong Min
Abstract: A printed circuit board is disclosed. The printed circuit board includes a first substrate portion, and a second substrate portion connected to the first substrate portion and having a flexible insulating layer bendable with respect to the first substrate portion. The second substrate portion includes a block member disposed in the flexible insulating layer and a circuit pattern disposed on a region of the flexible insulating layer, in which the block member is embedded.
-
公开(公告)号：US10109588B2
公开(公告)日：2018-10-23
申请号：US15151885
申请日：2016-05-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sung Won Jeong , Young Gwan Ko , Myung Sam Kang , Tae Hong Min
IPC: H01L23/538 , H01L23/16 , H01L23/00 , H01L25/10 , H01L23/498 , H01L23/31 , H01L23/13 , H01L23/36 , H01L21/56
Abstract: An electronic component package includes a frame containing a metal or ceramic based material and having a through-hole, an electronic component disposed in the through-hole, an insulating part at least covering upper portions of the frame and the electronic component, a bonding part at least partially disposed between the frame and the insulating part, and a redistribution part disposed at one side of the frame and the electronic component.
-
公开(公告)号：US10015877B2
公开(公告)日：2018-07-03
申请号：US14849880
申请日：2015-09-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong Min , Myung Sam Kang , Jin Hyuk Jang , Young Gwan Ko
IPC: H05K1/02 , H01L23/367 , H01L23/373 , H01L23/498 , H01L21/48 , H01L23/538
CPC classification number: H05K1/0204 , H01L21/4882 , H01L23/3677 , H01L23/373 , H01L23/49827 , H01L23/5389 , H01L2224/16235 , H01L2224/16265 , H01L2924/15311 , H05K1/0206 , H05K1/0207 , H05K2201/0323
Abstract: A circuit board comprises a first heat transfer structure including graphite or graphene, wherein at least a portion of the first heat transfer structure is disposed inside an insulating member and a primer layer is disposed on a surface of the first heat transfer structure. The first heat transfer structure may comprise a plurality of monomers, the monomers including a primer layer disposed on at least one surface of at least one layer of graphite or graphene.
-
公开(公告)号：US09699885B2
公开(公告)日：2017-07-04
申请号：US14870741
申请日：2015-09-30
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae Hong Min , Myung Sam Kang , Young Gwan Ko , Min Jae Seong
CPC classification number: H05K1/0206 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/16235 , H01L2224/2518 , H01L2924/15311 , H05K1/0207 , H05K1/023 , H05K1/141 , H05K1/185 , H05K3/4608 , H05K2201/041
Abstract: Disclosed herein is a circuit board. According to an exemplary embodiment of the present disclosure, a circuit board has a structure in which at least a portion of a first heat transfer structure in which a metal layer and an insulating layer are alternately stacked is inserted into an insulating part.
-
公开(公告)号：US11737211B2
公开(公告)日：2023-08-22
申请号：US17371813
申请日：2021-07-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong Min , Ho Hyung Ham , Yong Soon Jang , Ki Suk Kim , Hyung Ki Lee , Chi Won Hwang
CPC classification number: H05K1/115 , G06F1/189 , H05K2201/0338 , H05K2201/041
Abstract: A connection structure embedded substrate includes: a printed circuit board including a plurality of first insulating layers and a plurality of first wiring layers, respectively disposed on or between the plurality of first insulating layers; and a connection structure disposed in the printed circuit board and including a plurality of internal insulating layers and a plurality of internal wiring layers, respectively disposed on or between the plurality of internal insulating layers. Among the plurality of internal wiring layers, an internal wiring layer disposed in one surface of the connection structure is in contact with one surface of a first insulating layer, among the plurality of first insulating layers.
-
-
-
-
-
-
-
-
-
Search Results
26
records
(took 0.019 seconds)
