TOUCH SENSOR MODULE AND MANUFACTURING METHOD THEREOF
    1.
    发明申请
    TOUCH SENSOR MODULE AND MANUFACTURING METHOD THEREOF 审中-公开
    触摸传感器模块及其制造方法

    公开(公告)号:US20150145791A1

    公开(公告)日:2015-05-28

    申请号:US14506068

    申请日:2014-10-03

    CPC classification number: B32B38/0012 G06F3/041 G06F2203/04103 Y10T156/10

    Abstract: Embodiments of the invention provide a touch sensor module, including a base substrate having an electrode pattern formed thereon and an electrode pad transferring an electrical signal of the electrode pattern to the outside, a passivation layer coating surfaces of the electrode patterns, and a flexible cable having a terminal portion formed to correspond to the electrode pad and including an adhesive layer disposed between the electrode pad and the terminal portion. According to at least one embodiment, the passivation layer is formed to not be overlapped with the terminal portion.

    Abstract translation: 本发明的实施例提供了一种触摸传感器模块,其包括其上形成有电极图案的基底基板和将电极图案的电信号传递到外部的电极焊盘,电极图案的钝化层涂覆表面和柔性电缆 具有形成为对应于电极焊盘并且包括设置在电极焊盘和端子部分之间的粘合剂层的端子部分。 根据至少一个实施例,钝化层形成为不与端子部分重叠。

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