公开(公告)号：US09576740B2

公开(公告)日：2017-02-21

申请号：US14508583

申请日：2014-10-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hong Kyu Shin ,  Jae Bum Cho ,  Jae Hyuk Choi ,  Wan Suk Yang ,  Hyoung Sun Ham ,  Hyun Sub Oh

IPC: H01G9/08 ,  H01G9/008 ,  H01G9/052

CPC classification number: H01G9/008 ,  H01G9/052 ,  H01G9/08

Abstract: A tantalum capacitor may include two tantalum wires exposed through two surfaces of a capacitor body opposing each other, first and second positive electrode terminals, connected to the tantalum wires, respectively, and disposed on two surfaces of a molded part opposing each other, and a negative electrode terminal disposed between the first and second positive electrode terminals. The negative electrode terminal may be electrically connected to the capacitor body by a via electrode or a pad electrode disposed between the negative electrode terminal and the capacitor body.

Abstract translation: 钽电容器可以包括通过分别与钽线相连的电容器主体的彼此相对的两个表面暴露的两个钽线，第一和第二正极端子，并且设置在彼此相对的模制部件的两个表面上，并且 负极端子设置在第一和第二正极端子之间。 负极端子可以通过布置在负极端子和电容器体之间的通孔电极或焊盘电极电连接到电容器主体。

公开(公告)号：US09837218B2

公开(公告)日：2017-12-05

申请号：US14875373

申请日：2015-10-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hong Kyu Shin ,  Wan Suk Yang ,  Hyun Sub Oh ,  Hyoung Sun Ham ,  Jae Hyuk Choi

IPC: H01G15/00 ,  H01G4/30 ,  H01G9/15 ,  H01G4/12 ,  H01G9/052

CPC classification number: H01G15/00 ,  H01G4/12 ,  H01G4/30 ,  H01G9/052 ,  H01G9/15

Abstract: A composite electronic component includes: a tantalum capacitor, a multilayer ceramic capacitor, a sealing part, an anode lead frame, and a cathode lead frame, wherein the anode lead frame includes a step portion that does not contact a first external electrode of the multilayer ceramic capacitor, and the cathode lead frame includes a step portion that does not contact a second external electrode of the multilayer ceramic capacitor.

公开(公告)号：US11521802B2

公开(公告)日：2022-12-06

申请号：US16878994

申请日：2020-05-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yu Jin Choi ,  Hyoung Sun Ham

IPC: H01G9/15 ,  H01G9/052 ,  H01G9/00 ,  H01G11/46 ,  H01G11/42 ,  H01G11/48 ,  H01G9/04

Abstract: A solid electrolyte capacitor includes a sintered body formed by sintering a molded body containing a metal powder; and a solid electrolyte layer disposed on the sintered body, wherein the solid electrolyte layer includes a first layer containing an electrolytic polymerization conductive polymer disposed on the sintered body and a second layer containing a chemical polymerization conductive polymer disposed on the first layer.

公开(公告)号：US20210151258A1

公开(公告)日：2021-05-20

申请号：US16878994

申请日：2020-05-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yu Jin Choi ,  Hyoung Sun Ham

IPC: H01G9/052 ,  H01G9/00 ,  H01G11/48 ,  H01G11/46 ,  H01G11/42

Abstract: A solid electrolyte capacitor includes a sintered body formed by sintering a molded body containing a metal powder; and a solid electrolyte layer disposed on the sintered body, wherein the solid electrolyte layer includes a first layer containing an electrolytic polymerization conductive polymer disposed on the sintered body and a second layer containing a chemical polymerization conductive polymer disposed on the first layer.