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公开(公告)号：US20190237406A1
公开(公告)日：2019-08-01
申请号：US16120150
申请日：2018-08-31
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seong Hee CHOI , Han KIM , Hyung Joon KIM , Mi Ja HAN
IPC: H01L23/552 , H01L23/31 , H01L23/538 , H01L23/00 , H01L21/48 , H01L21/56 , H01L21/683
Abstract: A fan-out semiconductor package includes: a core member having at least one through-hole formed therein and having a metal layer disposed on an internal surface thereof; an electronic component disposed in the through-hole; an encapsulant encapsulating the core member and the electronic component; a metal plate disposed on an upper surface of the encapsulant; and a wall penetrating the encapsulant to connect the metal layer and the metal plate to each other. The wall includes sections spaced apart from each other.
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公开(公告)号：US20150380166A1
公开(公告)日：2015-12-31
申请号：US14847826
申请日：2015-09-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyung Joon KIM , Jong Hoon KIM , Kang Heon HUR , Dae Bok OH
CPC classification number: H01G4/30 , H01G4/0085 , H01G4/012 , H01G4/12 , H01G4/248 , Y10T29/43 , Y10T29/435
Abstract: Disclosed are a multilayer ceramic condenser and a method of manufacturing the same. The method includes printing a plurality of stripe-type inner electrode patterns in parallel on ceramic green sheets; forming a laminate by staking the ceramic green sheets having the plurality of stripe-type inner electrode patterns printed thereon; cutting the laminate in order to have a structure in which first and second inner electrode patterns are alternately stacked; and forming a first side part and a second side part by applying ceramic slurry in order to cover the sides of the laminate to which the first and second inner electrode patterns are exposed.
Abstract translation: 公开了一种多层陶瓷电容器及其制造方法。 该方法包括在陶瓷生片上平行印刷多条条状内部电极图案; 通过在其上印刷多个条形内部电极图案的陶瓷生片进行铆接来形成层压体; 切割层压体以具有第一和第二内部电极图案交替堆叠的结构; 以及通过施加陶瓷浆料形成第一侧面部分和第二侧面部分，以覆盖第一和第二内部电极图案所暴露的层压体的侧面。
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公开(公告)号：US20140189990A1
公开(公告)日：2014-07-10
申请号：US14206898
申请日：2014-03-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyung Joon KIM
IPC: H01G4/12
Abstract: There are provide a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes a multilayer body having a first side and a second side opposed to each other and having a third side and a fourth side connecting the first side to the second side, inner electrodes formed in the multilayer body and formed to be spaced apart from the third side or the fourth side by a predetermined distance, groove portions formed on at least one of top and bottom surfaces of the multilayer body and formed parallel to the third or fourth side by a predetermined distance from the third side or the fourth side, and outer electrodes extended from the third side and the fourth side to the top surface or the bottom surface of the multilayer body to cover the groove portions.
Abstract translation: 提供一种多层陶瓷电容器及其制造方法。 多层陶瓷电容器包括具有彼此相对的第一侧和第二侧的多层体，并且具有连接第一侧和第二侧的第三侧和第四侧，形成在多层体中并形成为间隔开的内电极 除了第三面或第四面一定距离之外，形成在多层体的顶面和底表面中的至少一个上并且与第三或第四侧平行的距第三面或第四面一定距离 侧面和外部电极从多层体的第三侧面和第四面延伸到顶面或底面，以覆盖凹槽部分。
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公开(公告)号：US20140160621A1
公开(公告)日：2014-06-12
申请号：US13764273
申请日：2013-02-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Byung Kwon YOON , Hyung Joon KIM , Jae Yeol CHOI
CPC classification number: H01G4/30 , H01G4/012 , H01G4/12 , H01G4/228 , Y10T29/435
Abstract: A multilayer ceramic capacitor includes a ceramic body; first and second internal electrodes including first and second body parts overlapped with each other and first and second lead-out parts having an overlap region and exposed to one surface of the ceramic body; first and second external electrodes formed on one surface of the ceramic body; and an insulating layer formed on one surface of the ceramic body, wherein first and second connection surfaces extended from end portions of the first and second body parts to end portions of the first and second lead-out parts are inclined, and when half of length of the internal electrode is defined as A and length from a center of the ceramic body to a starting point of the connection surface is defined as B, B/A satisfies 0.03≦B/A≦0.90.
Abstract translation: 多层陶瓷电容器包括陶瓷体; 第一和第二内部电极，包括彼此重叠的第一和第二主体部分，以及具有重叠区域并暴露于陶瓷体的一个表面的第一和第二引出部分; 形成在陶瓷体的一个表面上的第一和第二外部电极; 以及形成在陶瓷体的一个表面上的绝缘层，其中从第一和第二主体部分的端部延伸到第一和第二引出部分的端部的第一和第二连接表面是倾斜的，并且当长度的一半 内部电极的定义为A，从陶瓷体的中心到连接面的起点的长度定义为B，B / A满足0.03＆amp; nlE; B / A＆nlE; 0.90。
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公开(公告)号：US20220148803A1
公开(公告)日：2022-05-12
申请号：US17332608
申请日：2021-05-27
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyung Joon KIM , Hyun Ju KIM , Kyoung Ae KIM
Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and first and second internal electrodes and having first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other, first and second side portions disposed on the fifth and sixth surfaces of the capacitor body, respectively, and first and second external electrodes disposed on the third and fourth surfaces of the capacitor body, respectively, and connected to the first and second internal electrodes, respectively. The first and second internal electrodes have protrusions at one-side edge in a direction perpendicular to the fifth and sixth surfaces of the capacitor body.
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Patent Agency Ranking
公开(公告)号：US20200373271A1
公开(公告)日：2020-11-26
申请号：US16540715
申请日：2019-08-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyung Joon KIM , Seok Hwan KIM , Sung Il JO , Jung Ho SHIM
IPC: H01L23/00 , H01L23/495 , H01L23/498 , H01L23/31 , H01L23/48
Abstract: An electronic component module includes a semiconductor package having a first surface provided as a mounting surface and a second surface opposing the first surface, and including a semiconductor chip, a component package having a first surface facing the second surface of the semiconductor package, and a second surface opposing the first surface of the component package, the component package including a passive component, and a connector disposed on the second surface of the component package and having a connection surface configured to be mechanically coupled to an external device, the connector including a plurality of connection lines arranged on the connection surface.
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公开(公告)号：US20170213645A1
公开(公告)日：2017-07-27
申请号：US15482297
申请日：2017-04-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyung Joon KIM
Abstract: There are provide a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes a multilayer body having a first side and a second side opposed to each other and having a third side and a fourth side connecting the first side to the second side, inner electrodes formed in the multilayer body and formed to be spaced apart from the third side or the fourth side by a predetermined distance, groove portions formed on at least one of top and bottom surfaces of the multilayer body and formed parallel to the third or fourth side by a predetermined distance from the third side or the fourth side, and outer electrodes extended from the third side and the fourth side to the top surface or the bottom surface of the multilayer body to cover the groove portions.
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公开(公告)号：US20150170843A1
公开(公告)日：2015-06-18
申请号：US14633034
申请日：2015-02-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyung Joon KIM
Abstract: A multilayer ceramic condenser includes a multilayer main body, a first outer electrode, a second outer electrode, a first side part and a second side part. The multilayer main body has a first side, a second side, a third side and a fourth side. The multilayer main body includes a plurality of inner electrodes and a dielectric layer between the inner electrodes. The dielectric layer is formed by a first ceramic dielectric powder. The first side part and the second side part are formed on the second side and the fourth side of the multilayer main body, and formed by a second ceramic dielectric powder having a smaller particle diameter than the first ceramic dielectric powder. A mean grain size of the first side part or the second side part is similar to or smaller than that of the dielectric layer of the multilayer main body.
Abstract translation: 多层陶瓷电容器包括多层主体，第一外电极，第二外电极，第一侧部和第二侧部。 多层主体具有第一面，第二面，第三面和第四面。 多层主体包括多个内部电极和内部电极之间的电介质层。 电介质层由第一陶瓷电介质粉末形成。 第一侧部分和第二侧部分形成在多层主体的第二侧面和第四侧上，并且由比第一陶瓷电介质粉末更小的第二陶瓷电介质粉末形成。 第一侧部或第二侧部的平均粒径与多层主体的电介质层的平均粒径相同或以下。
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公开(公告)号：US20140301012A1
公开(公告)日：2014-10-09
申请号：US13924342
申请日：2013-06-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyung Joon KIM
CPC classification number: H01G4/30 , H01G4/012 , H01G4/1209 , H01G4/1227 , H01G4/232 , Y10T29/43
Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body having first and second side surfaces opposite to each other, and third and fourth end surfaces connecting the first and second side surfaces; a plurality of internal electrodes formed in the ceramic body and having one ends thereof exposed to the third or fourth end surface; and first and second side margin parts formed from the first and second side surfaces to respective edges of the internal electrodes, the first and second side margin parts having an average thickness of 18 μm or less, wherein when a boundary surface between a cover layer and the first or second side margin part in the ceramic body is divided into two regions in a thickness direction of the ceramic body, a region adjacent to the internal electrode is S1, and a porosity of S1 is P1, 1≦P1≦20 is satisfied.
Abstract translation: 提供了一种多层陶瓷电容器，其包括：具有彼此相对的第一和第二侧表面的陶瓷体，以及连接第一和第二侧表面的第三和第四端面; 多个内部电极，其形成在所述陶瓷体中并且其一端暴露于所述第三或第四端面; 以及从第一和第二侧表面到内部电极的各个边缘形成的第一和第二侧边缘部分，第一和第二边缘部分具有18μm或更小的平均厚度，其中当覆盖层和 陶瓷体中的第一或第二侧边缘部分在陶瓷体的厚度方向上分成两个区域，与内部电极相邻的区域为S1，S1的孔隙率为P1，1＆nlE;满足P1＆nlE; 20 。
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公开(公告)号：US20230411073A1
公开(公告)日：2023-12-21
申请号：US18238989
申请日：2023-08-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyung Joon KIM , Hyun Ju KIM , Kyoung Ae KIM
Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and first and second internal electrodes and having first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other, first and second side portions disposed on the fifth and sixth surfaces of the capacitor body, respectively, and first and second external electrodes disposed on the third and fourth surfaces of the capacitor body, respectively, and connected to the first and second internal electrodes, respectively. The first and second internal electrodes have protrusions at one-side edge in a direction perpendicular to the fifth and sixth surfaces of the capacitor body.
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