公开(公告)号：US20240222263A1

公开(公告)日：2024-07-04

申请号：US18214102

申请日：2023-06-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hoon KIM ,  Hye Jin KIM ,  Gyoung Heon KO ,  Jang Won LEE

IPC: H01L23/522 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/5223 ,  H01L23/49822 ,  H01L24/32 ,  H01L28/56 ,  H01L28/75 ,  H01L28/90 ,  H01L2224/32104 ,  H01L2224/32146 ,  H01L2924/1205 ,  H01L2924/19041

Abstract: A capacitor component includes a support member; capacitance laminates laminated on one surface of the support member; at least one insulating layer disposed between the capacitance laminates; and a plurality of through structures each penetrating through at least one of the capacitance laminates. Each of the capacitance laminates includes a first electrode layer, a second electrode layer, and a dielectric layer disposed between the first and second electrode layers. One of the plurality of through structures includes a connection conductive pillar connected between first electrode layers of the capacitance laminates. Another of the plurality of through structures includes a first conductive pillar connected to a first electrode layer of one of the capacitance laminates, a dielectric through portion surrounding the first conductive pillar; and a through connection portion surrounding the dielectric through portion and connecting second electrode layers of the capacitance laminates to each other.

公开(公告)号：US20240282807A1

公开(公告)日：2024-08-22

申请号：US18388992

申请日：2023-11-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hoon KIM ,  Hye Jin KIM ,  Gyoung Heon KO ,  Jang Won LEE

IPC: H01G4/08 ,  H01L23/522

CPC classification number: H01L28/91 ,  H01L23/5223

Abstract: A capacitor component including: a first capacitor structure including a substrate having a plurality of first trenches disposed on one surface of the substrate, and a first capacitor layer disposed on the one surface of the substrate and inner walls of the plurality of first trenches, the first capacitor layer including a first dielectric layer and first and second electrodes disposed to face each other with the first dielectric layer interposed therebetween; a second capacitor structure disposed on the first capacitor structure, and including an insulating layer having a plurality of second trenches disposed on one surface of the insulating layer, and a second capacitor layer disposed on the one surface of the insulating layer and inner walls of the plurality of second trenches, the second capacitor layer including a second dielectric layer and third and fourth electrodes disposed to face each other with the second dielectric layer interposed therebetween.