公开(公告)号：US20250157739A1

公开(公告)日：2025-05-15

申请号：US18882247

申请日：2024-09-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Bin JEONG ,  Hyung Jong CHOI ,  Kwan Hee YUN ,  Hyun Tak KIM ,  Jin Sung LEE ,  Boo Min NOH ,  Min Woo KIM

IPC: H01G4/232 ,  H01G4/30

Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes, and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction and external electrodes including a connection portion disposed on the third or fourth surfaces and a band portion extending onto portions of the first and second surfaces from the connection portion. The external electrode includes a base alloy layer including Cu—Ag alloy and disposed in the band portion, a lower electrode layer in contact with the internal electrode at the connection portion and in contact with the base alloy layer at the band portion, and an upper electrode layer disposed on the lower electrode layer. The lower electrode layer includes Cu, and the upper electrode layer includes Ag and glass.

公开(公告)号：US20250157737A1

公开(公告)日：2025-05-15

申请号：US18813587

申请日：2024-08-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Bin JEONG ,  Hyung Jong CHOI ,  Kwan Hee YUN ,  Hyun Tak KIM ,  Jin Sung LEE ,  Boo Min NOH ,  Min Woo KIM

IPC: H01G4/232 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30

Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately disposed while having the dielectric layer interposed therebetween; and external electrodes disposed outside the body, wherein the external electrode includes a lower electrode layer including copper (Cu) and in contact with the internal electrode, an upper electrode layer including silver (Ag) and disposed on the lower electrode layer, and an alloy layer including a copper (Cu)-silver (Ag) alloy and disposed at an interface between the lower electrode layer and the upper electrode layer, and an oxidation region including copper (Cu) oxide is disposed on at least a portion of an external surface of the lower electrode layer.