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公开(公告)号：US20240071689A1
公开(公告)日：2024-02-29
申请号：US18127234
申请日：2023-03-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Myung Chan SON , Yong PARK , Jong Ho LEE , Eun Jung LEE , Jung Tae PARK , Min Woo KIM , Ji Hyeon LEE , Sun Mi KIM
Abstract: A method of manufacturing a multilayer electronic component includes forming a stack by stacking a plurality of ceramic green sheets on which conductive patterns are disposed on a support film, cutting the stack in a second direction, perpendicular to a first direction which is a stacking direction of the plurality of ceramic green sheets, cutting the stack in a third direction, perpendicular to the first and second directions, to obtain a plurality of unit chips, separating the unit chip from the support film, arranging the unit chip such that one of side surfaces of the unit chip is in contact with an adhesive tape, and attaching another one of the side surfaces to a ceramic green sheet for a side margin portion, and forming a side margin portion on the another one of side surfaces.
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公开(公告)号：US20200058447A1
公开(公告)日：2020-02-20
申请号：US16274753
申请日：2019-02-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yeong Ju CHOE , Min Woo KIM , Eun Jung LEE , Ki Pyo HONG
Abstract: A multilayer ceramic capacitor includes a ceramic body including an active portion that includes a dielectric layer and a plurality of internal electrodes overlapping other across the dielectric layer, and cover portions formed above and below the active portion, and including first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other, and first and second side margin portions disposed on the first and second surfaces. In a cross-section of the ceramic body in a length-thickness (L-T) direction, a ratio Sd/Sc of an area Sd of a region except for the active portion to an overall area Sc of the section is greater than 27%.
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公开(公告)号：US20240387114A1
公开(公告)日：2024-11-21
申请号：US18588885
申请日：2024-02-27
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chang Ho SEO , Jong Ho LEE , Yong Min HONG , Jung Tae PARK , Min Woo KIM , Yong PARK , Sun Mi KIM
Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction, and including a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface, connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface, connected to the first to fourth surfaces and opposing each other in a third direction; external electrodes disposed on the third and fourth surfaces; and a first side margin portion and a second side margin portion, respectively disposed on the fifth and sixth surfaces, wherein the first and second side margin portions include a first extension portion disposed to extend onto a portion of the first surface and a portion of the second surface.
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公开(公告)号：US20220130612A1
公开(公告)日：2022-04-28
申请号：US17222499
申请日：2021-04-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jong Ho LEE , Chang Ho SEO , Eun Jung LEE , Myung Chan SON , Jung Tae PARK , Chang Soo PARK , Min Woo KIM
Abstract: A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are stacked, and further including a plurality of internal electrodes having a dielectric layer interposed therebetween and external electrodes disposed on external surfaces of the body and connected to the internal electrodes. The body further includes an active portion in which the plurality of internal electrodes are located to form capacitance and a side margin portion covering a first surface and a second surface of the active portion opposing each other. An average grain size of a dielectric layer included in the active portion is different from an average grain size of a dielectric layer included in the margin portion. The side margin portion includes an extending portion extending between the external electrodes and the internal electrodes to cover a portion of the internal electrodes.
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公开(公告)号：US20210398750A1
公开(公告)日：2021-12-23
申请号：US17464182
申请日：2021-09-01
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jong Ho LEE , Jung Tae PARK , Hee Ju SON , Min Woo KIM
Abstract: A capacitor component includes a body including a dielectric layer, a layering portion in which first and second internal electrodes opposing each other are layered in a first direction, and first and second connecting portions disposed on both surfaces of the layering portion taken in a second direction perpendicular to the first direction and connected to the first and second internal electrodes, respectively; and first and second external electrodes disposed on the first and second connecting portions, respectively, and the first and second external electrodes include metal powder particles, a surface of each of which is coated with at least one of graphene and carbon nanotubes.
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Patent Agency Ranking
公开(公告)号：US20210005385A1
公开(公告)日：2021-01-07
申请号：US16658652
申请日：2019-10-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jong Ho LEE , Jung Tae PARK , Hee Ju SON , Min Woo KIM
Abstract: A capacitor component includes a body including a dielectric layer, a layering portion in which first and second internal electrodes opposing each other are layered in a first direction, and first and second connecting portions disposed on both surfaces of the layering portion taken in a second direction perpendicular to the first direction and connected to the first and second internal electrodes, respectively; and first and second external electrodes disposed on the first and second connecting portions, respectively, and the first and second external electrodes include metal powder particles, a surface of each of which is coated with at least one of graphene and carbon nanotubes.
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公开(公告)号：US20250157739A1
公开(公告)日：2025-05-15
申请号：US18882247
申请日：2024-09-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Young Bin JEONG , Hyung Jong CHOI , Kwan Hee YUN , Hyun Tak KIM , Jin Sung LEE , Boo Min NOH , Min Woo KIM
Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes, and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction and external electrodes including a connection portion disposed on the third or fourth surfaces and a band portion extending onto portions of the first and second surfaces from the connection portion. The external electrode includes a base alloy layer including Cu—Ag alloy and disposed in the band portion, a lower electrode layer in contact with the internal electrode at the connection portion and in contact with the base alloy layer at the band portion, and an upper electrode layer disposed on the lower electrode layer. The lower electrode layer includes Cu, and the upper electrode layer includes Ag and glass.
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公开(公告)号：US20250157737A1
公开(公告)日：2025-05-15
申请号：US18813587
申请日：2024-08-23
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Young Bin JEONG , Hyung Jong CHOI , Kwan Hee YUN , Hyun Tak KIM , Jin Sung LEE , Boo Min NOH , Min Woo KIM
Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately disposed while having the dielectric layer interposed therebetween; and external electrodes disposed outside the body, wherein the external electrode includes a lower electrode layer including copper (Cu) and in contact with the internal electrode, an upper electrode layer including silver (Ag) and disposed on the lower electrode layer, and an alloy layer including a copper (Cu)-silver (Ag) alloy and disposed at an interface between the lower electrode layer and the upper electrode layer, and an oxidation region including copper (Cu) oxide is disposed on at least a portion of an external surface of the lower electrode layer.
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公开(公告)号：US20240203651A1
公开(公告)日：2024-06-20
申请号：US18137500
申请日：2023-04-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong PARK , Jong Ho LEE , Jung Jin PARK , Su Min KIM , Eun Jung LEE , Yong Min HONG , Ji Hyeon LEE , Sim Chung KANG , Min Woo KIM , Jung Tae PARK
CPC classification number: H01G4/1227 , H01G4/30
Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; and external electrodes disposed on the body. The dielectric layer includes N-doped polydopamine.
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10.发明公开公开(公告)号：US20240145173A1
公开(公告)日：2024-05-02
申请号：US18205104
申请日：2023-06-02
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ji Hyeon LEE , Jong Ho LEE , Eun Jung LEE , Yong Min HONG , Yong PARK , Min Woo KIM , Jung Tae PARK , Sun Mi KIM , Sim Chung KANG
Abstract: A method of manufacturing a multilayer electronic component, the method includes, attaching a margin portion green sheet including a ceramic material, a photocuring agent, and a photoinitiator to at least one end surface of each of the plurality of cut ceramic green sheet stacked bodies in the third direction, an energy irradiation operation of irradiating, with energy, the margin portion green sheet to generate a photocuring polymerization reaction between the photocuring agent and the photoinitiator.
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