公开(公告)号：US11076487B2

公开(公告)日：2021-07-27

申请号：US16820172

申请日：2020-03-16

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Mi Sun Hwang ,  Deok Man Kang ,  Jun Hyeong Jang

IPC分类号： H05K1/18

摘要： An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and a stopper layer. An electronic component is disposed in the cavity. The stopper layer includes a first metal layer embedded in the first insulating body and having a portion of an inner surface exposed from the first insulating body, and a second metal layer disposed below the first metal layer and having at least a portion of an upper surface disposed as a bottom surface of the cavity. The cavity has an inner surface of the first metal layer and an inner surface of the first insulating body as a first wall surface and a second wall surface, respectively, and an inclination of the first wall surface is different from an inclination of the second wall surface.

公开(公告)号：US11490503B2

公开(公告)日：2022-11-01

申请号：US17204058

申请日：2021-03-17

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Chang Hwa Park ,  Chi Seong Kim ,  Eun Heay Lee ,  Yo Han Song ,  Gun Hwi Hyung ,  Jae Heun Lee ,  Deok Man Kang ,  Jin Oh Park

IPC分类号： H05K3/22 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/30

摘要： A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.

公开(公告)号：US20220022310A1

公开(公告)日：2022-01-20

申请号：US17204058

申请日：2021-03-17

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Chang Hwa Park ,  Chi Seong Kim ,  Eun Heay Lee ,  Yo Han Song ,  Gun Hwi Hyung ,  Jae Heun LEE ,  Deok Man Kang ,  Jin Oh Park

IPC分类号： H05K1/02 ,  H05K1/18 ,  H05K3/22 ,  H05K3/00

摘要： A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.