公开(公告)号：US20230189451A1

公开(公告)日：2023-06-15

申请号：US17991627

申请日：2022-11-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ki Hwan You ,  Seung Ju Lee ,  Tae Hun Kim ,  Chang Gon Kim ,  Yeon Ji Kim ,  Young Gon Kim ,  Ho Kwon Yoon ,  Eun Seok Kang

IPC: H05K3/46 ,  H01L21/768 ,  H05K1/02

CPC classification number: H05K3/4688 ,  H01L21/76805 ,  H05K1/0298

Abstract: A printed circuit board includes: a first insulating layer; a first circuit layer disposed on one surface of the first insulating layer and including a connection pad; a second insulating layer disposed on the one surface of the first insulating layer and embedding the first circuit layer; a via penetrating through the second insulating layer and connected to the first circuit layer; a metal post disposed on one surface of the second insulating layer and connected to the via; and a hole penetrating through the second insulating layer and exposing at least a portion of the connection pad of the first circuit layer. The metal post is spaced apart from the hole, and protrudes from the second insulating layer.