公开(公告)号：US20140103098A1

公开(公告)日：2014-04-17

申请号：US14048839

申请日：2013-10-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Won Choi ,  Yon Ho YOU ,  Seon Jae MUN ,  Noriaki MUKAI ,  Seung Wan KIM ,  KiJu LEE ,  Jung In CHOI

IPC: B23K3/06 ,  B23K3/08

CPC classification number: B23K3/06 ,  B23K3/0623 ,  B23K3/082 ,  H01L24/11

Abstract: Disclosed herein are a mask for bumping solder balls on a circuit board and a solder ball bumping method using the same. The mask includes: a plurality of openings providing spaces into which the solder balls are inserted to thereby be seated on solder pads; and trenches providing introduction spaces for spreading a flux to portions at which the solder balls are seated on the solder pads and extended from at least one side of circumferences of the openings.

Abstract translation: 本文公开了一种用于在电路板上焊接焊球的掩模和使用该掩模的焊球凸块方法。 掩模包括：多个开口，提供空间，焊球插入其中，从而被安置在焊盘上; 以及沟槽，其提供引导空间，用于将焊剂铺展到焊球位于焊盘上并从开口周边的至少一侧延伸的部分。