公开(公告)号：US20150102488A1

公开(公告)日：2015-04-16

申请号：US14575915

申请日：2014-12-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Won CHOI ,  Yon Ho YOU

IPC: H01L23/00

CPC classification number: H01L24/16 ,  H01L21/76895 ,  H01L23/49816 ,  H01L23/49894 ,  H01L24/81 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Disclosed herein a printed circuit board comprising: a plurality of pads formed on a substrate; a solder resist (SR) pattern enclosing a region of the pad and burying another circuit pattern; and a solder pattern including a metal pattern therein using a solder and formed on an upper surface of each of the pads.

Abstract translation: 本文公开了一种印刷电路板，包括：形成在基板上的多个焊盘; 阻挡层（SR）图案，其包围焊盘的区域并掩埋另一电路图案; 以及焊料图案，其中使用焊料形成其中的金属图案并形成在每个焊盘的上表面上。

公开(公告)号：US20140103098A1

公开(公告)日：2014-04-17

申请号：US14048839

申请日：2013-10-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Won Choi ,  Yon Ho YOU ,  Seon Jae MUN ,  Noriaki MUKAI ,  Seung Wan KIM ,  KiJu LEE ,  Jung In CHOI

IPC: B23K3/06 ,  B23K3/08

CPC classification number: B23K3/06 ,  B23K3/0623 ,  B23K3/082 ,  H01L24/11

Abstract: Disclosed herein are a mask for bumping solder balls on a circuit board and a solder ball bumping method using the same. The mask includes: a plurality of openings providing spaces into which the solder balls are inserted to thereby be seated on solder pads; and trenches providing introduction spaces for spreading a flux to portions at which the solder balls are seated on the solder pads and extended from at least one side of circumferences of the openings.

Abstract translation: 本文公开了一种用于在电路板上焊接焊球的掩模和使用该掩模的焊球凸块方法。 掩模包括：多个开口，提供空间，焊球插入其中，从而被安置在焊盘上; 以及沟槽，其提供引导空间，用于将焊剂铺展到焊球位于焊盘上并从开口周边的至少一侧延伸的部分。

公开(公告)号：US20140076611A1

公开(公告)日：2014-03-20

申请号：US14022821

申请日：2013-09-10

Applicant: c/o SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Won CHOI ,  Yon Ho YOU

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0298 ,  H05K3/00 ,  H05K3/4046 ,  H05K3/4647 ,  H05K2201/10234

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, including: preparing a base substrate; disposing a mask having through-holes formed therein on one surface of the base substrate; inserting metal core balls into the through-holes of the mask, performing reflow treatment on the metal core balls, and removing the mask; and laminating an insulating layer on one surface of the base substrate.

Abstract translation: 本文公开了一种制造印刷电路板的方法，包括：制备基底; 在基底基板的一个表面上设置具有形成在其中的通孔的掩模; 将金属芯球插入到掩模的通孔中，对金属芯球进行回流处理，并除去掩模; 并且在基底基板的一个表面上层叠绝缘层。